C04B2111/00844

VOLTAGE-NONLINEAR RESISTOR ELEMENT AND METHOD FOR PRODUCING THE SAME

A voltage-nonlinear resistor element 10 includes a voltage-nonlinear resistor (referred simply as “resistor”) 20 and a pair of electrodes 14 and 16 between which the resistor 20 is interposed. The resistor 20 has a multilayer structure including a first layer 21 composed primarily of zinc oxide, a second layer 22 composed primarily of zinc oxide, and a third layer 23 composed primarily of a metal oxide other than zinc oxide. The second layer 22 is adjacent to the first layer 21 and has a smaller thickness and a higher volume resistivity than the first layer 21. The third layer 23 is adjacent to the second layer 22.

COMPOSITE BODY AND METHOD FOR PRODUCING SAME
20170239715 · 2017-08-24 · ·

A composite production method includes impregnating a plate-shaped porous inorganic structure and a fibrous inorganic material with a metal while the fibrous inorganic material is arranged to be adjacent to the porous inorganic structure. In the composite structure, first and second phases are adjacent to each other by using a porous inorganic structure having a porous silicon carbide ceramic sintered body and the fibrous inorganic material, the first phase being a phase in which the porous silicon carbide ceramic sintered body is impregnated with the metal, the second phase being a phase in which the fibrous inorganic material is impregnated with the metal, a percentage of the porous silicon carbide ceramic sintered body in the first phase is 50 to 80 volume percent, and a percentage of the fibrous inorganic material in the second phase is 3 to 20 volume percent. A composite is produced by the method.

METAL/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME
20220032580 · 2022-02-03 · ·

There are provide a metal/ceramic bonding substrate wherein the bonding strength of an aluminum plate bonded directly to a ceramic substrate is higher than that of conventional metal/ceramic bonding substrates, and a method for producing the same. The metal/ceramic bonding substrate is produced by a method including the steps of: arranging a ceramic substrate 10 in a mold 20; putting the mold 20 in a furnace; lowering an oxygen concentration to 25 ppm or less and a dew point to −45° C. or lower in the furnace; injecting a molten metal of aluminum into the mold 20 so as to allow the molten metal to contact the surface of the ceramic substrate 10; and cooling and solidifying the molten metal to form a metal plate 14 for circuit pattern of aluminum on one side of the ceramic substrate 10 to bond one side of the metal plate 14 for circuit pattern directly to the ceramic substrate 10, while forming a metal base plate 12 of aluminum on the other side of the ceramic substrate 10 to bond the metal base plate 12 directly to the ceramic substrate 10.

REFRACTORY METAL INKS AND RELATED SYSTEMS FOR AND METHODS OF MAKING HIGH-MELTING-POINT ARTICLES
20170226362 · 2017-08-10 · ·

Thin films of precious metals such as platinum and gold have the required ability to withstand high temperatures, but in pure form can suffer from grain growth, agglomeration and dewetting at high temperature. Grain boundaries must therefore be pinned by alloying with other metals and/or by inclusion of non-metallic nanoparticles. While such bulk materials are known in the prior art, they have not existed previously as printable inks that can be deposited by additive manufacturing direct-write methods. These materials have been formulated for the first time as alloy and composite inks so that they may be applied by direct-write additive manufacturing techniques directly onto three-dimensional components or on high temperature substrates that can be adhered to complex components.

FERRITE COMPOSITION AND ELECTRONIC COMPONENT

A ferrite composition comprises a main component and a subcomponent. The main component includes 32.0 to 46.4 mol % of iron oxide in terms of Fe.sub.2O.sub.3, 4.4 to 14.0 mol % of copper oxide in terms of CuO, and 8.4 to 56.9 mol % of zinc oxide in terms of ZnO. The subcomponent includes 0.53 to 11.00 parts by weight of a silicon compound in terms of SiO.sub.2, 0.1 to 12.8 parts by weight of a tin compound in terms of SnO.sub.2, and 0.5 to 7.0 parts by weight of a bismuth compound in terms of Bi.sub.2O.sub.3, with respect to 100 parts by weight of the main component.

POLYMER COMPOSITION AND ARTICLE MADE FROM THE SAME
20220267592 · 2022-08-25 ·

The present application relates to a polymer composition comprising from 20 wt % to 30 wt % of a polycarbonate; from 40 wt % to 60 wt % of a polybutylene terephthalate; from 5 wt % to 30 wt % of a reinforcement fiber; from 1 wt % to 10 wt % of glass bubbles, and from 0.3 wt % to 2 wt % of transesterification inhibitor, all contents are based on the total weight of the composition. The polymer composition according to the present invention has improved adhesion to the metal (especially aluminum), even after annealing and anodizing processes are applied.

SOLID COMPOSITION
20220267210 · 2022-08-25 ·

A solid composition contains a first material and a powder and satisfies requirements 1 and 2. Requirement 1: |dA(T)/dT| satisfies 10 ppm/° C. or more at least at −200° C. to 1,200° C. A is (an a-axis lattice constant of a crystal in the powder)/(a c-axis lattice constant of a crystal in the powder), obtained from X-ray diffractometry of the powder. Requirement 2: C is 0.04 or more. C is (a log differential pore volume when a pore diameter of the solid composition is B in a pore distribution curve of the solid composition)/(a log differential pore volume corresponding to a maximum peak intensity in the pore distribution curve of the solid composition). B is (a pore diameter giving a maximum peak intensity in the pore distribution curve of the solid composition)/2. The pore distribution curve of the solid composition shows a relationship between the pore diameter and the log differential pore volume.

Method of metallizing ferrite ceramics and component comprising a metallized ferrite ceramic

The invention relates to a process for metallizing ferrite ceramics, which comprises the following steps: arrangement of a contact element composed of copper or a copper alloy on a surface of the ferrite ceramic, melting of the contact element at least in the region in which the contact element contacts the surface of the ferrite ceramic, and cooling of the contact element and the ferrite ceramic to below the melting point of copper or the copper alloy.

Green ceramic tapes and method for their fabrication
09718993 · 2017-08-01 · ·

“Green”, ceramic tapes intended as building blocks for making complex, fully ceramic components and devices for electronic-, lab-on-chip-, and sensing applications, the manufacture of which comprises in sequence: I. mixing of a ceramic “green” paste, II. homogenisation of a ceramic “green” paste, III. dimensioning and optionally structuring the ceramic “green” paste, IV. drying of the dimensioned and structured ceramic paste, in which: step iii) is performed in a combination of an extruder and a calender, the extruder being provided with a circular extrusion die, splitting and unfolding the extruded tube to a flat, continuous tape strip, using methylcellulose or derivatives thereof as binder, and, an additional step chosen among cutting and punching the thus dimensioned and optionally structured “green” paste, thereby making thick, “green” tapes. A method for its manufacture is also contemplated.

Porous sintered body and method of making the same
11247266 · 2022-02-15 · ·

[Object] There is provided a porous sintered body has a uniform porosity, a high level of freedom in body formation which allows formation into varieties shapes and various levels of porosity, and a very large surface area. [Solution] The porous sintered body includes: hollow cores which follow a vanished shape of an interlaced or otherwise structured fibriform vanisher material; sintered walls 226 which extend longitudinally of the cores and obtained by sintering a first sintering powder held around the cores; and voids formed between the sintered walls. The cores and the voids communicate with each other via absent regions formed in the sintered walls. The sintered walls have surfaces formed with a sintered microparticulate layer 232 made from a material containing a second sintering powder which has a smaller diameter than the first sintering powder, and has predetermined pores 231.