C04B2111/00844

INORGANIC SHELL, RESIN COMPOSITION, AND METHOD FOR MAKING INORGANIC SHELL
20190055378 · 2019-02-21 ·

An inorganic shell is ball-shaped and hollow, and includes silica and crystalline inorganic powder sintered together. A resin composition has the inorganic shells and the resin composition has certain dieletric characteristics. A method for making the inorganic shell is also provided.

Metal coating on ceramic substrates

A method for producing metal coatings on ceramic substrates for establishing electrical contact, and ceramic substrates having metal coatings. More particularly, the invention relates to the production of weldable and solderable metal coatings on ceramic substrates.

BARIUM TITANATE FOAM CERAMIC/THERMOSETTING RESIN COMPOSITES AND PREPARATION METHOD THEREOF
20190016639 · 2019-01-17 ·

Disclosed are a barium titanate foam ceramic/thermosetting resin composite material and a preparation method therefor. An organic additive is used as an auxiliary; deionized water is used as a solvent; nanometer barium titanate is used as a ceramic raw material; and all of same are mixed and ground so as to form a slurry with a certain solid content. A pre-treated polymer sponge is impregnated into the slurry for slurry coating treatment, and then redundant slurry is removed and the polymer sponge is dried so as to obtain a barium titanate foam ceramic blank, and same is then sintered so as to obtain a barium titanate foam ceramic. A resin, being in a molten state and thermosettable, submerges the pores of the barium titanate foam ceramic, and a barium titanate foam ceramic/thermosetting resin composite material is obtained after a thermosetting treatment.

FIRE-RESISTANT CABLE
20180374608 · 2018-12-27 ·

The present invention relates to a fire-resistant cable comprising at least one electrically insulating composite layer based on at least one cementitious material and at least one starch, and the process for manufacturing same.

Method for metalizing vias
10165681 · 2018-12-25 · ·

A method for producing plated-through holes in printed circuit boards and to printed circuit boards produced in this manner.

BORON NITRIDE AGGREGATE POWDER
20180362726 · 2018-12-20 ·

A powder essentially composed of aggregates based on boron nitride, the powder exhibiting an overall chemical composition, as percentages by weight, including between 40 and 45% of boron, between 53 and 57% of nitrogen, less than 400 ppm by weight of calcium, less than 5%, in total, of other elements and more than 90% of boron nitride, limit included, as percentage by weight and on the basis of the combined crystalline phases, a mean circularity of greater than or equal to 0.90, a median pore size of less than or equal to 1.5 m and an apparent porosity of less than or equal to 55%.

LOW COMPRESSION SET AEROGELS AND AEROGEL COMPOSITES AND METHODS OF MAKING

This disclosure relates generally to aerogel technology. The disclosure relates more particularly, in various embodiments, to improved methods for producing aerogels and improved aerogel composites having a low compression set.

Organosiloxane compositions and uses thereof
10155885 · 2018-12-18 · ·

The present disclosure provides methods of making organosiloxane polymer compositions from hydrosilylation curable compositions comprising at least the components (a) and (b) and at least one of components (c) and (d): (a) an organosiloxane resin material comprising aliphatic unsaturation; and (b) an organosiloxane crosslinker comprising multiple silicon atom-bonded hydrogen atoms (e.g., an SiH siloxane); in combination with at least one of (c) at least one organosiloxane comprising at least two silicon atom-bonded hydrogen atoms; and (d) at least one organosiloxane comprising at least two silicon atom-bonded hydrocarbyl groups comprising aliphatic unsaturation (e.g., a di-vinyl functional siloxane). Such hydrosilylation curable compositions have, in some instances, significantly faster cure speed, relative to their condensation curable counterparts. A faster cure speed can be important for encapsulating electronic devices, such as light-emitting diode (LED) chip devices, including devices having tall structures.

Resin-impregnated boron nitride sintered body and use for same

A resin-impregnated boron nitride sintered body having superior thermal conductivity and superior strength, and a resin-impregnated boron nitride sintered body having superior conductivity and small anisotropy of thermal conductivity are provided. A resin-impregnated boron nitride sintered body, including: 30 to 90 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally; and 10 to 70 volume % of a resin; wherein the boron nitride sintered body has a porosity of 10 to 70%; the boron nitride particles of the boron nitride sintered body has an average long diameter of 10 m or more; the boron nitride sintered body has a graphitization index by powder X-ray diffractometry is 4.0 or less; and an orientation degree of the boron nitride particles of the boron nitride sintered body by I.O.P is 0.01 to 0.05 or 20 to 100; and a resin-impregnated boron nitride sintered body, including: 30 to 90 volume % of a boron nitride sintered body having boron nitride particles bonded three-dimensionally is provided.

POSITIVE TEMPERATURE COEFFICIENT CERAMIC THERMISTOR ELEMENT HAVING STRONG REDUCING ATMOSPHERE RESISTANCE AND PREPARATION METHOD THEREFOR
20240312678 · 2024-09-19 ·

A positive temperature coefficient ceramic thermistor element includes a sintered thermosensitive ceramic piece that uses lead barium titanate as a base, as well as metal ohmic electrodes which are positioned on two side surfaces of the thermosensitive ceramic piece. The thermistor element has a microporous channel barrier layer, and includes a glass sealing layer which wraps the outer surface of the thermosensitive ceramic piece, or an organic matter sealant which fills and blocks micro-pores in the surfaces of the metal ohmic electrodes combined on the two side surfaces of the thermosensitive ceramic piece and, at the same time, blocks gaps in the surfaces of areas, that do not have the metal ohmic electrodes, of a peripheral edge of the thermosensitive ceramic piece.