Disclosed are methods of preparing thiol keratin-containing materials, comprising applying a mixture comprising one or more thiol compounds and a catalyst. Methods of preparing cross-linked keratin-containing materials by applying a mixture comprising one or more thiol compounds and an oxidizing agent are also disclosed. Methods of grafting monomeric and polymeric materials on keratin-containing materials to provide a covalent coating on keratin-containing materials are disclosed. A mixture comprising one or more thiol compounds is applied to the keratin-containing material sample. The keratin-containing material sample then comprises a plurality of free thiol groups. A monomer is optionally applied to the keratin-containing material sample to form a plurality of covalent bonds between the free thiol groups and the monomers. The disclosed grafting methods can be carried out with or without catalyst.

A resin composition contains a maleimide compound (A) having an arylene structure bonded in the meta-orientation in the molecule, and a styrenic polymer being solid at 25° C.

To provide a curable resin composition of which a cured product has excellent heat-resistance and dielectric properties, and a cured product thereof, and a prepreg, a circuit board, a build-up film, a semiconductor sealing material, and a semiconductor apparatus having both excellent heat resistance and dielectric properties. The invention has an indane scaffold represented by the following general formula (1):

##STR00001##

in formula (1), Ra's are each independently an alkyl group, an alkyloxy group or an alkylthio group, which has 1 to 10 carbon atoms, an aryl group, an aryloxy group or an arylthio group, which has 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a nitro group, a hydroxyl group, or a mercapto group, and q represents an integer value of 0 to 4.

To provide a curable resin composition of which a cured product has excellent heat-resistance and dielectric properties, and a cured product thereof, and a prepreg, a circuit board, a build-up film, a semiconductor sealing material, and a semiconductor apparatus having both excellent heat resistance and dielectric properties. The invention has an indane scaffold represented by the following general formula (1):

##STR00001##

in formula (1), Ra's are each independently an alkyl group, an alkyloxy group or an alkylthio group, which has 1 to 10 carbon atoms, an aryl group, an aryloxy group or an arylthio group, which has 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a nitro group, a hydroxyl group, or a mercapto group, and q represents an integer value of 0 to 4.

A curable composition can comprise a polymerizable material and a photo-initiator, wherein the polymerizable material can comprise a first monomer including at least one bismaleimide-monomer and at least one second monomer. The curable composition can have a viscosity of not greater than 30 mPa.Math.s, and a cured layer of the curable composition can have a high thermal stability up to 350° C.

A curable composition can comprise a polymerizable material and a photo-initiator, wherein the polymerizable material can comprise a first monomer including at least one bismaleimide-monomer and at least one second monomer. The curable composition can have a viscosity of not greater than 30 mPa.Math.s, and a cured layer of the curable composition can have a high thermal stability up to 350° C.

An object of the present invention is to provide a novel photosensitive resin precursor that can be developed with an alkali and ring-closed even at low temperatures, and preferably has excellent thermal properties and excellent electric properties after curing, and also to provide a use application thereof. As means for achieving the object, disclosed are a bismaleimide compound comprising, in one molecule, two partial structures in each of which a carbon atom having a substituent represented by the following formula (A) (wherein Y represents a direct bond or a divalent linking group), and a carbon atom having a hydroxy group are directly bonded to each other, a polymer which is a self-polymer of the bismaleimide compound, and a benzoxazole which is an intramolecular dehydrated ring-closed product of the polymer.

##STR00001##

Disclosed are methods of preparing thiol keratin-containing materials, comprising applying a mixture comprising one or more thiol compounds and a catalyst. Methods of preparing cross-linked keratin-containing materials by applying a mixture comprising one or more thiol compounds and an oxidizing agent are also disclosed. Methods of grafting monomeric and polymeric materials on keratin-containing materials to provide a covalent coating on keratin-containing materials are disclosed. A mixture comprising one or more thiol compounds is applied to the keratin-containing material sample. The keratin-containing material sample then comprises a plurality of free thiol groups. A monomer is optionally applied to the keratin-containing material sample to form a plurality of covalent bonds between the free thiol groups and the monomers. The disclosed grafting methods can be carried out with or without catalyst.

An object of the present invention is to provide a film forming material for lithography that is applicable to a wet process, and is useful for forming a photoresist underlayer film excellent in heat resistance, etching resistance, embedding properties to a supporting material having difference in level, and film flatness; and the like. A film forming material for lithography comprising a compound having a group of the following formula (0):

##STR00001##

can solve the problem described above.

An object of the present invention is to provide a film forming material for lithography that is applicable to a wet process, and is useful for forming a photoresist underlayer film excellent in heat resistance, etching resistance, embedding properties to a supporting material having difference in level, and film flatness; and the like. A film forming material for lithography comprising a compound having a group of the following formula (0):

##STR00001##

can solve the problem described above.