C04B2111/00844

THERMALLY CONDUCTIVE COMPOSITE PARTICLES, METHOD FOR PRODUCING SAME, INSULATING RESIN COMPOSITION, INSULATING RESIN MOLDED BODY, LAMINATE FOR CIRCUIT BOARDS, METAL BASE CIRCUIT BOARD AND POWER MODULE
20210017084 · 2021-01-21 · ·

A thermally conductive composite particle, including: a core portion including an inorganic particle; and a shell portion including a nitride particle and covering the core portion, is provided. The thermally conductive composite particle is a sintered body.

Apparatus and Method for Solar Heat Collection
20210018184 · 2021-01-21 ·

Subterranean thermal capacitance for an environmental-control apparatus mechanized via a solar thermal system. The method and apparatus use a solar collector and a plurality of heating-energy-storage cells that are each thermally insulated from one another, wherein heating energy-transfer fluid (HETF) coming from the solar collector is transferred to the energy-storage cell having the highest temperature that is greater than the temperature of the HETF, in order to segregate energy-storage cells to more efficiently store heating energy. Some embodiments further include an energy radiator that radiates thermal energy to an environment and thereby cools a cooling-energy-transfer fluid (CETF) and a plurality of cooling-energy-storage cells that are each thermally insulated from one another, wherein the CETF coming from the energy radiator is transferred to the cooling-energy-storage cell having the lowest temperature that is lower than the temperature of the ETF, in order to segregate cooling-energy-storage cells to more efficiently store cooling energy.

PROCESS FOR THE MANUFACTURE OF ENCAPSULATED SEMICONDUCTOR DIES AND/OR OF ENCAPSULATED SEMICONDUCTOR PACKAGES

A process for the manufacture of encapsulated semiconductor dies and/or of encapsulated semiconductor packages or for the manufacture of an encapsulation of semiconductor dies and/or of semiconductor packages comprising the steps: (1) assembling a multitude of bare semiconductor dies on a temporary carrier, and (2) encapsulating the assembled bare semiconductor dies, characterized in that an aqueous hydraulic hardening inorganic cement preparation is applied as encapsulation agent in step (2).

Electron conducting carbon-based cement

A nanoporous carbon-loaded cement composite that conducts electricity. The nanoporous carbon-loaded cement composite can be used in a variety of different fields of use, including, for example, a structural super-capacitor as an energy solution for autonomous housing and other buildings, a heated cement for pavement deicing or house basement insulation against capillary rise, a protection of concrete against freeze-thaw (FT) or alkali silica reaction (ASR) or other crystallization degradation processes, and as a conductive cable, wire or concrete trace.

Inorganic shell, resin composition, and method for making inorganic shell

An inorganic shell is ball-shaped and hollow, and includes silica and crystalline inorganic powder sintered together. A resin composition has the inorganic shells and the resin composition has certain dieletric characteristics. A method for making the inorganic shell is also provided.

Barium titanate foam ceramic/thermosetting resin composites and preparation method thereof

Disclosed are a barium titanate foam ceramic/thermosetting resin composite material and a preparation method therefor. An organic additive is used as an auxiliary; deionized water is used as a solvent; nanometer barium titanate is used as a ceramic raw material; and all of same are mixed and ground so as to form a slurry with a certain solid content. A pre-treated polymer sponge is impregnated into the slurry for slurry coating treatment, and then redundant slurry is removed and the polymer sponge is dried so as to obtain a barium titanate foam ceramic blank, and same is then sintered so as to obtain a barium titanate foam ceramic. A resin, being in a molten state and thermosettable, submerges the pores of the barium titanate foam ceramic, and a barium titanate foam ceramic/thermosetting resin composite material is obtained after a thermosetting treatment.

A PROCESS FOR THE PREPARATION OF A POROUS CARBON MATERIAL USING AN IMPROVED AMPHIPHILIC SPECIES

A process for preparation of a porous carbon material using an improved amphiphilic species. Also disclosed are a porous carbon material, devices comprising the porous carbon material and use of an amphiphilic compound for the preparation of a porous carbon material. The process for preparing a porous carbon material comprises the process steps: (a) providing a carbon source comprising a first carbon source compound; (b) providing an amphiphilic species comprising a first amphiphilic compound, the first amphiphilic compound comprising two or more adjacent ethylene oxide-based repeating units; (c) contacting the carbon source and the amphiphilic species to obtain a precursor; and (d) heating the precursor to obtain the porous carbon material.

Lead-free high-insulating ceramic coating zinc oxide arrester valve and preparation method thereof

A lead-free insulating ceramic coating zinc oxide arrester valve and a method for manufacturing thereof are disclosed. In an embodiment a method includes preparing an initial powder from starting materials with the following mass percentages: ZnO: 86-95%; Bi2O3: 1.0-3.0%; Co3O4: 0.5-1.5%; Mn3O4: 0.2-1.0%; Sb2O3: 3.0-9.0 %; NiO: 0.2-1.0%; and SiO2: 1.0-3.0%, preparing a ceramic coating powder by mixing the initial powder, deionized water and first grinding balls, milling the mixture, and drying and pulverizing the mixture, preparing a ceramic coating slurry by mixing a PVA solution, the ceramic coating powder and second grinding balls and milling the mixture, applying the ceramic coating slurry to a green body, heating and debinding the ceramic coating slurry with the green body thereby forming a resistor element and sintering the resistor element thereby obtaining a zinc oxide surge arrester valve block having a lead-free insulating ceramic coating.

Method of Making Aluminum Nitride Foam
20200239312 · 2020-07-30 ·

Porous aluminum nitride (AlN) provides a greater surface area and higher permeability, which is especially desirable for advanced functional application. Porous or bulk aluminum nitride is very difficult to manufacture due mainly to its high melting point (e.g., 2200 degrees Celsius). A new processing method synthesizes porous aluminum nitride through a complete transformation from porous aluminum using a remarkably low nitriding or sintering temperature. The manufactured porous aluminum nitride foam can be used for such applications as filters, separators, heat sinks, ballistic armor, electronic packaging, light- and field-emission devices, and highly wear-resistant composites when infiltrated with metal such as aluminum, titanium, or copper.

CARBON FOAM, STACK CARBON FOAM, AND METHOD OF MANUFACTURING STACK CARBON FOAM

It is an object of the present disclosure to provide a thin-film carbon foam and a method of manufacture the same. It is another object of the present disclosure to provide a stack carbon foam having fewer through holes and a method of manufacturing the same. The carbon foam of the present disclosure is, for example, a stack carbon foam being a stack of at least two monolayer carbon foams stacked one another, each monolayer carbon foam comprising linear portions and node portions joining the linear portions, or a carbon foam comprising linear portions and node portions joining the linear portions, wherein the ratio of the number of large through holes having a diameter of 1 mm or more to the surface area of the carbon foam is 0.0003/mm.sup.2 or less.