C04B2237/12

HYDROPHOBIC MATERIALS INCORPORATING RARE EARTH ELEMENTS AND METHODS OF MANUFACTURE

This invention relates generally to an article that includes a base substrate, an intermediate layer including at least one element or compound selected from titanium, chromium, indium, zirconium, tungsten, and titanium nitride on the base substrate, and a hydrophobic coating on the base substrate, wherein the hydrophobic coating includes a rare earth element material (e.g., a rare earth oxide, a rare earth carbide, a rare earth nitride, a rare earth fluoride, and/or a rare earth boride). An exposed surface of the hydrophobic coating has a dynamic contact angle with water of at least about 90 degrees. A method of manufacturing the article includes providing the base substrate and forming an intermediate layer coating on the base substrate (e.g., through sintering or sputtering) and then forming a hydrophobic coating on the intermediate layer (e.g., through sintering or sputtering).

Ceramic Insulator

Various embodiments include a method for producing a ceramic insulator for a high-voltage or medium-voltage switching system comprising: attaching a base material for an equipotential layer between two axially symmetrical ceramic structural elements; disposing the electrically conductive equipotential layer between the two ceramic structural elements; and joining the two ceramic structural elements to form a unitary body along a symmetry axis of a first of the two elements.

Copper/ceramic assembly, insulated circuit board, method for producing copper/ceramic assembly, and method for producing insulated circuit board

This A copper/ceramic bonded body includes: a copper member made of copper or a copper alloy; and a ceramic member made of oxygen-containing ceramics, wherein the copper member and the ceramic member are bonded to each other, a magnesium oxide layer is formed on a ceramic member side between the copper member and the ceramic member, and an active metal oxide phase composed of an oxide of one or more active metals selected from Ti, Zr, Nb, and Hf is dispersed inside a copper layer in contact with the magnesium oxide layer.

GALLIUM NITRIDE SINTERED BODY OR GALLIUM NITRIDE MOLDED ARTICLE, AND METHOD FOR PRODUCING SAME

The present invention provides a gallium nitride sintered body and a gallium nitride molded article which have high density and low oxygen content without using a special apparatus. According to the first embodiment, a gallium nitride sintered body, which is characterized by having density of 2.5 g/cm.sup.3 to less than 5.0 g/cm.sup.3 and an intensity ratio of the gallium oxide peak of the (002) plane to the gallium nitride peak of the (002) plane of less than 3%, which is determined by X-ray diffraction analysis, can be obtained. According to the second embodiment, a metal gallium-impregnated gallium nitride molded article, which is characterized by comprising a gallium nitride phase and a metal gallium phase that exist as separate phases and having a molar ratio, Ga/(Ga+N), of 55% to 80%, can be obtained.

CONTAINER AND METHOD FOR CLOSING AN OPENING OF CONTAINER

A container comprising: a container body that includes a wall portion separating inside and outside and is formed of a long-fiber-reinforced silicon-carbide composite material obtained by combining monofilaments of silicon carbide with a silicon carbide matrix, the wall portion having a thickness equal to a specific dimension; and a lid configured to close an opening of the container body, formed of a material containing at least silicon carbide, and equipped with such a wall portion separating inside and outside that thickness is within a range of 1 to 3 times the specific dimension.

Copper/ceramic bonded body, insulating circuit substrate, copper/ceramic bonded body production method, and insulating circuit substrate production method

A copper/ceramic bonded body includes: a copper member made of copper or a copper alloy; and a ceramic member made of an aluminum oxide, wherein the copper member and the ceramic member are bonded to each other, a magnesium oxide layer is provided on a ceramic member side of an interface between the copper member and the ceramic member; and a Mg solid solution layer is provided between the magnesium oxide layer and the copper member and contains Mg in a state of a solid solution in a Cu primary phase.

Cemented carbide body and method for manufacturing the cemented carbide body
10226820 · 2019-03-12 · ·

A method for manufacturing a cemented carbide body includes the steps of forming a first part of a first powder composition comprising a first carbide and a first binder phase, sintering the first part to full density in a first sintering operation, forming a second part of a second powder composition comprising a second carbide and a second binder phase, sintering the second part to full density in a second sintering operation, bringing a first surface of the first part and a second surface of the second part in contact, and joining the first and second surface in a heat treatment operation.

Polycrystalline diamond compacts having parting compound and methods of making the same
10213835 · 2019-02-26 · ·

Polycrystalline diamond compacts having parting compound within the interstitial volumes are disclosed herein. In one embodiment, a polycrystalline diamond compact includes a polycrystalline diamond body having a plurality of diamond grains bonded together in diamond-to-diamond bonds, interstitial volumes positioned between the adjacent diamond grains, and a parting compound positioned in at least a portion of the interstitial volumes of the polycrystalline diamond body.

Method for manufacturing bonded body and method for manufacturing power-module substrate

A method for manufacturing a power-module substrate includes a lamination step of laminating a ceramic member and a copper member through an active metal material and a filler metal having a melting point of 710 C. or lower, and a heating treatment step of heating the ceramic member and the copper member laminated together.

DEVICES COMPRISING TRANSPARENT SEALS AND METHODS FOR MAKING THE SAME

Disclosed herein are methods for making a sealed device (200), the methods comprising positioning a sealing layer comprising at least one metal between a first glass substrate (201a) and a second substrate (201b) to form a sealing interface; and directing a laser beam operating at a predetermined wavelength onto the sealing interface to form at least one seal (207) between the first and second substrates and to convert the at least one metal to metal nanoparticles. Sealed devices having a seal comprising metal nanoparticles having a particles size of less than about 50 nm are also disclosed herein, as well as display devices comprising such sealed devices.