Adhesive compositions and methods for bonding materials with different thermal expansion coefficients is provided. The adhesive is formulated using a flux material, a low flux material, and a filler material, where the filler material comprises particulate from at least one of the two components being bonded together. A thickening agent can also be used as part of the adhesive composition to aid in applying the adhesive and establishing a desired bond thickness. The method of forming a high strength bond using the disclosed adhesive does not require the use of intermediary layer or the use of high cure temperatures that could damage one or both of the components being bonded together.

A manufacture method of a lining plate structure for use with a tube mill for the cement industry. The manufacture method has the following three technical solutions: 1) metal lining plate, 2) ceramic lining plate, and 3) combined lining plate. The manufacture method includes: lining the concave-convex space, formed in the combination of metal lining plate and tube body, with corundum ceramic lining plate; then installing the combined lining plate on the steel plate of the tube body through inlaying, sticking and local welding. Under the same reference conditions of the present method, the weight of lining plate is reduced 50%, saving the steel material consumption by more than 50%; and the service life of the lining plate for use with the tube mill of cement industry is doubled, up to 15000-20000 hours.

A thermal protection system is provided for a vehicle substructure. The thermal protection system comprises an outer layer for protecting the vehicle substructure. The thermal protection system further comprises an inner layer for conforming to the vehicle substructure. The thermal protection system also comprises an insulation layer sandwiched between the inner and outer layers. The insulation layer includes a porous low-density ceramic insulating material having a densified portion that covers an inner surface of the outer layer to strengthen adhesion.

A wafer holder 10 includes a resin adhesive layer 16 between a ceramic electrostatic chuck 12 and a metal cooling plate 14. The adhesive layer 16 includes a first layer 16a in contact with the electrostatic chuck 12, a second layer 16b in contact with the cooling plate 14, and an intermediate layer 16c located between the first layer 16a and the second layer 16b. Heat resistance of each of the first layer 16a and the intermediate layer 16c is higher than heat resistance of the second layer 16b, flexibility of the second layer 16b is higher than flexibility of each of the first layer 16a and the intermediate layer 16c, and the layers are in hermetic contact with each other.

An adhesive composition containing cottonseed protein, and one or more of the following components: (i) soy protein, (ii) a polysaccharide, and (iii) at least one modifier selected from a carboxylic acid, a dicarboxylic acid, a phosphorus-containing acid or ester, a cationic amino acid, a quaternary ammonium salt, or mixtures thereof.

Adhesive compositions and methods for bonding materials with different thermal expansion coefficients is provided. The adhesive is formulated using a flux material, a low flux material, and a filler material, where the filler material comprises particulate from at least one of the two components being bonded together. A thickening agent can also be used as part of the adhesive composition to aid in applying the adhesive and establishing a desired bond thickness. The method of forming a high strength bond using the disclosed adhesive does not require the use of intermediary layer or the use of high cure temperatures that could damage one or both of the components being bonded together.

Provided herein is a heat dissipating laminate that exhibits excellent heat conductivity not only in the plane direction (XY-axis direction), but also in the thickness direction (Z-axis direction). The heat dissipating laminate of the present invention is characterized in comprising: a first layer consisting of one or more selected from the group consisting of expanded graphite and mixed graphite; a first sheet body laminated to one surface of the first layer; and a second sheet body laminated to another surface of the first layer, wherein a coating is applied on the second sheet body.

A ceramic structural body includes a substrate that is composed of a ceramic(s), a hole that is opened on a surface of the substrate, and a seal material that is positioned at an opening portion of the hole.

Fan blade containment system includes circular tile layer of annular ceramic tiles attached to and extending radially inwardly from a shell, radially inner and outer annular surfaces of ceramic tiles bonded to a radially inner composite layer and the shell respectively with elastomeric inner and outer adhesive layers respectively. Elastomeric adhesive layers between circumferentially adjacent overlapped or scarfed edges along circumferential edges of the ceramic tiles overlap and mate along oppositely facing surfaces of adjacent ones of the ceramic tiles. Inner and outer adhesive layers and elastomeric adhesive layer may be a double-sided adhesive foam tape. Scarfed edges may be bevels or rabbets. Shell may be made of a metal or composite material. Fan blade containment system may be bonded to and extend inwardly from fan case circumscribing fan blades of a fan. Inner composite layer and composite outer shell may be co-cured with ceramic tiles therebetween.

A metal-on-ceramic substrate comprises a ceramic layer, a first metal layer, and a bonding layer joining the ceramic layer to the first metal layer. The bonding layer includes thermoplastic polyimide adhesive that contains thermally conductive particles. This permits the substrate to withstand most common die attach operations, reduces residual stress in the substrate, and simplifies manufacturing processes.