A module and a process for forming a monolithic substantially closed-porosity silicon carbide fluidic module having a tortuous fluid passage extending through the module, the tortuous fluid passage having an interior surface, the interior surface having a surface roughness in the range of from 0.1 to 10 μm Ra. The process includes positioning a positive fluid passage mold within a volume of silicon carbide powder, the powder coated with a binder; pressing the volume of silicon carbide powder with the mold inside to form a pressed body; heating the pressed body to remove the mold; and sintering the pressed body.

The present invention is directed to a method for producing a silicon nitride sintered material, the method including heating a molded article, which contains a silicon nitride powder having a β phase ratio of 80% or more, a dissolved oxygen content of 0.2% by mass or less, and a specific surface area of 5 to 20 m.sup.2/g, and a sintering auxiliary containing a compound having no oxygen bond, and which has an overall oxygen content controlled to be 1 to 15% by mass and an aluminum element overall content controlled to be 800 ppm or less, to a temperature of 1,200 to 1,800° C. in an inert gas atmosphere under a pressure of 0 MPa.Math.G or more and less than 0.1 MPa.Math.G to sinter the silicon nitride.

In the present invention, there can be provided a method for producing a silicon nitride sintered material, which method is advantageous in that a silicon nitride sintered material having high thermal conductivity can be obtained even when using a silicon nitride powder having a high β phase ratio and conducting calcination under normal pressure or substantially normal pressure.

A piezoelectric thin film 3 contains a metal oxide, the metal oxide contains bismuth, potassium, titanium, iron and element M, the element M is at least one of magnesium and nickel, at least a part of the metal oxide is a crystal having a perovskite structure, and a (001) plane, a (110) plane or a (111) plane of the crystal is oriented in a normal direction dn of the surface of the piezoelectric thin film 3.

A dry backfill for producing a basic molded heavy-clay refractory product, to such a product and a method for producing the same, to a lining of an industrial furnace, and to an industrial furnace.

Disclosed herein are power electronic modules formed by directly bonding a heat sink to a dielectric substrate using transition liquid phase bonding.

The present invention relates to a SiC composite and a method for manufacturing the same. More particularly, the present invention relates to a slurry composition for ceramic matrix composites which can not only reduce the number of precursor impregnation pyrolysis (PIP) cycles but also be useful in the PIP process to increase hardness, thermal stability, and relative density.

Provided is a ZrO.sub.2—CaO—C based refractory material which is capable of maintaining high adhesion resistance over a long period of time, while exhibiting significant slaking resistance, and suppressing self-fluxing, i.e., exhibiting corrosion-erosion resistance. The refractory material comprises a CaO—ZrO.sub.2 composition containing a CaO component in an amount of 40% by mass to 60% by mass, wherein a mass ratio of the CaO component to a ZrO.sub.2 component is 0.67 to 1.5, and wherein the CaO—ZrO.sub.2 composition includes a eutectic microstructure of CaO crystals and CaZrO.sub.3 crystals, wherein a width of each of the CaO crystals observable in a cross-sectional microstructure is 50 μm or less.

Disclosed herein is a sintered ceramic body comprising from 90% to 99.9% by volume of polycrystalline yttrium aluminum garnet (YAG) as measured using XRD and image processing methods and a volumetric porosity of from 0.1 to 4% as calculated from density measurements performed in accordance with ASTM B962-17. The sintered ceramic body may have a total purity of 99.99% and greater and a grain size of from 0.3 to 8 μm. A method of making the sintered ceramic body is also disclosed.

Disclosed are: damage-resistant ECMCs that need to work and remain elastic between minus 120° C. and positive 300° C.; ECMCs that need to be able to contain a flame of 1900° C. for more than 90 minutes; and composite structures, especially highly stressed structures. One of the characteristic problems of ceramic matrices is their fragility. Indeed, when a fracture starts, it propagates easily in the matrix. Disclosed are elastic ceramic matrix composites (ECMCs), for which: the ceramic matrix is split into solid “ceramic microdomains” (CMDs); the CMDs are connected to one another by a dense network of “elastic microelements” (EMEs); and the bonds between the EMEs and the CMDs are strong chemical bonds, preferably covalent.

A ferrite sintered magnet 100 comprises M-type ferrite crystal grains 4 having a hexagonal crystal structure, two-crystal grain boundaries 6a formed between two of the M-type ferrite crystal grains 4, and multiple-crystal grain boundaries 6b surrounded by three or more of the M-type ferrite crystal grains 4. This ferrite sintered magnet 100 contains at least Fe, Ca, B, and Si, and contains B in an amount of 0.005 to 0.9 mass % in terms of B.sub.2O.sub.3, the two-crystal grain boundaries 6a and the multiple-crystal grain boundaries 6b contain Si and Ca, and in a cross-section parallel to a c-axis of the ferrite sintered magnet, when the number of multiple-crystal grain boundaries having a maximum length of 0.088 or more and less than 0.49 μm per cross-sectional area of 76 μm.sup.2 is P, P is 8 or more.