A sintered compact includes an alumina phase as a primary phase, and further includes an amorphous phase containing Si and Mn and a cordierite phase. The sintered compact has a porosity of higher than or equal to 1.1% and less than or equal to 5.0%. Preferably, I1/(I1+I2) is greater than or equal to 0.20 and less than or equal to 0.45, where I1 is the strength of the main peak of cordierite obtained by an XRD method, and I2 is the strength of the main peak of alumina.

A sandwich-structured dielectric material for pulse energy storage is provided as well as a preparation method thereof. Employing a sandwich structure and combining the properties of ceramic-glass materials prepares a high performance dielectric material for pulse energy storage, in which the ceramic dielectric is core-shell structured powder of Ba.sub.xSr.sub.1-xTiO.sub.3 coated with SiO.sub.2, and the glass material is alkali-free glass AF45, of which the chemical composition is 63% SiO.sub.2-12% BaO-16% B.sub.2O.sub.3-9% Al.sub.2O.sub.3. AF45 alkali-free glass paste is spin-coated on both sides of the ceramic and calcined to get a layer-structured material of glass-ceramic-glass.

A ceramic green sheet including a plurality of substrate forming regions. A barcode or a two-dimensional code is drawn in a portion of the ceramic green sheet. The barcode or the two-dimensional code is obtained by encoding one or more of the following information. Information relating to raw materials used when the ceramic green sheet is produced, information relating to molding conditions of the ceramic green sheet, information relating to a release agent used when a plurality of the ceramic green sheets are stacked, or a serial number.

Provided is a method for manufacturing a circuit board including: (a) preparing a mixture of a metal powder, an anti-sintering agent, and an activator; (b) immersing a dielectric substrate in the mixture; (c) forming a metal-containing layer on the surface of the dielectric substrate by heating the mixture under an inert atmosphere or under a reducing atmosphere; (d) forming a first metal layer on the metal-containing layer by electroless plating and forming a second metal layer thereon by electroplating; and (e) forming a metal pattern on the dielectric substrate, wherein the first metal layer includes Cu, Ni, Co, Au, Pd, or an alloy thereof, the second metal layer includes Cu, Ni, Fe, Co, Cr, Zn, Au, Ag, Pt, Pd, Rh, or an alloy thereof, and the method further includes performing heat treatment at least once after step (c).

Provided is a method for manufacturing a circuit board including: (a) preparing a mixture of a metal powder, an anti-sintering agent, and an activator; (b) immersing a dielectric substrate in the mixture; (c) forming a metal-containing layer on the surface of the dielectric substrate by heating the mixture under an inert atmosphere or under a reducing atmosphere; (d) forming a first metal layer on the metal-containing layer by electroless plating and forming a second metal layer thereon by electroplating; and (e) forming a metal pattern on the dielectric substrate, wherein the first metal layer includes Cu, Ni, Co, Au, Pd, or an alloy thereof, the second metal layer includes Cu, Ni, Fe, Co, Cr, Zn, Au, Ag, Pt, Pd, Rh, or an alloy thereof, and the method further includes performing heat treatment at least once after step (c).

A laminated ceramic sintered body board for an electronic device includes a ceramic sintered body board and a flattening film that is provided on an upper surface of the ceramic sintered body board and contains a thermally conductive filler, and the flattening film contains a thermally conductive filler.

A laminated ceramic sintered body board for an electronic device includes a ceramic sintered body board and a flattening film that is provided on an upper surface of the ceramic sintered body board and contains a thermally conductive filler, and the flattening film contains a thermally conductive filler.

A method for manufacturing a ceramic substrate that includes preparing a plurality of ceramic green sheets, at least one of the plurality of ceramic green sheets having a disappearance material that disappears by firing in a recessed portion formation planned region of the at least one of the plurality of ceramic green sheets; forming a mother multilayer body by laminating the plurality of ceramic green sheets such that the at least the one ceramic green sheet having the disappearance material is positioned on an uppermost layer of the mother multilayer body; and forming a recessed portion in the mother multilayer body before firing by pressing the recessed portion formation planned region of the mother multilayer body.

A continuous operation method is employed for the microwave high-temperature pyrolysis of a solid material containing an organic matter. The method includes the steps of mixing a solid material containing an organic matter with a liquid organic medium; transferring the obtained mixture to a microwave field; and in the microwave field, continuously contacting the mixture with a strong wave absorption material in an inert atmosphere or in vacuum. The strong wave absorption material continuously generates a high temperature under a microwave such that the solid material containing an organic matter and the liquid organic medium are continuously pyrolyzed to implement a continuous operation.

A porous composite material capable of generating an arc in a microwave field includes an inorganic porous framework and a carbon material loaded on the inorganic porous framework. The average pore size of the inorganic porous framework is 0.2-1000 μm. The porous composite material has an excellent mechanical performance, can generate an arc in a microwave field to quickly generate a high temperature, and thus can be used in fields such as microwave high-temperature heating, biomass pyrolysis, vegetable oil treatment, waste polymer material pyrolysis, petrochemical pyrolysis, carbon-fiber composite material recovery, waste treatment, VOC waste gas treatment, COD wastewater treatment, high-temperature catalysis, waste circuit board full-component recycling, and hydrogen preparation.