C04B2237/64

Method for manufacturing ceramic-metal layer assembly, method for manufacturing ceramic circuit board, and metal-board-joined ceramic base material board

Provided is a method for manufacturing a metal-layer-joined ceramic base material board, in which at least one scribe line is formed, on each of the front and back surfaces of a ceramic base material board, along dividing lines for dividing the ceramic base material board into a plurality of ceramic boards, a metal board covering at least a portion of the dividing lines is joined to each of the front and back surface of the ceramic base material board, the metal boards are etched along the dividing lines to form a plurality of metal layers, and the plurality of metal layers are joined to each of the front and back surfaces of the ceramic base material board.

BONDED CERAMIC HAVING CHANNEL THROUGH WHICH FLUID CAN FLOW, AND METHOD FOR MANUFACTURING SAME
20200317586 · 2020-10-08 ·

Described herein are a bonded ceramic having a channel through which a fluid can flow, and a method for manufacturing the same. The bonded ceramic includes: a first ceramic base material; and a second ceramic base material, wherein: the first ceramic base material and the second ceramic base material are bonded by adhesive layer-free bonding; a pattern is formed on either or both of the bonding surface of the first ceramic base material where the first ceramic base material comes in contact with the second ceramic base material and the bonding surface of the second ceramic base material where the second ceramic base material comes in contact with the first ceramic base material; and the bonded ceramic includes pores having a size of 0.01 m to 50 m and formed along the bonding surface between the first ceramic base material and the second ceramic base material.

CERAMIC-ALUMINUM ASSEMBLY WITH BONDING TRENCHES

A method of joining is provided. the method includes preparing a first member, preparing a second member, and forming at least one trench in at least one of the first member and the second member. The method further includes placing a strip of solid aluminum material between the first member and the second member across the trench, bringing the first member and the second member together to contact the solid aluminum material and to form an assembly, and applying a force and heat to the assembly above a melting point of the solid aluminum material such that the solid aluminum material flows into the trench. Additionally, the method further includes applying additional heat to the assembly at or above a wetting temperature of the member in which the trench is formed to bond the first member to the second member along adjacent faces and cooling the assembly.

MECHANICAL CERAMIC MATRIX COMPOSITE (CMC) REPAIR
20200230752 · 2020-07-23 ·

Various embodiments include a metal-repaired ceramic matrix composite (CMC) article, and a method of repairing a CMC article having a defect. Particular embodiments include a method including: removing a defect-containing portion of the CMC article; forming at least one opening in a remaining portion of the CMC article; preparing a metal repair preform for replacing at least the removed portion of the CMC article, wherein a portion of the metal repair preform complements the at least one opening; and attaching the metal repair preform to the remaining portion of the CMC article.

Semiconductor Substrate Support With Multiple Electrodes And Method For Making Same
20200206835 · 2020-07-02 ·

A method for manufacturing an electrostatic chuck with multiple chucking electrodes made of ceramic pieces using metallic aluminum as the joining. The aluminum may be placed between two pieces and the assembly may be heated in the range of 770C to 1200C. The joining atmosphere may be non-oxygenated. After joining the exclusions in the electrode pattern may be machined by also machining through one of the plate layers. The machined exclusion slots may then be filled with epoxy or other material. An electrostatic chuck or other structure manufactured according to such methods.

METHOD FOR BRAZING TITANIUM ALLOY COMPONENTS WITH ZIRCONIA-BASED CERAMIC COMPONENTS FOR HOROLOGY OR JEWELLERY
20200189983 · 2020-06-18 · ·

A method for brazing a first ceramic component and a second metal alloy component, to make a structural or external timepiece element, a zirconia-based ceramic is chosen for the first component and a titanium alloy for the second component, a first recess is made inside the first component, set back from a first surface in a junction area with a second surface of the second component, braze material is deposited on this first surface and inside each recess, the second surface is positioned in alignment with the first surface to form an assembly, this assembly is heated in a controlled atmosphere to above the melting temperature of the braze material, in order to form the braze in the junction area.

Flow path member
10685860 · 2020-06-16 · ·

There is provided a first substrate having a first main surface, a second substrate having a second main surface, a bonding member bonding the first main surface and the second main surface, and a flow path positioned between the first substrate and the second substrate and extended in a parallel direction with the first main surface and the second main surface, and the bonding member has a projection which is protruded from a portion between the first main surface and the second main surface toward an inner part of the flow path, the flow path includes a first portion having the projection provided in an inner part and a second portion linked to the first portion adjacently to an opposite side to a side where the projection of the first portion is provided, and a height of the first substrate is greater than a height of the second portion in the thickness direction.

Method for joining dissimilar engine components

A method for joining engine components includes positioning a first plurality of thermal protection structures across a thermal protection space between a first thermal protection surface and a second thermal protection surface. The first and second engine components are locally joined by forming a first plurality of transient liquid phase (TLP) or partial transient liquid phase (PTLP) bonds along corresponding ones of the first plurality of thermal protection structures between the first thermal protection surface and the second thermal protection surface. The second thermal protection surface is formed from a second surface material different from a first surface material of the first thermal protection surface.

Method for manufacture of a multi-layer plate device

A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the joining atmosphere, and other factors. The ceramic pieces may be aluminum nitride and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.

METHOD FOR MANUFACTURING CERAMIC-METAL LAYER ASSEMBLY, METHOD FOR MANUFACTURING CERAMIC CIRCUIT BOARD, AND METAL-BOARD-JOINED CERAMIC BASE MATERIAL BOARD
20200146144 · 2020-05-07 ·

Provided is a method for manufacturing a metal-layer-joined ceramic base material board, in which at least one scribe line is formed, on each of the front and back surfaces of a ceramic base material board, along dividing lines for dividing the ceramic base material board into a plurality of ceramic boards, a metal board covering at least a portion of the dividing lines is joined to each of the front and back surface of the ceramic base material board, the metal boards are etched along the dividing lines to form a plurality of metal layers, and the plurality of metal layers are joined to each of the front and back surfaces of the ceramic base material board.