Patent classifications
C04B37/005
SEMICONDUCTOR PROCESSING EQUIPMENT WITH HIGH TEMPERATURE RESISTANT NICKEL ALLOY JOINTS AND METHODS FOR MAKING SAME
A method for the joining of ceramic pieces includes applying a layer of titanium on a first ceramic piece and applying a layer of titanium on a second ceramic piece; applying a layer of nickel on each of the layers of titanium on the first ceramic piece and the second ceramic piece; applying a layer of nickel phosphorous to each of the layers of nickel on the first ceramic piece and the second ceramic piece; assembling the first ceramic piece and the second ceramic piece with the layers of titanium, nickel, and nickel phosphorous therebetween; pressing the layer of nickel phosphorous of the first ceramic piece against the layer of nickel phosphorous of the second ceramic piece; heating the first ceramic piece and the second ceramic piece to a joining temperature in a vacuum; and cooling the first ceramic piece and the second ceramic piece. A hermetic seal is formed between the first ceramic piece and the second ceramic piece.
Method for assembling a metal part and a ceramic part, and electrical device, in particular a capacitive sensor, produced by said method
A method for the assembly of a metal part and a ceramic part, including the following steps: supplying a solid ceramic part of the alumina type; supplying a solid metal part, the metal being selected from platinum and tantalum, or an alloy including a majority of one of these metals; depositing at least one layer, called interface layer, on at least one of the solid parts, the interface layer containing magnesium oxide; bringing into contact the solid metal part and the solid ceramic part such that the interface layer is located between the solid parts; and hot densification under pressure of the solid parts brought into contact, to create a close bond between the solid parts and form a spinel from the interface layer. An electrical device, such as a capacitive sensor having a sensitive part produced according to the present method, is also provided.
Zirconia sintered body and manufacturing method of the same
A zirconia sintered body that includes a transparent zirconia portion and an opaque zirconia portion has a biaxial bending strength of 300 MPa or more. In addition, the opaque zirconia portion is configured by an opaque zirconia sintered body that is any one of a dark-colored zirconia sintered body, a medium-light-colored zirconia sintered body, and a light-colored zirconia sintered body.
Member for semiconductor manufacturing apparatus
A member for a semiconductor manufacturing apparatus includes a ceramic plate having an upper surface serving as a wafer mounting surface and incorporating an electrode, a ceramic dense plug disposed adjacent to a lower surface side of the ceramic plate and ceramic-bonded to the ceramic plate by a ring-shaped joint portion, a metal cooling plate joined to the lower surface of the ceramic plate in a portion other than the ring-shaped joint portion, and a gas flow channel. The gas flow channel includes a gas discharge hole that passes completely through the ceramic plate in the thickness direction of the ceramic plate and an internal gas flow channel that passes from the upper surface to the lower surface of the dense plug while winding through the dense plug. The gas flow channel passes inside of an inner periphery of the joint portion.
ULTRAFAST LASER WELDING OF CERAMICS
Ceramic welding methods and welded articles are disclosed. The present disclosure shows that transparent and diffuse ceramics can be successfully joined using lasers. The diffuse ceramic welding can be aided by introducing a small gap for optical penetration while no gap is necessary in the transparent ceramics case. Laser welding is more versatile on transparent ceramics since one can focus through the material allowing the joining of more complex geometries and over multiple interaction zones, increasing the ultimate weld volumes.
Multilayered ceramic substrate and method for manufacturing same
The present disclosure relates to a multilayer ceramic substrate preparation method. The multilayer ceramic substrate preparation method according to the present disclosure includes firing a plurality of ceramic green sheets, to create a plurality of ceramic thin films; forming a via hall in each of the plurality of ceramic thin films; filling the via hall of the plurality of ceramic thin films with conductive paste, and heat treating the via hall filled with the conductive paste, to form a via electrode; printing a pattern on a cross section of each of the plurality of ceramic thin films, and heat treating the printed pattern, to form an inner electrode; applying a bonding agent on the cross section of each of the ceramic thin films excluding an uppermost ceramic thin film of the plurality of ceramic thin films; aligning and laminating each of the plurality of ceramic thin films such that each of the plurality of ceramic thin films is electrically connected through the via electrode and the inner electrode; and firing or heat treating the laminated plurality of ceramic thin films.
Systems and methods for additively manufactured ceramic composites
A turbine engine component may comprise a Ceramic Matrix Composite (CMC) structure including a plurality of nominally dense plies, wherein each of the plurality of the nominally dense plies are bonded by at least one of a Field Assisted Sintering Technique (FAST), a Spark Plasma Sintering (SPS), or a localized heating at a bonding interface. The turbine engine component may include an airfoil extending between a first platform and a second platform, wherein the airfoil, the first platform, and the second platform define the CMC structure.
Internal cooling circuits for CMC and method of manufacture
A method for forming a ceramic matrix composite (CMC) component with an internal cooling channel includes forming a first fiber member, forming a first depression in a surface of the first fiber member, covering the first depression with a second fiber member to form a near-net shape fiber preform of a component with an internal channel defined in part by the first depression, and densifying the fiber preform.
Scraping device for joining material and method for manufacturing segment joint body
A scraping device for undried joining material protruding from a segment joint body in which side surfaces of a plurality of pillar-shaped honeycomb structure segments are joined via the undried joining material, the segment joint body having an outer peripheral side surface, a first honeycomb-shaped end surface, and a second honeycomb-shaped end surface located on an opposite side of the first honeycomb-shaped end surface, the scraping device includes a stand for placing the segment joint body; a controller; and a scraping robot comprising at least one scraping spatula configured to be movable in at least one scraping direction along at least one surface of the outer peripheral side surface, the first honeycomb-shaped end surface, and the second honeycomb-shaped end surface while being pressed against the at least one surface.
Airfoil with buffer layer to absorb thermal mismatch
An airfoil includes a ceramic matrix composite airfoil core that defines an airfoil portion and a root portion. The ceramic matrix composite airfoil core is subject to core thermal growth. A platform includes a ceramic matrix composite that wraps around the root portion. The platform is subject to platform thermal growth. A buffer layer is located between the root portion and the platform. The buffer layer absorbs a mismatch between the core thermal growth and the platform thermal growth.