The present disclosure relates to a multilayer ceramic substrate preparation method. The multilayer ceramic substrate preparation method according to the present disclosure includes firing a plurality of ceramic green sheets, to create a plurality of ceramic thin films; forming a via hall in each of the plurality of ceramic thin films; filling the via hall of the plurality of ceramic thin films with conductive paste, and heat treating the via hall filled with the conductive paste, to form a via electrode; printing a pattern on a cross section of each of the plurality of ceramic thin films, and heat treating the printed pattern, to form an inner electrode; applying a bonding agent on the cross section of each of the ceramic thin films excluding an uppermost ceramic thin film of the plurality of ceramic thin films; aligning and laminating each of the plurality of ceramic thin films such that each of the plurality of ceramic thin films is electrically connected through the via electrode and the inner electrode; and firing or heat treating the laminated plurality of ceramic thin films.

Production of multilayered ceramic missile radomes with wide frequency band and high electromagnetic permeability through three-dimensional printing technology and the use of glass inter-layer materials to minimize defects caused by thermo-mechanical incompatibility of adjacent layers during sintering are provided. The three dimensional printing of the multilayered ceramic missile radomes provide an automated, operator-independent and repeatable manufacturing technique to produce wide band ceramic missile radomes.

Adhesive compositions and methods for bonding materials with different thermal expansion coefficients is provided. The adhesive is formulated using a flux material, a low flux material, and a filler material, where the filler material comprises particulate from at least one of the two components being bonded together. A thickening agent can also be used as part of the adhesive composition to aid in applying the adhesive and establishing a desired bond thickness. The method of forming a high strength bond using the disclosed adhesive does not require the use of intermediary layer or the use of high cure temperatures that could damage one or both of the components being bonded together.

Methods of forming ceramic matrix composite structures include joining at least two lamina together to form a flexible ceramic matrix composite structure. Ceramic matrix composite structures include at least one region of reduced inter-laminar bonding at a selected location between lamina thereof. Thermal protection systems include at least one seal comprising a ceramic matrix composite material and have at least one region of reduced inter-laminar bonding at a selected location between lamina used to form the seal. Methods of forming thermal protection systems include providing one or more such seals between adjacent panels of a thermal protection system.

Provided is a composite ceramic atomizer, comprising a first main body and a second main body, wherein the first main body and the second main body are integrally formed by using a glazing and sealing process, and the first main body is connected to the second main body by means of a glazed surface formed by glazing. The glazed surface completely or partially covers a surface at the joint between the first main body and the second main body. The first main body comprises a heating carrier and a conductive path for heating, the conductive path being formed on a surface of or inside the heating carrier and having a first contact part and a second contact part connected to a power supply. The second main body is used for liquid conduction.

A method of bonding includes applying a glass composition to at least a first material surface. The glass composition includes a glass powder and a solvent. The first material surface is disposed onto a second material surface. An elevated temperature is applied to the first material surface and the second material surface to form a bond between the first material surface and the second material surface. The first material surface and the second material surface are compressed under an isostatic pressure.

Adhesive compositions and methods for bonding materials with different thermal expansion coefficients is provided. The adhesive is formulated using a flux material, a low flux material, and a filler material, where the filler material comprises particulate from at least one of the two components being bonded together. A thickening agent can also be used as part of the adhesive composition to aid in applying the adhesive and establishing a desired bond thickness. The method of forming a high strength bond using the disclosed adhesive does not require the use of intermediary layer or the use of high cure temperatures that could damage one or both of the components being bonded together.

The invention relates to a method for joining a ceramic friction element (11) to a piezoelectric element (1), comprising, among other things, the following steps: pressing (14) a joining surface (10) of the friction element and a contact surface (9) of the piezoelectric element against each other with a low-melting glass mass (12) arranged therebetween and maintaining the pressing force for all subsequent steps; heating (17) the piezoelectric element and the friction element to a defined temperature above the Curie point of the piezoceramic material of the piezoelectric element and above the melting point of the low-melting glass mass; thereafter, while maintaining the temperature, applying an electric polarization voltage Up to electrodes of the piezoelectric element; removing the polarization voltage after the Curie point has been fallen below; and cooling the piezoelectric element and the friction element to room temperature without an electric voltage being applied to the electrodes.

Fused, monolithic 3-D products of high-SiO2-containing body materials, called FHD/S, cut to pattern, mating surfaces honed or polished, assembled with mating surfaces in contact, and fusion fired until the contacting parts fuse without added flux. Fused FHD/S products may be used unglazed, or glaze may be applied to selected fused surfaces and then glaze fired. FHD/S body materials may include colorants so that the fused parts exhibit color contrast and variation when used without glazing. Examples include countertops having integral fused vertical back-splashes and front edges, and bowls fused to openings. The inventive 3-D monolithic fused FHD/S products are produced in standard sizes or as custom-fit interior and exterior products that are stain resistant, moisture impervious, UV resistant, acid resistant, dimensionally stable, abrasion and impact resistant, and may be glazed to produce unique decorative and utilitarian surfaces in a wide range of colors and textures, including artistic, one-of-a-kind 3-D works.

One aspect is a logic power module, with at least one logic component, at least one power component and a substrate. The logic element and the power component are provided in separate areas on the substrate. The logic component on the substrate is provided by thick printed copper; and the power component is provided by a metal-containing thick-film layer, and, provided thereon, a metal foil.