A wiring substrate includes an insulating substrate, a conductor and an Ni film. The insulating substrate has a first surface and a second surface on a side opposite the first surface, and contains AlN. The conductor is disposed on the first surface and contains Cu. The Ni film is disposed so as to extend across an upper surface and a side surface of the conductor to the first surface. Ti oxide is scattered so as to be at a plurality of points on the first surface.

A method of plugging a filter, comprising: positioning a mask layer over the filter comprising a plurality of intersecting walls, wherein the intersecting walls define at least one channel between the intersecting walls; perforating the mask layer proximate the channel to form a hole, wherein the hole extends around a portion of a perimeter of the channel such that the mask layer defines a flap extending over a center of the channel; passing a plugging mixture into the channel through the hole in the mask layer; and sintering the plugging mixture to form a plug within the channel.

A method of plugging a filter, comprising: positioning a mask layer over the filter comprising a plurality of intersecting walls, wherein the intersecting walls define at least one channel between the intersecting walls; perforating the mask layer proximate the channel to form a hole, wherein the hole extends around a portion of a perimeter of the channel such that the mask layer defines a flap extending over a center of the channel; passing a plugging mixture into the channel through the hole in the mask layer; and sintering the plugging mixture to form a plug within the channel.

Methods for forming a sintered patch on a silicon-based substrate are disclosed. The methods include applying a patch slurry on the silicon-based substrate, drying the patch slurry on the silicon-based substrate to form a dried patch material, and sintering the dried patch material in an oxidizing atmosphere to form a sintered patch on the silicon-based substrate. The patch slurry includes a patch material containing silicates in a fluid carrier.

Methods for forming a sintered patch on a silicon-based substrate are disclosed. The methods include applying a patch slurry on the silicon-based substrate, drying the patch slurry on the silicon-based substrate to form a dried patch material, and sintering the dried patch material in an oxidizing atmosphere to form a sintered patch on the silicon-based substrate. The patch slurry includes a patch material containing silicates in a fluid carrier.

Methods for forming holes in a substrate by reducing back reflections of a quasi-non-diffracting beam into the substrate are described herein. In some embodiments, a method of processing a substrate having a first surface and a second surface includes applying an exit material to the second surface of the substrate, wherein a difference between a refractive index of the exit material and a refractive index of the substrate is 0.4 or less, and focusing a pulsed laser beam into a quasi-non-diffracting beam directed into the substrate such that the quasi-non-diffracting beam enters the substrate through the first surface. The substrate is transparent to at least one wavelength of the pulsed laser beam. The quasi-non-diffracting beam generates an induced absorption within the substrate that produces a damage track within the substrate.

A knife includes a blade having a first side face and a second side face. The blade includes zirconia as a main component, and includes a cutting region including at least a ridge portion between the first side face and the second side face. When a portion including the cutting region in the first side face is referred to as a first cutting face, and a portion including the cutting region in the second side face is referred to as a second cutting face, the proportion of cubic crystals of zirconia in the first cutting face is larger than the proportion of cubic crystals of zirconia in the second cutting face.

A knife includes a blade having a first side face and a second side face. The blade includes zirconia as a main component, and includes a cutting region including at least a ridge portion between the first side face and the second side face. When a portion including the cutting region in the first side face is referred to as a first cutting face, and a portion including the cutting region in the second side face is referred to as a second cutting face, the proportion of cubic crystals of zirconia in the first cutting face is larger than the proportion of cubic crystals of zirconia in the second cutting face.

The disclosure describes articles and techniques that include an airfoil having a hybrid coating system to provide improved particle impact resistance and improve CMAS attack resistance on the pressure side of the airfoil and improved thermal load protection on the suction side of the airfoil. An example article for a gas turbine engine may include a substrate, and a hybrid environmental barrier coating (EBC) including a relatively dense EBC layer on a first portion of the substrate and a relatively porous EBC layer on a second portion of the substrate, where the first portion of the substrate is different from the second portion of the substrate, and wherein at least a portion of the relatively porous EBC layer overlaps at least a portion of the relatively dense EBC layer in an overlap region.

The disclosure describes articles and techniques that include an airfoil having a hybrid coating system to provide improved particle impact resistance and improve CMAS attack resistance on the pressure side of the airfoil and improved thermal load protection on the suction side of the airfoil. An example article for a gas turbine engine may include a substrate, and a hybrid environmental barrier coating (EBC) including a relatively dense EBC layer on a first portion of the substrate and a relatively porous EBC layer on a second portion of the substrate, where the first portion of the substrate is different from the second portion of the substrate, and wherein at least a portion of the relatively porous EBC layer overlaps at least a portion of the relatively dense EBC layer in an overlap region.