An article comprises a plasma resistant ceramic material comprising 80-90 mol % of Y.sub.2O.sub.3, over 0 mol % to 20 mol % of ZrO.sub.2, and 10-20 mol % of Al.sub.2O.sub.3.

A plasma resistant ceramic article comprises a plasma resistant ceramic material comprising 60-80 mol % of Y.sub.2O.sub.3, above 0 mol % to 9 mol % of ZrO.sub.2, and 20-40 mol % of Al.sub.2O.sub.3.

An article comprises a plasma resistant ceramic material comprising 40 mol % to less than 100 mol % of Y.sub.2O.sub.3, above 0 mol % to 60 mol % of ZrO.sub.2, and above 0 mol % to 5 mol % of Al.sub.2O.sub.3.

A method of manufacturing a ceramic substrate includes the steps of preparing a ceramic paste in which a powder of at least one of a metal boride and a metal silicide is added to a raw material powder of a glass ceramic, applying the ceramic paste to a green sheet which is to become a ceramic layer after firing, applying a conductor paste which is to become a conductor trace after firing to the ceramic paste having been applied to the green sheet, and firing the green sheet carrying the ceramic paste and the conductor paste applied thereto.

A method of manufacturing a circuit substrate includes the steps of preparing a conductor paste in which a powder of at least one of a metal boride and a metal silicide is added to a powder of silver (Ag), applying the conductor paste to a surface of a ceramic substrate which has been fired, applying a glass paste to the surface of the ceramic substrate after applying the conductor paste, firing the conductor paste applied to the surface so as to form a conductor trace, and firing the glass paste applied to the surface so as to form a coating layer.

A ceramic substrate includes a ceramic layer mainly formed of a glass ceramic and a conductor trace mainly formed of silver (Ag). In an adjacent region located adjacent to the conductor trace, the concentration of boron atoms (B) contained in the ceramic layer increases toward the conductor trace.

A pressure sensor, including a platform of ceramic, a measuring membrane arranged on the platform, a pressure measuring chamber enclosed in the platform under the measuring membrane, and at least one metal body connected with the platform via a pressure-tight, preferably elastomer free, mechanical connection. Thermomechanical stresses arising from the connection are reduced by features including that the pressure-tight, mechanical connection occurs via an adapting body arranged between the platform and the metal body. The adapting body has a thermal expansion coefficient, which rises in direction (z) extending from the platform to the metal body from a coefficient of expansion corresponding to a thermal coefficient of expansion of the ceramic of the platform to a coefficient of expansion corresponding to the thermal coefficient of expansion of the metal body, and the adapting body is connected by a first joint with the platform and by a second joint with the metal body.

An improved ceramic material for heat insulation with selection of specific stabilizers and adapted proportions, includes zirconium oxide with 0.2 wt. % to 8.0 wt. % of the base stabilizers: yttrium oxide (Y.sub.2O.sub.3), hafnium oxide (HfO.sub.2), cerium oxide (CeO.sub.2), calcium oxide (CaO), and/or magnesium oxide (MgO), wherein at least yttrium oxide (Y.sub.2O.sub.3) is used, and optionally at least one of the additional stabilizers: 0.2 wt. % to 20 wt. % of erbium oxide (Er.sub.2O.sub.3) and/or ytterbium oxide (Yb.sub.2O.sub.3).

A transaction card includes a card body that may comprise a card body comprising a ceramic material, the card body including a primary surface and a first mating surface. A card backer comprises a metallic material and includes a secondary surface and a second mating surface. A portion of the first mating surface and a portion of the second mating surface are coupled together.

A transaction card includes a card body that may comprise a card body comprising a ceramic material, the card body including a primary surface and a first mating surface. A card backer comprises a metallic material and includes a secondary surface and a second mating surface. A portion of the first mating surface and a portion of the second mating surface are coupled together.