A joined body 20 includes a first member 21, a second member 22, and a joint portion 30 which is formed from an oxide ceramic containing a Fe.sub.3O.sub.4 phase in which a solute component capable of forming a spinel-type oxide with Fe is solid-dissolved and which joins the first member 21 and the second member 22.

A composite ceramic substrate having multi-layer configuration includes a nitride ceramic core layer, two composite layers respectively formed on two opposite sides of the nitride ceramic core layer, and two ceramic covering layers that are respectively formed on the two composite layers. Each of the two ceramic covering layers is coated on the corresponding composite layer so as to be jointly sintered to the nitride ceramic core layer. Each of the two ceramic covering layers and the nitride ceramic core layer are of different materials, and a composite material of each of the two composite layers includes the material of the ceramic covering layer connected thereto and the material of the nitride ceramic core layer. A sum of the thicknesses of the two ceramic covering layers and the thicknesses of the two composite layers is less than or equal to a thickness of the nitride ceramic core layer.

A method of forming a hybrid metal composite structure including at least one metal ply. The method includes forming at least one metal ply, forming the at least one metal ply comprising forming at least one perforation in the at least one metal ply, abrasively blasting at least one surface of the at least one metal ply to coarsen the at least one surface of the metal ply, and exposing the at least one metal ply to at least one of an acid or a base. The method further includes disposing at least one fiber composite material structure adjacent the at least one metal ply. Related methods of forming a portion of a rocket case and related hybrid metal composite structures are also disclosed.

A metal/ceramic bonding substrate wherein the bonding strength of an aluminum plate bonded directly to a ceramic substrate is higher than that of conventional metal/ceramic bonding substrates, and a method for producing same, wherein the method includes arranging a ceramic substrate in a mold; putting the mold in a furnace; lowering an oxygen concentration to 25 ppm or less and a dew point to 45 C. or lower in the furnace; injecting a molten metal of aluminum into the mold to contact the surface of the ceramic substrate; and cooling and solidifying the molten metal to form a metal plate for a circuit pattern of aluminum on one side of the ceramic substrate to bond one side of the metal plate for a circuit pattern directly to the ceramic substrate, while forming a metal base plate of aluminum on the other side of the ceramic substrate.

A ceramic structural body includes a substrate that is composed of a ceramic(s), a hole that is opened on a surface of the substrate, and a seal material that is positioned at an opening portion of the hole.

A honeycomb structural body 40 includes: a partition wall 48 formed of a porous ceramic which forms and defines a plurality of cells 47 each functioning as a flow path of a fluid and extending from one end surface to the other end surface; and an outer circumference wall 49 formed along the outermost circumference, where an oxide ceramic containing a Fe.sub.3O.sub.4 phase in which a solute component capable of forming a spinel-type oxide with Fe is solid-dissolved is formed.

A joined body 20 includes a first member 21 which is a ceramic containing Si, a second member 22, and a joining portion 30 which is formed of an electrically conductive oxide containing a Fe.sub.3O.sub.4 phase and which joins the first member 21 and the second member 22. In the joined body 20, no reaction layer is preferably formed at a joining interface between the electrically conductive oxide and the first member 21. The joining portion 30 is preferably formed to have a multilayer structure in which from the first matter 21 to the second member 22, a first layer containing a first oxide of a transition metal, a second layer containing an electrically conductive oxide of a transition metal having a low valence as compared to that of the first oxide, and a mixed layer containing a transition metal and an oxide thereof are formed.

A substrate support for a substrate processing system includes a baseplate and a ceramic layer arranged on the baseplate. The ceramic layer includes a lower surface, an upper surface configured to support a substrate, and sidewalls around a perimeter of the ceramic layer extending from the lower surface to the upper surface, and the ceramic layer comprises a first material. A bond layer is provided between the baseplate and the ceramic layer. A protective layer is formed on the sidewalls of the ceramic layer. The protective later comprises a second material different from the first material.

A copper/ceramic bonded body includes: a copper member made of copper or a copper alloy; and a ceramic member made of an aluminum nitride, wherein, the copper member and the ceramic member are bonded to each other, and a Mg solid solution layer is provided between the copper member and the ceramic member and contains Mg in a state of a solid solution in a Cu primary phase.

An improved ceramic material for heat insulation with selection of specific stabilizers and adapted proportions, includes zirconium oxide with 0.2 wt. % to 8.0 wt. % of the base stabilizers: yttrium oxide (Y.sub.2O.sub.3), hafnium oxide (HfO.sub.2), cerium oxide (CeO.sub.2), calcium oxide (CaO), and/or magnesium oxide (MgO), wherein at least yttrium oxide (Y.sub.2O.sub.3) is used, and optionally at least one of the additional stabilizers: 0.2 wt. % to 20 wt. % of erbium oxide (Er.sub.2O.sub.3) and/or ytterbium oxide (Yb.sub.2O.sub.3).