Methods for repairing composite component voids are provided. For example, one method comprises locating a void in a composite component and subjecting the composite component to a process for repair. The process for repair includes creating a flow path through the void, applying a filler material to the composite component at the flow path, and processing the composite component having the filler material. In some embodiments, the flow path has a first opening on a first side of the composite component and a second opening on a second, opposite side of the composite component. In other embodiments, at least one portion of the flow path extends at a first angle with respect to a lateral direction defined by the CMC component, and at least another portion extends at a second angle with respect to the lateral direction.

Production of multilayered ceramic missile radomes with wide frequency band and high electromagnetic permeability through three-dimensional printing technology and the use of glass inter-layer materials to minimize defects caused by thermo-mechanical incompatibility of adjacent layers during sintering are provided. The three dimensional printing of the multilayered ceramic missile radomes provide an automated, operator-independent and repeatable manufacturing technique to produce wide band ceramic missile radomes.

Methods for repairing composite component voids are provided. For example, one method comprises locating a void in a composite component and subjecting the composite component to a process for repair. The process for repair includes creating a flow path through the void, applying a filler material to the composite component at the flow path, and processing the composite component having the filler material. In some embodiments, the flow path has a first opening on a first side of the composite component and a second opening on a second, opposite side of the composite component. In other embodiments, at least one portion of the flow path extends at a first angle with respect to a lateral direction defined by the CMC component, and at least another portion extends at a second angle with respect to the lateral direction.

A method for manufacturing a composite panel is described. The method includes producing a first wall, a second wall, a third wall and a fourth wall from composite materials including an oxide matrix and long oxide fibres; from the first and second walls, producing a cellular core including a plurality of cells, each cell including a first end and an opposing second end, covering the first and second ends of the cells of the cellular core with the third wall and the fourth wall, respectively, so as to close the ends of said cells.

A bonding tape for joining carbide ceramic structures, wherein the bonding tape comprises: a mixture comprising carbide ceramic particles, preceramic polymer liquid, fine carbon particles and metal nanoparticles that form a eutectic liquid at temperatures below 1400° C.

A manufacturing method of a honeycomb structure including: a formed body forming step of extruding a forming raw material, to form a plurality of quadrangular prismatic columnar honeycomb formed bodies; a firing step of firing the honeycomb formed bodies, to form a plurality of quadrangular prismatic-columnar quadrangular segments; a triangular segment forming step to form a triangular prismatic-columnar triangular segment; a bonded body forming step to form a honeycomb bonded body; and a circumference grinding step to manufacture the honeycomb structure, wherein the bonded body forming step further includes: a pressurizing step of pressurizing the triangular segment from a circumferential direction of the temporary assembly toward a central direction thereof, by use of a pressurizing jig comprising a pressurizer.

Adhesive compositions and methods for bonding materials with different thermal expansion coefficients is provided. The adhesive is formulated using a flux material, a low flux material, and a filler material, where the filler material comprises particulate from at least one of the two components being bonded together. A thickening agent can also be used as part of the adhesive composition to aid in applying the adhesive and establishing a desired bond thickness. The method of forming a high strength bond using the disclosed adhesive does not require the use of intermediary layer or the use of high cure temperatures that could damage one or both of the components being bonded together.

The invention relates to a method for the preparation of a blank from a ceramic material, wherein at least two layers of ceramic material of different compositions are filled into a die layer-by-layer and after filling of the layers they are then pressed and sintered, wherein after filling of a first layer this is structured on its surface in such a way that the first layer, viewed across its surface, differs in its height from region to region, and then a layer with a composition that differs from the first layer is filled as a second layer into the mold.

A ceramic matrix composite member including a ceramic matrix composite reinforced by ceramic fiber, includes a body portion and a joint portion joined integrally to the body portion, the joint portion occupying a part of a surface of the ceramic matrix composite member, wherein the body portion includes at least one hole extending toward an inside of the body portion from a boundary surface between the body portion and the joint portion, and the at least one hole is filled with a matrix of the ceramic matrix composite, wherein the body portion includes a first region where a density of the ceramic fiber is relatively high and a second region where the density of the ceramic fiber is lower than that in the first region, and wherein the at least one hole exists so as to cut off a part of bundles of the ceramic fiber in the second region.

An airfoil includes a ceramic matrix composite airfoil core that defines an airfoil portion and a root portion. The ceramic matrix composite airfoil core is subject to core thermal growth. A platform includes a ceramic matrix composite that wraps around the root portion. The platform is subject to platform thermal growth. A buffer layer is located between the root portion and the platform. The buffer layer absorbs a mismatch between the core thermal growth and the platform thermal growth.