A ceramic electronic component includes a body including a dielectric layer and an internal electrode; and an external electrode disposed on the body and connected to the internal electrode. The dielectric layer includes a plurality of crystal grains and a grain boundary disposed between adjacent crystal grains. A ratio (C2/C1) of an Mg content (C2) of the grain boundary to an Mg content (C1) of at least one of the plurality of crystal grains is 3 or more.

A method of manufacturing a multilayer ceramic capacitor includes printing an internal electrode pattern on a dielectric layer, forming a dielectric pattern in a region other than a region in which the internal electrode pattern is printed, laminating dielectric layers to form a multilayer body, exposing the internal electrode pattern and the dielectric pattern from a side surface of the multilayer body, removing at least a portion of the exposed dielectric pattern, and forming a dielectric gap layer on the side surface.

A high permittivity antiferroelectric composition and a manufacturing method thereof aim to provide an antiferroelectric, which has a Pb.sub.xLa.sub.1-x([Zr.sub.1-YSn.sub.Y].sub.ZTi.sub.1-Z) composition, is sintered at low temperatures, and has a high density and a high permittivity.

A dielectric composition includes dielectric particles. At least one of the dielectric particles include a main phase and a secondary phase. The main phase has a main component of barium titanate. The secondary phase exists inside the main phase and has a higher barium content than the main phase.

The present disclosure relates to porous ceramic articles and a method of making the same. The porous ceramic articles have a porosity (P) as a fraction in a range of about 0.3 to about 0.7; a permeability factor PQ>0.025, wherein PQ is (K.sub.bulk)/(P.Math.d.sub.50.sup.2), K.sub.bulk being bulk permeability in Darcy, and d.sub.50 being the mean pore size in micrometers (μm); a tortuosity in a range of about 1.8 to 3; and a median pore size diameter d.sub.50 in a range of about 10 μm to about 35 μm. The porous ceramic articles can have an interconnected bead microstructure comprising beads and bead connections, PQ is directly proportional to bead size, and wherein in a random cross section through the body, the beads appear as globular portions.

A method of producing a multi-layer ceramic electronic component includes: forming a base film formed from an electrically conductive material on a surface of a ceramic body including internal electrodes laminated and drawn to the surface in such a manner that the base film is connected to the internal electrodes; forming a first nickel film on the base film by an electrolytic plating method; performing, after forming the first nickel film, heat treatment in a weakly reducing atmosphere at a temperature equal to or higher than a temperature at which the first nickel film is recrystallized; and forming a second nickel film on the first nickel film, on which the heat treatment is performed, by an electrolytic plating method.

Provided is a multilayer ceramic capacitor having dielectric layers and internal electrode layers laminated alternately on one another. Each internal electrode layer comprises a common ceramic material containing 3 to 25% by weight of rare earth elements, and through the rare earth elements, high dielectric layers are formed on the interfaces between the dielectric layers and the internal electrode layers.

A ceramic electronic component includes a multilayer chip having a substantially rectangular parallelepiped shape and including a first multilayer structure and a second multilayer structure disposed on each of top and bottom faces of the first multilayer structure, the first multilayer structure including first ceramic dielectric layers having a first width in a first direction in which side faces of the multilayer chip are opposite to each other, the second multilayer structure including second internal electrode layers having a second width less than the first width in the first direction, and a pair of external electrodes formed from the respective two edge faces to at least one of side faces of the multilayer chip, wherein main components of the first and second internal electrode layers differ from a main component of the external electrodes.

Methods of flash sintering have been developed in which particle are initially coated with thin layers by atomic layer deposition (ALD). Examples are provided in which 8 mol % yttria-stabilized zirconia (8YSZ) particles are coated with small quantities of Al.sub.2O.sub.3 by particle atomic layer deposition (ALD). Sintered materials that result from the process have been characterized. Sintered materials having unique characteristics are also described.

A multi-layer ceramic electronic component includes: a ceramic body including internal electrodes laminated and drawn to a surface of the ceramic body; and an external electrode including: a base film disposed on the surface of the ceramic body, connected to the internal electrodes, and formed from an electrically conductive material, a first nickel film disposed on and in contact with the base film in a thickness direction of the base film, and a second nickel film disposed on the first nickel film in a thickness direction of the first nickel film.