Patent classifications
C04B41/91
Solid State Heater And Method Of Manufacture
A solid state heater and methods of manufacturing the heater is disclosed. The heater comprises a unitary component that includes portions that are graphite and other portions that are silicon carbide. Current is conducted through the graphite portion of the unitary structure between two or more terminals. The silicon carbide does not conduct electricity, but is effective at conducting the heat throughout the unitary component. In certain embodiments, chemical vapor conversion (CVC) is used to create the solid state heater. If desired, a coating may be applied to the unitary component to protect it from a harsh environment.
SOLID STATE ELECTROLYTE MATERIALS
A solid state electrolyte material including a decontaminated lithium conducting ceramic oxide material including a decontaminated surface thickness. The decontaminated surface thickness is less than or equal to 5 nm. The decontaminated surface thickness may be greater than or equal to 1 nm. The decontaminated lithium conducting ceramic oxide material may be selected from the group consisting of Li.sub.7La.sub.3Zr.sub.2O.sub.12 (LLZO), Li.sub.5La.sub.3Ta.sub.2O.sub.12 (LLTO), Li.sub.6La.sub.2CaTa.sub.2O.sub.12 (LLCTO), Li.sub.6La.sub.2ANb.sub.2O.sub.12 (A is Ca or Sr), Li.sub.1+xAl.sub.xGe.sub.2-x(PO.sub.4).sub.3 (LAGP), Li.sub.14Al.sub.0.4(Ge.sub.2-xTi.sub.x).sub.1.6(PO.sub.4).sub.3 (LAGTP), perovskite Li.sub.3xLa.sub.2/3-xTiO.sub.3 (LLTO), Li.sub.0.8La.sub.0.6Zr.sub.2(PO.sub.4).sub.3 (LLZP), Li.sub.1+xTi.sub.2-xAl.sub.x(PO.sub.4).sub.3 (LTAP), Li.sub.1+x+yTi.sub.2-xAl.sub.xSi.sub.y(PO.sub.4).sub.3-y (LTASP), LiTi.sub.xZr.sub.2-x(PO.sub.4).sub.3 (LTZP), Li.sub.2Nd.sub.3TeSbO.sub.12 and mixtures thereof.
METHOD FOR PRODUCING CERAMIC COMPOSITE
A method for producing a ceramic composite includes: preparing a sintered body in a plate form containing a fluorescent material having a composition of a rare earth aluminate, and aluminum oxide; and eluting the aluminum oxide from the sintered body by contacting the sintered body with a basic substance, for example, contained in an alkali aqueous solution, and the dissolution amount of the fluorescent material eluted from the sintered body in the step of eluting the aluminum oxide is 0.5% by mass or less based on an amount of the fluorescent material contained in the sintered body as 100% by mass.
Medical devices and instruments with non-coated superhydrophobic or superoleophobic surfaces
Device surfaces are rendered superhydrophobic and/or superoleophobic through microstructures and/or nanostructures that utilize the same base material(s) as the device itself without the need for coatings made from different materials or substances. A medical device includes a portion made from a base material having a surface adapted for contact with biological material, and wherein the surface is modified to become superhydrophobic, superoleophobic, or both, using only the base material, excluding non-material coatings. The surface may be modified using a subtractive process, an additive process, or a combination thereof. The product of the process may form part of an implantable device or a medical instrument, including a medical device or instrument associated with an intraocular procedure. The surface may be modified to include micrometer- or nanometer-sized pillars, posts, pits or cavitations; hierarchical structures having asperities; or posts/pillars with caps having dimensions greater than the diameters of the posts or pillars.
Medical devices and instruments with non-coated superhydrophobic or superoleophobic surfaces
Device surfaces are rendered superhydrophobic and/or superoleophobic through microstructures and/or nanostructures that utilize the same base material(s) as the device itself without the need for coatings made from different materials or substances. A medical device includes a portion made from a base material having a surface adapted for contact with biological material, and wherein the surface is modified to become superhydrophobic, superoleophobic, or both, using only the base material, excluding non-material coatings. The surface may be modified using a subtractive process, an additive process, or a combination thereof. The product of the process may form part of an implantable device or a medical instrument, including a medical device or instrument associated with an intraocular procedure. The surface may be modified to include micrometer- or nanometer-sized pillars, posts, pits or cavitations; hierarchical structures having asperities; or posts/pillars with caps having dimensions greater than the diameters of the posts or pillars.
Sintered body and electrostatic chuck
A sintered body includes a ceramic substrate including sintered oxide particles, a through-hole formed in the ceramic substrate such that the side surfaces of the oxide particles exposed from an inner wall of the through-hole form a flat surface, and a porous body disposed in the through-hole, the porous body including spherical oxide ceramic particles and a mixed oxide configured to bind the spherical oxide ceramic particles.
Sintered body and electrostatic chuck
A sintered body includes a ceramic substrate including sintered oxide particles, a through-hole formed in the ceramic substrate such that the side surfaces of the oxide particles exposed from an inner wall of the through-hole form a flat surface, and a porous body disposed in the through-hole, the porous body including spherical oxide ceramic particles and a mixed oxide configured to bind the spherical oxide ceramic particles.
Method of forming fine dimples in a hard-brittle material surface
The present invention is directed to provide a method of forming dimples comparatively simply on a surface of hard-brittle materials such as ceramics by post-processing. In the method, substantially spherical ejection particles having a median diameter d50 of from 1 μm to 20 μm are ejected together with a compressed gas at an ejection pressure of from 0.01 MPa to 0.7 MPa against a dimple formation region which is a region where dimples are to be formed on a surface of an article made from a hard-brittle material or a surface of an article having a surface coated with a coating layer of a hard-brittle material, or the like so as to form dimples on the surface of the hard-brittle material by plastic deformation without occurrences of breaks or cracks.
Method of forming fine dimples in a hard-brittle material surface
The present invention is directed to provide a method of forming dimples comparatively simply on a surface of hard-brittle materials such as ceramics by post-processing. In the method, substantially spherical ejection particles having a median diameter d50 of from 1 μm to 20 μm are ejected together with a compressed gas at an ejection pressure of from 0.01 MPa to 0.7 MPa against a dimple formation region which is a region where dimples are to be formed on a surface of an article made from a hard-brittle material or a surface of an article having a surface coated with a coating layer of a hard-brittle material, or the like so as to form dimples on the surface of the hard-brittle material by plastic deformation without occurrences of breaks or cracks.
Transferring nanostructures from wafers to transparent substrates
Embodiments of the present disclosure generally relate to methods of forming optical devices comprising nanostructures disposed on transparent substrates. A substrate, such as a silicon wafer, is provided as a base for forming an optical device. A transparent layer is disposed on a first surface of the substrate, and a structure layer is disposed on the transparent surface. An etch mask layer is disposed on a second surface of the substrate opposite the first surface, and a window or opening is formed in the etch mask layer to expose a portion of the second surface of the substrate. A plurality of nanostructures is then formed in the structure layer, and a portion of the substrate extending from the window to the transparent layer is removed. A portion of the transparent layer having nanostructures disposed thereon is then detached from the substrate to form an optical device.