A method for fabricating assemblies includes providing first and second components that include ceramic, metal, or composite; positioning a multiphase joining interlayer between the first and second components, wherein the joining interlayer includes a first phase that melts at a first temperature and a second phase interspersed throughout the first phase, and wherein the second phase melts at a second temperature that is lower than the melting temperature of the first phase; and heating the joining interlayer to a temperature in the range of 725 C. to 1450 C. for a predetermined period of time to soften the first phase and melt the second phase, wherein the first phase remains in a solid or a semi-solid state, and wherein the second phase segregates to the boundaries of the first phase and transforms the joining interlayer into a substantially porosity-free adherent material that joins the first component to the second component.

A substrate support assembly including a ceramic body includes an upper surface. The upper surface includes a sealing ring at a periphery of the ceramic body, a plurality of mesas and a plurality of recessed features, wherein the plurality of recessed features are formed between the plurality of mesas. The ceramic body further includes one or more through holes to receive a thermally conductive gas, wherein molecules of the thermally conductive gas are to collide with the walls of the plurality of recessed features to increase an effective thermal accommodation coefficient (TAC) associated with the upper surface and increase an effective thermal conductivity of the thermally conductive gas as a result of the increase in the effective TAC associated with the upper surface.

The invention relates to a method for connecting at least two components (1, 2), comprising the following steps: A) providing at least a first component (1) and a second component (2), B) applying at least one donor layer (3) to the first and/or the second component (1, 2), wherein the donor layer (3) is enriched with oxygen (31), C) applying a metal layer (4) to the donor layer (3), the first or the second component (1, 2), D) heating at least the metal layer (4) to a first temperature (T1) such that the metal layer (4) is melted and the first component (1) and the second component (2) are connected to one another, and E) heating the arrangement to a second temperature (T2) such that the oxygen (31) passes from the donor layer (3) into the metal layer (4) and the metal layer (4) is converted to form a stable metal oxide layer (5), wherein the metal oxide layer (5) has a higher melting temperature than the metal layer (4), wherein at least the donor layer (3) and the metal oxide layer (5) connect the first component (1) and the second component (2) to one another.

A coating used in a vapor-oxidative atmosphere has a first layer including SIALON and a second layer covering the first layer and being exposed to the atmosphere, the second layer including mullite, wherein the first layer and the second layer get in contact with each other.

The invention relates to a multilayer cladding including a combination of ceramic and metallic components. The multilayer coating includes an inner layer, an intermediate layer and an outer layer. The inner layer can form the cladding structure, the intermediate layer can include a ceramic composite or ceramic-containing composite composed of interlocking woven or braided fibers, e.g., fiber tows wrapped on the inner layer to form a woven structure, and a matrix material, and the outer can be composed of metal or metal alloy, such as, in the form of a coating. The multilayer cladding is effective to protect contents of the cladding structure from exposure to high temperature environments.

An improved method of sealing a ceramic part to a solid part made of ceramic, metal, cermet or a ceramic coated metal is provided. The improved method includes placing a bond agent comprising an Al.sub.2O.sub.3 and SiO.sub.2 based glass-ceramic material and organic binder material on adjoining surfaces of the ceramic part and the solid part. The assembly is heated to a first target temperature that removes or dissolves the organic binder material from the bond agent and the assembly is subjected to a second induction heating step at a temperature ramp rate of between about 100? C. and 200? C. per minute to temperatures where the glass-ceramic material flows and wets the interface between adjoining surfaces. The assembly is rapidly cooled at a cooling rate of about 140? C. per minute or more to induce nucleation and re-crystallization of the glass-ceramic material to form a dense, durable and gas-tight seal.

A ceramic structural body includes a substrate that is composed of a ceramic(s), a hole that is opened on a surface of the substrate, and a seal material that is positioned at an opening portion of the hole.

A transaction card includes a card body that may comprise a card body comprising a ceramic material, the card body including a primary surface and a first mating surface. A card backer comprises a metallic material and includes a secondary surface and a second mating surface. A portion of the first mating surface and a portion of the second mating surface are coupled together.

A method of producing a bonded body is disclosed in which a ceramic member made of ceramics and a Cu member made of Cu or a Cu alloy are bonded to each other, the method including: a laminating step of laminating the ceramic member and the Cu member in a state where a CuP-based brazing filler material containing 3 mass % to 10 mass % of P and an active metal material are interposed therebetween; and a heating step of heating the ceramic member and the Cu member which are laminated.

An article comprises a plasma resistant ceramic material comprising 40-60 mol % of Y.sub.2O.sub.3, 35-50 mol % of ZrO.sub.2, and 10-20 mol % of Al.sub.2O.sub.3.