A ceramic bonding material including at least one fibrous material, a flux agent and a thickening agent wherein the ceramic bonding material fired at a set temperature to bond the two adjacent substrate faces.

According to the present invention, when manufacturing expandable graphite, it is possible to remarkably reduce the generation of waste acid and waste and economically manufacture expandable graphite having a low content of volatile substances and good appearance, and thus, it is possible to efficiently manufacture a heat dissipation sheet having excellent thermal conductivity.

A joining material used for joining side surfaces of a plurality of silicon carbide-based honeycomb segments to each other to produce a silicon carbide-based honeycomb structure. The joining material contains from 0.1 to 50% by mass of processed powder generated in the production of the silicon carbide-based honeycomb segments and/or the silicon carbide-based honeycomb structure. The joining material has an average particle diameter D50 of from 0.5 to 60 μm.

A method to produce a protective surface layer having a predetermined topography on a ceramic matrix composite is described. The method includes applying a slurry layer to a surface of a fiber preform, and drying the slurry layer to form a particulate layer. A surface of the particulate layer is machined to improve surface smoothness and to form a machined surface. A ceramic tape is attached to the machined surface, and a tool comprising one or more features to be imprinted is placed on the ceramic tape, thereby forming a compression assembly. Heat and pressure are applied to the compression assembly to consolidate and bond the ceramic tape to the machined surface, while the one or more features of the tool are imprinted. Thus, a protective surface layer having a predetermined topography is formed.

A CMC ply assembly is disclosed including at least one matrix ply interspersed amongst a plurality of CMC plies. Each of the plurality of CMC plies includes a first matrix and a plurality of ceramic fibers. The at least one matrix ply includes a second matrix and is essentially free of ceramic fibers. The plurality of CMC plies and the at least one matrix ply are arranged in an undensified ply stack having an article conformation. A CMC article is disclosed including a plurality of densified CMC plies and at least one densified matrix ply interspersed amongst the plurality of densified CMC plies. A method for forming the CMC article is disclosed including forming, carburizing, infusing a melt infiltration agent into, and densifying the CMC ply assembly. The melt infiltration agent infuses more completely through the at least one matrix ply than through the plurality of CMC plies.

The invention relates to a blank from a ceramic material, wherein at least two layers of ceramic material of different compositions are filled into a die layer-by-layer and after filling of the layers they are then pressed and sintered, wherein after filling of a first layer this is structured on its surface in such a way that the first layer, viewed across its surface, differs in its height from region to region, and then a layer with a composition that differs from the first layer is filled as a second layer into the mold.

A honeycomb structure includes a plurality of prismatic columnar shaped honeycomb segments; a bonding layer bonding side faces of the honeycomb segments; and a circumferential wall disposed to surround a honeycomb segment bonded body having the honeycomb segments arranged in a grid pattern and bonded with the bonding layer, wherein the honeycomb segments has a porous partition wall disposed to surround a plurality of cells, the cells in other than outermost circumference have a hexagonal shape in a section orthogonal to the cell extending direction, the honeycomb segments include first and second honeycomb segment, the second honeycomb segment is different from the first in at least one of: a shape in the section; a size; and an arrangement direction of the cells and an extended line of one diagonal line imaginarily depicted in the cells in the first honeycomb segment and that in the second are configured to be orthogonal.

Adhesive compositions and methods for bonding materials with different thermal expansion coefficients is provided. The adhesive is formulated using a flux material, a low flux material, and a filler material, where the filler material comprises particulate from at least one of the two components being bonded together. A thickening agent can also be used as part of the adhesive composition to aid in applying the adhesive and establishing a desired bond thickness. The method of forming a high strength bond using the disclosed adhesive does not require the use of intermediary layer or the use of high cure temperatures that could damage one or both of the components being bonded together.

A joining method includes the steps of placing a brazing element between an interface area of a first ceramic piece and an interface area of a second ceramic piece to create a joining pre-assembly, placing the components of said joining pre-assembly into a process chamber, removing oxygen from said process chamber, and heating at least said brazing element of said joining pre-assembly, thereby hermetically joining said first ceramic piece to said second ceramic piece. The brazing element consists of Nickel and Carbon.

A method of manufacturing an epitaxy substrate is provided. A handle substrate is provided. A beveling treatment is performed on an edge of a device substrate such that a bevel is formed at the edge of the device substrate, wherein a thickness of the device substrate is greater than 100 μm and less than 200 μm. An ion implantation process is performed on a first surface of the device substrate to form an implantation region within the first surface. A second surface of the device substrate is bonded to the handle substrate for forming the epitaxy substrate, wherein a bonding angle greater than 90° is provided between the bevel of the device substrate and the handle substrate, and a projection length of the bevel toward the handle substrate is between 600 μm and 800 μm.