A photoacid generator (PAG) and a photoresist composition, the PAG being represented by the following Chemical Formula (I): ##STR00001## wherein, in Chemical Formula (I), L is sulfur (S) or iodine (I), R.sub.3 being omitted when L is I; R.sub.1, R.sub.2, and R.sub.3 are each independently a C1 to C10 alkyl, alkenyl, alkynyl, or alkoxy group that is unsubstituted or substituted with a heteroatom such that the heteroatom is pendant or is between the group and L, or a C6 to C18 aryl, arylalkyl, or alkylaryl group that is unsubstituted or substituted with a heteroatom such that the heteroatom is pendant or is between the group and L; AL is an acid-labile group; m is 1 to 4; and M is a C1 to C30 hydrocarbon group that is unsubstituted or substituted with a heteroatom such that the heteroatom is pendant or is between the group and a sulfur atom.

A photoacid generator (PAG) and a photoresist composition, the PAG being represented by the following Chemical Formula (I): ##STR00001## wherein, in Chemical Formula (I), L is sulfur (S) or iodine (I), R.sub.3 being omitted when L is I; R.sub.1, R.sub.2, and R.sub.3 are each independently a C1 to C10 alkyl, alkenyl, alkynyl, or alkoxy group that is unsubstituted or substituted with a heteroatom such that the heteroatom is pendant or is between the group and L, or a C6 to C18 aryl, arylalkyl, or alkylaryl group that is unsubstituted or substituted with a heteroatom such that the heteroatom is pendant or is between the group and L; AL is an acid-labile group; m is 1 to 4; and M is a C1 to C30 hydrocarbon group that is unsubstituted or substituted with a heteroatom such that the heteroatom is pendant or is between the group and a sulfur atom.

The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition with which a pattern having an excellent pattern collapse suppressing property and excellent LWR performance can be obtained. In addition, the present invention also provides a resist film, a pattern forming method, and a method for manufacturing an electronic device, each regarding the actinic ray-sensitive or radiation-sensitive resin composition. The actinic ray-sensitive or radiation-sensitive resin composition of the present invention includes a resin whose solubility in a developer is changed by the action of an acid, a photoacid generator represented by General Formula (b1), and a solvent, in which the photoacid generator represented by General Formula (b1) is a compound that generates an acid having a pka of 1.0 or less upon irradiation with actinic rays or radiation

##STR00001##

The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition with which a pattern having an excellent pattern collapse suppressing property and excellent LWR performance can be obtained. In addition, the present invention also provides a resist film, a pattern forming method, and a method for manufacturing an electronic device, each regarding the actinic ray-sensitive or radiation-sensitive resin composition. The actinic ray-sensitive or radiation-sensitive resin composition of the present invention includes a resin whose solubility in a developer is changed by the action of an acid, a photoacid generator represented by General Formula (b1), and a solvent, in which the photoacid generator represented by General Formula (b1) is a compound that generates an acid having a pka of 1.0 or less upon irradiation with actinic rays or radiation

##STR00001##

An additive for a non-aqueous electrolyte solution that can suppress the initial gas generation amount when used in a non-aqueous electrolyte solution battery. The additive for a non-aqueous electrolyte solution is represented by any one of formulae [1] to [4]:

##STR00001## wherein R.sup.1, R.sup.2, R.sup.3, R.sup.4, X.sup.1, X.sup.2 and Y are as defined in the specification.

A novel onium salt and a resist composition comprising the same as a PAG are provided. When processed by photolithography using KrF or ArF excimer laser, EB or EUV, the resist composition is reduced in acid diffusion and improved in exposure latitude, MEF, and LWR.

A novel onium salt having formula (1) and a resist composition comprising the same as a quencher are provided. When the resist composition is processed by photolithography using high-energy radiation, there is formed a resist pattern which is improved in LWR and CDU. In formula (1), R.sup.1, R.sup.2 and R.sup.3 each are a C.sub.1-C.sub.20 monovalent hydrocarbon group which may contain a heteroatom exclusive of fluorine, and Z.sup.+ is a sulfonium, iodonium or ammonium cation.

The present application relates to a compound of Chemical Formula 1 and an organic light emitting device including the same.

The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition with which a pattern having an excellent pattern collapse suppressing property and excellent LWR performance can be obtained. In addition, the present invention also provides a resist film, a pattern forming method, and a method for manufacturing an electronic device, each regarding the actinic ray-sensitive or radiation-sensitive resin composition. The actinic ray-sensitive or radiation-sensitive resin composition of the present invention includes a resin whose solubility in a developer is changed by the action of an acid, a photoacid generator represented by General Formula (b1), and a solvent, in which the photoacid generator represented by General Formula (b1) is a compound that generates an acid having a pka of 1.0 or less upon irradiation with actinic rays or radiation ##STR00001##

The present invention provides an actinic ray-sensitive or radiation-sensitive resin composition with which a pattern having an excellent pattern collapse suppressing property and excellent LWR performance can be obtained. In addition, the present invention also provides a resist film, a pattern forming method, and a method for manufacturing an electronic device, each regarding the actinic ray-sensitive or radiation-sensitive resin composition. The actinic ray-sensitive or radiation-sensitive resin composition of the present invention includes a resin whose solubility in a developer is changed by the action of an acid, a photoacid generator represented by General Formula (b1), and a solvent, in which the photoacid generator represented by General Formula (b1) is a compound that generates an acid having a pka of 1.0 or less upon irradiation with actinic rays or radiation ##STR00001##