C08F22/40

Covalent treatment with thiols of keratin-containing materials

Disclosed are methods of preparing thiol keratin-containing materials, comprising applying a mixture comprising one or more thiol compounds and a catalyst. Methods of preparing cross-linked keratin-containing materials by applying a mixture comprising one or more thiol compounds and an oxidizing agent are also disclosed. Methods of grafting monomeric and polymeric materials on keratin-containing materials to provide a covalent coating on keratin-containing materials are disclosed. A mixture comprising one or more thiol compounds is applied to the keratin-containing material sample. The keratin-containing material sample then comprises a plurality of free thiol groups. A monomer is optionally applied to the keratin-containing material sample to form a plurality of covalent bonds between the free thiol groups and the monomers. The disclosed grafting methods can be carried out with or without catalyst.

BCDA-based semi-alicyclic homo- or co-polyimide membrane materials for gas separation and the preparation method thereof

The present invention relates to a BCDA-based semi-alicyclic homo- or co-polyimide membrane material for gas separation and a preparation method thereof. The polyimide material prepared according to the present invention has high solubility in casting solvents, particularly in polar organic solvents, by interrupting asymmetry in the polyimide chain structure and formation of polyimide complexes compared with aromatic polyimides, and has higher heat resistance than the conventional aromatic polyimides and aliphatic polyimides, so that it is useful for the process of a high-selective permeable composite membrane or a asymmetric hollow fiber membrane used for commercial purposes, suggesting that it can be effectively used as a membrane for gas separation in various fields. In addition, the polyimide material membrane for gas separation of the present invention is useful because it has superior gas separation properties to the conventional commercialized aromatic polyimides or semi-alicyclic polyimides.

BCDA-based semi-alicyclic homo- or co-polyimide membrane materials for gas separation and the preparation method thereof

The present invention relates to a BCDA-based semi-alicyclic homo- or co-polyimide membrane material for gas separation and a preparation method thereof. The polyimide material prepared according to the present invention has high solubility in casting solvents, particularly in polar organic solvents, by interrupting asymmetry in the polyimide chain structure and formation of polyimide complexes compared with aromatic polyimides, and has higher heat resistance than the conventional aromatic polyimides and aliphatic polyimides, so that it is useful for the process of a high-selective permeable composite membrane or a asymmetric hollow fiber membrane used for commercial purposes, suggesting that it can be effectively used as a membrane for gas separation in various fields. In addition, the polyimide material membrane for gas separation of the present invention is useful because it has superior gas separation properties to the conventional commercialized aromatic polyimides or semi-alicyclic polyimides.

RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE

A resin composition of the present invention contains: a maleimide compound (A) having a maleimide functional group equivalent of 300 g/eq. or more, and a transmittance of 1% or more at a wavelength of 405 nm (h-line); a maleimide compound (B) having a maleimide functional group equivalent of less than 300 g/eq.; and a photo initiator (C) having an absorbance of 0.1 or more at a wavelength of 405 nm (h-line).

RESIN COMPOSITION, RESIN SHEET, MULTILAYER PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE

A resin composition of the present invention contains: a maleimide compound (A) having a maleimide functional group equivalent of 300 g/eq. or more, and a transmittance of 1% or more at a wavelength of 405 nm (h-line); a maleimide compound (B) having a maleimide functional group equivalent of less than 300 g/eq.; and a photo initiator (C) having an absorbance of 0.1 or more at a wavelength of 405 nm (h-line).

Resin composition, prepreg, metal foil-clad laminate, and printed circuit board

A resin composition comprising a thermosetting resin, a functional group-modified copolymer, and an inorganic filler, wherein the functional group-modified copolymer has two or more alkyl (meth)acrylate units, or one or two or more alkyl (meth)acrylate units and an acrylonitrile unit, and at least a part of alkyl ester groups of the alkyl (meth)acrylate units and/or a cyano group of the acrylonitrile unit are/is modified with at least one selected from the group consisting of an epoxy group, a carboxyl group, and an amide group.

Resin composition, prepreg, metal foil-clad laminate, and printed circuit board

A resin composition comprising a thermosetting resin, a functional group-modified copolymer, and an inorganic filler, wherein the functional group-modified copolymer has two or more alkyl (meth)acrylate units, or one or two or more alkyl (meth)acrylate units and an acrylonitrile unit, and at least a part of alkyl ester groups of the alkyl (meth)acrylate units and/or a cyano group of the acrylonitrile unit are/is modified with at least one selected from the group consisting of an epoxy group, a carboxyl group, and an amide group.

MATERIAL FOR FORMING ORGANIC FILM, SUBSTRATE FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND COMPOUND FOR FORMING ORGANIC FILM

An object of the present invention is to provide: a compound containing an imide group which is not only cured under film formation conditions of inert gas as well as air, generates no by-product and has excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but can also form an organic underlayer film with favorable adhesion to a substrate. The present invention provides a material for forming an organic film, including: (A) a compound for forming an organic film shown by the following general formula (1A) or (1B); and (B) an organic solvent,

##STR00001##

noting that in the general formula (1A), when W.sub.1 represents any of

##STR00002##

R.sub.1 does not represent any of

##STR00003##

MATERIAL FOR FORMING ORGANIC FILM, SUBSTRATE FOR MANUFACTURING SEMICONDUCTOR DEVICE, METHOD FOR FORMING ORGANIC FILM, PATTERNING PROCESS, AND COMPOUND FOR FORMING ORGANIC FILM

An object of the present invention is to provide: a compound containing an imide group which is not only cured under film formation conditions of inert gas as well as air and has excellent heat resistance and properties of filling and planarizing a pattern formed on a substrate, but can also form an organic underlayer film with favorable adhesion to a substrate, and a material for forming an organic film containing the compound. A material for forming an organic film, including: (A) a compound for forming an organic film shown by the following general formula (1A); and (B) an organic solvent,

##STR00001## noting that in the general formula (1B), when W.sub.1 represents

##STR00002##

R.sub.1 does not represent any of

##STR00003##

Resin composition, laminate including the resin composition, semiconductor wafer with resin composition layer, substrate for mounting semiconductor with resin composition layer, and semiconductor device including the semiconductor wafer with resin composition layer

The present invention provides a resin composition for an underfill material, comprising a maleimide compound (A) and a secondary monoamino compound (B), wherein the secondary monoamino compound (B) has a boiling point of 120 C. or more.