An electrical termination unit or feedthrough which may be used for routing electrical conductors through a chamber wall, or otherwise across a barrier between isolated atmospheric conditions. The electrical termination unit may have aluminum as the interface material to the chamber interface and may utilize a ceramic insulator. The electrical termination unit may have the aluminum used as the interface brazed directly to a ceramic surface of the insulator. The aluminum that forms the chamber interface may be formed within a hollow ceramic tube in the same process step that brazes the aluminum to the ceramic tube with a hermetic joint. Machining subsequent to the brazing of the aluminum to the ceramic insulator may allow for achievement of the final form desired. A method for manufacturing such an electrical termination unit.

A sensor element includes a ceramic layered body having a zirconia layer part and two alumina layer parts provided on both surfaces of the zirconia layer part, respectively, and a plurality of electrodes provided in the ceramic layered body. At least one of the two alumina layer parts contains Ti element, the zirconia layer part has a layer containing Zr element and Ti element in the vicinity of an interface with the at least one alumina layer part, and the layer contains Ti element in an amount from 0.05 to 5.0 mass %.

A bonded body is formed to configured to join a ceramic member formed of a Si-based ceramic and a copper member formed of copper or a copper alloy, in which, in a joint layer formed between the ceramic member and the copper member, a crystalline active metal compound layer formed of a compound including an active metal is formed on the ceramic member side.

A power module substrate according to the present invention is a power module substrate in which a copper sheet made of copper or a copper alloy is laminated and bonded onto a surface of a ceramic substrate (11), an oxide layer (31) is formed on the surface of the ceramic substrate (11) between the copper sheet and the ceramic substrate (11), and the thickness of a AgCu eutectic structure layer (32) is set to 15 m or less.

A braze alloy for joining or repairing ceramic matrix composite (CMC) components comprises a braze composition including silicon at a concentration from about 48 at. % to about 66 at. %, titanium at a concentration from about 1 at. % to about 35 at. %, and an additional element selected from aluminum, cobalt, vanadium, nickel, and chromium. The braze composition comprises a melting temperature of less than 1300 C.

In some examples, techniques of repairing and/or reinforcing oxide-oxide ceramic matrix composite (CMC) materials using a metallic material. In one example, a method including applying a metallic material at an edge of an oxide-oxide CMC substrate; and heating the metallic material to diffuse the metal material into the oxide-oxide CMC substrate at the edge. In another example, a method including applying a metallic material onto a damaged area of the oxide-oxide CMC; applying a reinforcing phase material onto the damaged area of the oxide-oxide CMC; and heating the metallic material to diffuse the metallic material into the oxide-oxide CMC and attach the reinforcing phase material to the damaged area of the oxide-oxide CMC.

Methods for forming a unitary ceramic component are provided. The method may include: positioning a braze reactant layer in a contact area between a first densified ceramic component and a second densified ceramic component; positioning a pack material around at least a portion of the first densified ceramic component or the second densified ceramic component; positioning at least one infiltrate source in fluid communication with the braze reactant layer; and thereafter, heating the at least one infiltrate source, the pack material, the first densified ceramic component, and the second densified ceramic component to a braze temperature that is at or above a melting point of at least one phase of the infiltrate composition such that at least one phase of infiltrate composition melts and flows into the braze reactant layer and reacts with a ceramic precursor compound therein to form a ceramic material.

Adhesive compositions and methods for bonding materials with different thermal expansion coefficients is provided. The adhesive is formulated using a flux material, a low flux material, and a filler material, where the filler material comprises particulate from at least one of the two components being bonded together. A thickening agent can also be used as part of the adhesive composition to aid in applying the adhesive and establishing a desired bond thickness. The method of forming a high strength bond using the disclosed adhesive does not require the use of intermediary layer or the use of high cure temperatures that could damage one or both of the components being bonded together.

A bonded body of copper and ceramic includes: a copper member made of copper or a copper alloy and a ceramic member made of an aluminum oxide, the copper member and the ceramic member being bonded to each other; a magnesium oxide layer which is formed on a ceramic member side between the copper member and the ceramic member; and a Mg solid solution layer which is formed between the magnesium oxide layer and the copper member and contains Mg in a state of a solid solution in a Cu primary phase, in which one or more active metals selected from Ti, Zr, Nb, and Hf are present in the Mg solid solution layer.

The invention relates to an insert brazed on a body of cutting tools (101), consisting of: a metal substrate (11), in the form of plates, having a surface for attachment to the tool body; a high-temperature, brazing, alloy layer (12); an intermediate layer; and a ceramic plate (14). The brazing alloy layer connects the metal substrate (11) of the ceramic plate (14) via the metal layer (13). A low-temperature brazing layer (1) connects the insert (1, 1) to the body of the tool (101).