An aspect of the present invention is a resin composition containing at least one of a polyphenylene ether compound (A), having at least one of a group represented by the following Formula (1) and a group represented by the following Formula (2) in the molecule, and a maleimide compound (B); and ceramic particles (C) including aluminum titanate particles (C1).

##STR00001##

In Formula (1), p represents 0 to 10, Ar represents an arylene group, and R.sub.1 to R.sub.3 each independently represent a hydrogen atom or an alkyl group.

##STR00002##

In Formula (2), R.sub.4 represents a hydrogen atom or an alkyl group.

The resin composition according to the present invention is a resin composition including a cyanate compound (A) and/or a maleimide compound (B), and an inorganic filler (C), wherein the inorganic filler (C) includes a boron nitride particle aggregate including primary hexagonal boron nitride particles, wherein (0001) planes of the primary hexagonal boron nitride particles are stacked on top of each other to thereby form the boron nitride particle aggregate.

Provided is a thermosetting compound that has satisfactory solvent solubility and can be rapidly cured by a heat treatment to form a cured product having extreme heat resistance. The thermosetting compound according to the present invention is represented by following Formula (1). In Formula (1), R.sup.1 and R.sup.2 each independently represent a thermosetting group; D.sup.1 and D.sup.2 are each, identically or differently, selected from a single bond and a linkage group; Ar.sup.1, Ar.sup.2, and Ar.sup.3 are each, identically or differently, selected from a divalent aromatic hydrocarbon group and a divalent group including two or more aromatic hydrocarbons bonded to each other via any one selected from a single bond, a divalent aliphatic hydrocarbon group, and a divalent alicyclic hydrocarbon group; and E represents, independently on each occurrence, an ester bond.

##STR00001##

The disclosure relates to the functionalization of a carbon-carbon backbone (CCB) polymer using a (cyclic) grafting agent, an initiator, and optionally a reversible radical trapping agent. The grafting agent and/or initiator can be particularly selected in terms of their surface energy and/or half-life, respectively, to limit or control undesirable effects associated with reactive melt-processing, such as excessive crosslinking, chain scission, or grafting agent homopolymerization, as well as to improve or control desirable effects associated with reactive melt-processing, such as improved relative graft uniformity or homogeneity on the CCB polymer. In some cases, the grafting agent can further include a functional group to impart some additional or new chemical or physical property to the CCB polymer. In some cases, the reactively melt-processed mixture includes two or more different polymers that are compatibilized via the grafting agent.

The disclosure relates to the functionalization of a carbon-carbon backbone (CCB) polymer using a (cyclic) grafting agent, an initiator, and optionally a reversible radical trapping agent. The grafting agent and/or initiator can be particularly selected in terms of their surface energy and/or half-life, respectively, to limit or control undesirable effects associated with reactive melt-processing, such as excessive crosslinking, chain scission, or grafting agent homopolymerization, as well as to improve or control desirable effects associated with reactive melt-processing, such as improved relative graft uniformity or homogeneity on the CCB polymer. In some cases, the grafting agent can further include a functional group to impart some additional or new chemical or physical property to the CCB polymer. In some cases, the reactively melt-processed mixture includes two or more different polymers that are compatibilized via the grafting agent.

The present invention relates to a new class of dielectric polymer material, which is particularly suitable for the manufacturing of electronic devices. The dielectric polymer material is formed by reacting bismaleimide compounds and shows an advantageous well-balanced profile of favorable material properties. The bismaleimide compounds have an oligomeric structure with an oligoamide extended repeating unit in the middle part of the molecule and maleimide groups at each terminal end of the molecule. There is further provided a method for forming said dielectric polymer material. Beyond that, the present invention relates to the dielectric polymer material and to an electronic device comprising the same.

The present invention relates to a new class of dielectric polymer material, which is particularly suitable for the manufacturing of electronic devices. The dielectric polymer material is formed by reacting bismaleimide compounds and shows an advantageous well-balanced profile of favorable material properties. The bismaleimide compounds have an oligomeric structure with an oligoamide extended repeating unit in the middle part of the molecule and maleimide groups at each terminal end of the molecule. There is further provided a method for forming said dielectric polymer material. Beyond that, the present invention relates to the dielectric polymer material and to an electronic device comprising the same.

An object of the present invention is to provide a resin composition which has excellent photocurability for various active energy rays without inhibiting photocuring reaction in an exposure step, and can confer excellent alkaline developability in a development step, when used in the fabrication of a multilayer printed wiring board, while the resulting insulation layer has excellent adhesiveness to an adhesive metal such as titanium; and a resin sheet, a multilayer printed wiring board, and a semiconductor device. The resin composition of the present invention is a resin composition containing: a bismaleimide compound (A) containing a constituent unit represented by the following formula (1), and maleimide groups at both ends of the molecular chain; and an imidazole compound (B) represented by the following formula (2):

##STR00001##

An object of the present invention is to provide a resin composition which has excellent photocurability for various active energy rays without inhibiting photocuring reaction in an exposure step, and can confer excellent alkaline developability in a development step, when used in the fabrication of a multilayer printed wiring board, while the resulting insulation layer has excellent adhesiveness to an adhesive metal such as titanium; and a resin sheet, a multilayer printed wiring board, and a semiconductor device. The resin composition of the present invention is a resin composition containing: a bismaleimide compound (A) containing a constituent unit represented by the following formula (1), and maleimide groups at both ends of the molecular chain; and an imidazole compound (B) represented by the following formula (2):

##STR00001##

An object of the present invention is to provide a resin composition which has excellent photocurability for various active energy rays, in particular, an active energy ray including an h-line at a wavelength of 405 nm, without inhibiting photocuring reaction in an exposure step, and can confer excellent alkaline developability in a development step, when used in the fabrication of a multilayer printed wiring board; and a resin sheet, a multilayer printed wiring board, and a semiconductor device. The resin composition of the present invention is a resin composition containing: a maleimide compound (A) containing a constituent unit represented by the formula (1), and maleimide groups at both ends of the molecular chain; a photo initiator (B1) represented by the formula (2) and/or a photo initiator (B2) represented by the formula (3); and a photo initiator (C) represented by the formula (4):

##STR00001##