C04B35/52

PARTICULATE COMPOSITE MATERIALS

Particulate composite materials and devices comprising the same are provided.

Diamond tool piece

A high-pressure high-temperature, HPHT, diamond tool piece and a method of producing an HPHT diamond tool piece. At least a portion of the HPHT diamond tool piece comprises an aggregated nitrogen centre to C-nitrogen centre ratio of greater than 30%. The method includes irradiating an HPHT diamond material to introduce vacancies in the diamond crystal lattice, annealing the HPHT diamond material such that at least a portion of the HPHT diamond material comprises an aggregated nitrogen centre to C-nitrogen centre ratio of greater than 30%, and processing the HPHT diamond material to form an HPHT diamond tool piece.

Diamond tool piece

A high-pressure high-temperature, HPHT, diamond tool piece and a method of producing an HPHT diamond tool piece. At least a portion of the HPHT diamond tool piece comprises an aggregated nitrogen centre to C-nitrogen centre ratio of greater than 30%. The method includes irradiating an HPHT diamond material to introduce vacancies in the diamond crystal lattice, annealing the HPHT diamond material such that at least a portion of the HPHT diamond material comprises an aggregated nitrogen centre to C-nitrogen centre ratio of greater than 30%, and processing the HPHT diamond material to form an HPHT diamond tool piece.

Mixtures of Binder Particles Used in Production of Immobilized Particulate Products
20230173461 · 2023-06-08 ·

A carbon structure comprising a mixture and a polymer. The mixture has a base carbon and a catalytic carbon. The polymer has a first binder with a median diameter of less than 10 microns and a second binder with a median diameter between 10 and 70 microns.

Method of producing integral 3D humic acid-carbon hybrid foam
11254616 · 2022-02-22 · ·

Provided is a method of producing an integral 3D humic acid-carbon hybrid foam, comprising: (A) forming a solid shape of humic acid-polymer particle mixture; and (B) pyrolyzing the solid shape of humic acid-polymer particle mixture to thermally reduce humic acid into reduced humic acid sheets and thermally convert polymer into pores and carbon or graphite that bonds the reduced humic acid sheets to form the integral 3D humic acid-carbon hybrid foam.

Method of depositing nanoscale materials within a nanofiber network and networked nanofibers with coating
09793548 · 2017-10-17 · ·

Provided herein is a method of manufacturing a nanoscale coated network, which includes providing nanofibers, capable of forming a network in the presence of a liquid vehicle and providing a nanoscale solid substance in the presence of the liquid vehicle. The method may also include forming a network of the nanofibers and the nanoscale solid substance and redistributing at least a portion of the nanoscale solid substance within the network to produce a network of nanofibers coated with the nanoscale solid substance. Also provided herein is a nanoscale coated network with an active material coating that is redistributed to cover and electrochemically isolate the network from materials outside the network.

Method of depositing nanoscale materials within a nanofiber network and networked nanofibers with coating
09793548 · 2017-10-17 · ·

Provided herein is a method of manufacturing a nanoscale coated network, which includes providing nanofibers, capable of forming a network in the presence of a liquid vehicle and providing a nanoscale solid substance in the presence of the liquid vehicle. The method may also include forming a network of the nanofibers and the nanoscale solid substance and redistributing at least a portion of the nanoscale solid substance within the network to produce a network of nanofibers coated with the nanoscale solid substance. Also provided herein is a nanoscale coated network with an active material coating that is redistributed to cover and electrochemically isolate the network from materials outside the network.

Emissivity controlled coatings for semiconductor chamber components
09790581 · 2017-10-17 · ·

A component for a semiconductor processing chamber, the component including a substrate and a coating layer provided on a surface of the substrate, wherein the coating layer includes at least a first coating layer having a thermal emissivity of more than 0.98 to 1, having plasma resistance, and having a color value L in a range of 35 to 40 through a thickness direction thereof.

Emissivity controlled coatings for semiconductor chamber components
09790581 · 2017-10-17 · ·

A component for a semiconductor processing chamber, the component including a substrate and a coating layer provided on a surface of the substrate, wherein the coating layer includes at least a first coating layer having a thermal emissivity of more than 0.98 to 1, having plasma resistance, and having a color value L in a range of 35 to 40 through a thickness direction thereof.

Low-thickness thermostructural composite material part, and manufacture method
09784217 · 2017-10-10 · ·

A thermostructural composite material part including carbon or ceramic fiber reinforcement densified by a matrix having at least one thin portion in which: the thickness of the part is less than 2 mm, or indeed less than 1 mm; the fiber reinforcement is made as a single thickness of multilayer fabric made of spread yarns having a weight of not less than 200 tex; the fiber volume ratio lies in the range 25% to 45%; and the ratio between the number of layers of the multilayer fabric and the thickness in millimeters of the part is not less than four.