An electronic device housing, an electronic device and a compound body are provided. The electronic device housing comprises a frame; a sealing layer, disposed on at least a part of an outer surface of the frame, and including a plurality of sub-sealing layers laminated in sequence; and a back case, attached to the frame by the sealing layer, wherein two adjacent sub-sealing layers have different compositions.

A unitary ceramic component is provided that includes a first ceramic component; a second ceramic component; and a series-hybrid joint coupling the first ceramic component to the second ceramic component. The series-hybrid joint includes a first bonding interface coupling the first ceramic component and the second ceramic component and a second bonding interface coupling the first ceramic component and the second ceramic component. The first bonding interface exhibits properties that are different from the second bonding interface.

A system for producing chemicals, such as, ethylene or gasoline, at high temperature (above 1100 degrees C.) having a feedstock source. The system includes a chemical conversion portion connected with the feedstock source to receive feedstock and convert the feedstock to ethylene or gasoline. The conversion portion includes a coil array and a furnace that heats the feedstock to temperatures in excess of 1100 C. or 1200 C. or even 1250 C. or even 1300 C. or even 1400 C. A method for producing chemicals, such as ethylene or gasoline, at high temperature.

A system for producing chemicals, such as, ethylene or gasoline, at high temperature (above 1100 degrees C.) having a feedstock source. The system includes a chemical conversion portion connected with the feedstock source to receive feedstock and convert the feedstock to ethylene or gasoline. The conversion portion includes a coil array and a furnace that heats the feedstock to temperatures in excess of 1100 C. or 1200 C. or even 1250 C. or even 1300 C. or even 1400 C. A method for producing chemicals, such as ethylene or gasoline, at high temperature.

An assembly including a ceramic body. The assembly comprises a tungsten coupling attached to the ceramic body with a first joint that forms a first helium tight seal between the ceramic body and the tungsten coupling and where the first helium tight seal maintains its integrity at a temperature over 400 C. The assembly includes a metal body attached to the tungsten coupling with a second joint that forms a second helium tight seal between the metal body and the tungsten coupling and where the second helium tight seal maintains its integrity at a temperature over 400 C. A method. A mixture. A coupling.

Process for the moderately refractory assembly of at least two articles made of silicon carbide-based materials by non-reactive brazing in an oxidizing atmosphere, in which the articles are placed in contact with a non-reactive brazing composition and the assembly formed by the articles and the brazing composition is heated in an oxidizing atmosphere at a brazing temperature sufficient to melt the brazing composition so as to form a moderately refractory joint, wherein the non-reactive brazing composition is a composition A composed of silica (SiO.sub.2), alumina (Al.sub.2O.sub.3) and calcium oxide (CaO), or alternatively a composition B composed of alumina (Al.sub.2O.sub.3), calcium oxide (Cao) and magnesium oxide (MgO). Brazing suspension, paste comprising a powder of said brazing composition and an organic binder. Refractory joint and assembly.

A positive temperature coefficient ceramic thermistor element includes a sintered thermosensitive ceramic piece that uses lead barium titanate as a base, as well as metal ohmic electrodes which are positioned on two side surfaces of the thermosensitive ceramic piece. The thermistor element has a microporous channel barrier layer, and includes a glass sealing layer which wraps the outer surface of the thermosensitive ceramic piece, or an organic matter sealant which fills and blocks micro-pores in the surfaces of the metal ohmic electrodes combined on the two side surfaces of the thermosensitive ceramic piece and, at the same time, blocks gaps in the surfaces of areas, that do not have the metal ohmic electrodes, of a peripheral edge of the thermosensitive ceramic piece.

Adhesive compositions and methods for bonding materials with different thermal expansion coefficients is provided. The adhesive is formulated using a flux material, a low flux material, and a filler material, where the filler material comprises particulate from at least one of the two components being bonded together. A thickening agent can also be used as part of the adhesive composition to aid in applying the adhesive and establishing a desired bond thickness. The method of forming a high strength bond using the disclosed adhesive does not require the use of intermediary layer or the use of high cure temperatures that could damage one or both of the components being bonded together.

Disclosed herein are sealed devices comprising at least one cavity containing at least one quantum dot or at least one laser diode are also disclosed herein. The sealed devices can comprise a glass substrate sealed to an inorganic substrate, optionally via a sealing layer, the seal extending around the at least one cavity. Display and optical devices comprising such sealed devices are also disclosed herein, as well as methods for making such sealed devices.

A method of integrally bonding a glass element to a support element, the method comprising a step of inserting at least one contact element into a contact recess in a surface of the support element. In addition, the method comprises a step of placing the glass element on a portion of the contact element which portion protrudes beyond the surface, and a step of locally heating the contact element in order to connect the glass element to the support element via the contact element. The method also comprises a step of coating at least a part of the contact recess with a separating layer prior to the step of insertion.