Patent classifications
C04B2237/64
Method for forming passages in composite components
The present disclosure is directed to a method for forming a passage in a composite component. The method includes forming a cavity in a fiber preform. The cavity forms a portion of the passage. The method also includes inserting a core into the cavity and placing one or more fiber plies onto the fiber preform to form a fiber preform assembly. The method further includes thermally processing the fiber preform assembly and densifying the fiber preform assembly to form the composite component. The method also includes removing the core from the composite component.
Process of Manufacturing a Conversion Element, Conversion Element and Light Emitting Device Comprising the Conversion Element
A method of manufacturing a conversion element is disclosed. A precursor material is selected from one or more of lutetium, aluminum and a rare-earth element. The precursor material is mixed with a binder and a solvent to obtain a slurry. A green body is formed from the slurry and the green body is sintered to obtain the conversion element. The sintering is performed at a temperature of more than 1720 C.
Low Temperature Method For Hermetically Joining Non-Diffusing Ceramic Materials In Multi-Layer Plate Devices
A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The wetting and flow of the joining material is controlled by the selection of the joining material, the joining temperature, the joining atmosphere, and other factors. The ceramic pieces may be on a non-diffusable type, such as aluminum nitride, alumina, beryllium oxide, and zirconia, and the pieces may be brazed with an aluminum alloy under controlled atmosphere. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck.
POLYCRYSTALLINE DIAMOND COMPACT
A polycrystalline diamond compact including a cemented carbide substrate and a polycrystalline diamond layer bonded to the cemented carbide substrate. The polycrystalline diamond layer is nonplanar and includes a central part and a peripheral part surrounding the central part. The central part includes a protruding surface relative to the peripheral part. The protruding surface is spherical or planar. The peripheral part includes a plurality of radially-disposed ridges.
MANUFACTURING METHOD OF CERAMIC ELECTROSTATIC CHUCK
The present invention provides a method for manufacturing a ceramic electrostatic chuck which enables high purity and minimum thickness variation of a dielectric layer formed of ceramics or composite ceramics. The method includes: forming grooves for electrode pattern formation in a dielectric layer formed of ceramics or composite ceramics and having a density of 95% or greater; forming an electrode pattern by filling the grooves with a metal; forming an activated bonding layer configured for joining on the dielectric layer; and joining an insulator layer, which is formed of ceramics or composite ceramics and has a density of 95% or greater, with the dielectric layer.
CERAMIC-ALUMINUM ASSEMBLY WITH BONDING TRENCHES
An assembly includes a first member, a second member adjacent to the first member, and an aluminum material. At least one of the first member and the second member defines at least one trench. The aluminum material is disposed within the trench and bonds the first member to the second member along adjacent faces. In one form, a spacing between the first member and the second member along the adjacent faces is less than 5 m.
Heating module of electronic cigarette atomizer
A heating module of an electronic cigarette atomizer includes a ceramic rod, a connecting element and a heating wire. The heating wire is wound around the ceramic rod, the connecting element is connected to two ends of the heating wire respectively, and the ceramic rod is of a hollow micro-porous structure.
Semiconductor Processing Equipment With High Temperature Resistant Nickel Alloy Joints And Methods For Making Same
A method for the joining of ceramic pieces with a hermetically sealed joint comprising brazing a layer of joining material between the two pieces. The ceramic pieces may be aluminum nitride or other ceramics, and the pieces may be brazed with Nickel and an alloying element, under controlled atmosphere. The completed joint will be fully or substantially Nickel with another element in solution. The joint material is adapted to later withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the interior of a heater or electrostatic chuck. Semiconductor processing equipment comprising ceramic and joined with a nickel alloy and adapted to withstand processing chemistries, such as fluorine chemistries, as well as high temperatures.
SUPERHARD CONSTRUCTIONS & METHODS OF MAKING SAME
A polycrystalline super hard construction comprises a body of polycrystalline super hard material and a substrate bonded to the body along an interface. The substrate a first end surface forming the interface, the first end surface comprising a projection extending from the body of the substrate into the body of super hard material towards the cutting face, the body of polycrystalline material extending around the projection. The body of polycrystalline material comprises a first region more thermally stable than a second region, the first region comprising an annular portion located around the projection, the second region extending between and bonding the first region to the substrate. The first region has a thickness from the cutting face along the peripheral side edge to the interface of at least around 3 mm and a portion of the projection has a thickness measured in a plane extending along the longitudinal axis of at least around 3 mm.
METHOD FOR MANUFACTURING BONDED BODY
A method for manufacturing a bonded body according to the present disclosure includes: obtaining a first composite that includes a first outer layer portion located on an outer surface side and containing silicon oxide as a main component, and a first inner portion surrounded by the first outer layer portion and containing silicon carbide and silicon; obtaining a second composite that includes a second outer layer portion located on an outer surface side and containing silicon oxide as a main component, and a second inner portion surrounded by the second outer layer portion and containing silicon carbide and silicon; grinding or polishing a first contact surface at which the first inner portion is in contact with the second inner portion and/or a second contact surface at which the second inner portion is in contact with the first inner portion; and bringing the first contact surface and the second contact surface into contact with each other and performing thermal treatment in a vacuum atmosphere or an inert gas atmosphere.