Patent classifications
C04B2237/52
Target material for sputtering and method for manufacturing same
Provided is a sputtering target having extremely low occurrence of arcing or nodules, and a method for manufacturing such a sputtering target. A flat plate-shaped or cylindrical target material (3, 13) is obtained by processing a material composed of an oxide sintered body. In doing so, a grindstone having a specified grade is used to perform rough grinding of a surface of the material that will become a sputtering surface (5, 15) one or more times in accordance to the grade of the grindstone, after which zero grinding is performed one or more times so that the surface roughness of the sputtering surface (5, 15) has an arithmetic mean roughness Ra of 0.9 m or more, a maximum height Rz of 10.0 m or less, and Rz.sub.JIS roughness of 7.0 m or less. A sputtering target (1, 11) is obtained by bonding the obtained target material (3, 13) to a backing body (2, 12) by way of a bonding layer (4, 14).
Hybrid metal composite structures, rocket cases, and related methods
A method of forming a hybrid metal composite structure including at least one metal ply. The method includes forming at least one metal ply, forming the at least one metal ply comprising forming at least one perforation in the at least one metal ply, abrasively blasting at least one surface of the at least one metal ply to coarsen the at least one surface of the metal ply, and exposing the at least one metal ply to at least one of an acid or a base. The method further includes disposing at least one fiber composite material structure adjacent the at least one metal ply. Related methods of forming a portion of a rocket case and related hybrid metal composite structures are also disclosed.
Method for producing hermetic package
A technical object of the present invention is to devise a method by which bonding strength between an element base and a sealing material layer can be increased without thermal degradation of a member to be housed inside, to thereby improve long-term reliability of a hermetic package. A method of producing a hermetic package of the present invention includes the steps of: preparing a ceramic base and forming a sealing material layer on the ceramic base; preparing a glass substrate and arranging the ceramic base and the glass substrate so that the glass substrate is brought into contact with the sealing material layer on the ceramic base; and irradiating the sealing material layer with laser light from a glass substrate side to seal the ceramic base and the glass substrate with each other through intermediation of the sealing material layer, to thereby provide a hermetic packages.
METHOD OF PRESSURE SINTERING AN ENVIRONMENTAL BARRIER COATING ON A SURFACE OF A CERAMIC SUBSTRATE
This disclosure provides a method of pressure sintering an environmental barrier coating on a surface of a ceramic substrate to form an article. The method includes the steps of etching the surface of the ceramic substrate to texture the surface, disposing an environmental barrier coating on the etched surface of the ceramic substrate wherein the environmental barrier coating includes a rare earth silicate, and pressure sintering the environmental barrier coating on the etched surface of the ceramic substrate in an inert or nitrogen atmosphere at a pressure of greater than atmospheric pressure such that at least a portion of the environmental barrier coating is disposed in the texture of the surface of the ceramic substrate thereby forming the article.
Shaped composite ply layups and methods for shaping composite ply layups
Ply layups and methods for forming composite components are provided. For example, a method for forming a composite component comprises laying up a plurality of composite plies to form a composite ply layup; partially processing the composite ply layup to form a green state layup; machining the green state layup; assembling the green state layup with one or more sub-assemblies; and processing the green state layup and the one or more sub-assemblies to form the composite component. In an exemplary embodiment, the composite component is a turbine nozzle airfoil. Another exemplary method comprises laying up a plurality of composite plies to form a composite ply layup; compacting the composite ply layup to form a green state layup; machining the green state layup; assembling the green state layup with one or more sub-assemblies; and processing the green state layup and the one or more sub-assemblies to form the composite component.
HIGH TEMPERATURE OXIDATION PROTECTION FOR COMPOSITES
An oxidation protection system disposed on a substrate is provided, which may comprise a base layer comprising a first pre-slurry composition comprising a first phosphate glass composition, and/or a sealing layer comprising a second pre-slurry composition comprising a second phosphate glass composition and a strengthening compound comprising boron nitride, a metal oxide, and/or silicon carbide.
Ceramic/aluminum joined body, insulating circuit board, power module, LED module, and thermoelectric module
A joined body according to the invention is a ceramic/aluminum joined body including: a ceramic member; and an aluminum member made of aluminum or an aluminum alloy, in which the ceramic member and the aluminum member are joined to each other, the ceramic member is formed of silicon nitride containing magnesium, and a joining layer in which magnesium is contained in an aluminum-silicon-oxygen-nitrogen compound is formed at a joining interface between the ceramic member and the aluminum member.
Bonded substrate and manufacturing method of bonded substrate
A second main surface of the copper plate is opposite a first main surface of the copper plate, and is bonded to a silicon nitride ceramic substrate by the bonding layer. A first portion and a second portion of an end surface of the copper plate form an angle of 135 to 165 on an outside of the copper plate. An extended plane of the first portion and the second main surface form an angle of 110 to 145 a side where the second portion is located. A distance from the second main surface to an intersection of the first portion and the second portion in a direction of a thickness of the copper plate is 10 to 100 m. The second main surface extends beyond the extended plane of the first portion by a distance of 10 m or more.
Composite Component Modifications
Composite components and methods for adding a composite material to a composite component are provided. For example, a method comprises positioning a composite material segment against the composite component to form a component layup; applying an insulating material around at least a portion of the component layup to form an insulated layup; and densifying the insulated layup, where the composite component was previously densified before positioning the composite material segment against the composite component. In some embodiments, the composite material is ceramic matrix composite (CMC) and the composite material segment is a plurality of CMC plies. The composite component may be a CMC gas turbine engine component that comprises an original CMC component and a new CMC material segment joined to the original CMC component through the transfer of silicon between the original CMC component and the new CMC material segment during melt infiltration.
METHOD FOR REPAIRING HEATERS AND CHUCKS USED IN SEMICONDUCTOR PROCESSING
A method for the repair of a heater, or an electrostatic chuck, using a ceramic top layer joined with a hermetically sealed joint. The heater or electrostatic chuck may be machined down to remove a damaged top surface, and to allow for the joining of a new top surface. The new top pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.