To provide a semi-aromatic polyamide resin composition having excellent good plating properties, low water absorption properties, and solder reflow resistance. A semi-aromatic polyamide resin composition of the present invention comprises: 10 to 200 parts by mass of an inorganic filler (B) and 2 to 30 parts by mass of a toughness improver (C) based on 100 parts by mass of a semi-aromatic polyamide (A), wherein the semi-aromatic polyamide resin (A) satisfies the following (a) and (b): (a) a melting point (Tm) measured by differential scanning calorimetry (DSC) is 280° C. or higher; and (b) an equilibrium water absorption rate at 80° C. and 95% RH is 3.5% or less.

An ultra-high molecular weight, ultra-fine particle size polyethylene has a viscosity average molecular weight (Mv) greater than 1×10.sup.6. The polyethylene is spherical or are sphere-like particles having a mean particle size of 10-100 μm, having a standard deviation of 2-15 μm and a bulk density of 0.1-0.3 g/mL. Using the polyethylene as a basic polyethylene, a grafted polyethylene can be obtained by means of a solid-phase grafting method; and a glass fiber-reinforced polyethylene composition comprising the polyethylene and glass fibers, and a sheet or pipe prepared therefrom; a solubilized ultra-high molecular weight, ultra-fine particle size polyethylene; and a fiber and a film prepared from the solubilized ultra-high molecular weight, ultra-fine particle size polyethylene may also be obtained. The method has simple steps, is easy to control, has a relatively low cost and a high repeatability, and can realize industrialisation.

An ultra-high molecular weight, ultra-fine particle size polyethylene has a viscosity average molecular weight (Mv) greater than 1×10.sup.6. The polyethylene is spherical or are sphere-like particles having a mean particle size of 10-100 μm, having a standard deviation of 2-15 μm and a bulk density of 0.1-0.3 g/mL. Using the polyethylene as a basic polyethylene, a grafted polyethylene can be obtained by means of a solid-phase grafting method; and a glass fiber-reinforced polyethylene composition comprising the polyethylene and glass fibers, and a sheet or pipe prepared therefrom; a solubilized ultra-high molecular weight, ultra-fine particle size polyethylene; and a fiber and a film prepared from the solubilized ultra-high molecular weight, ultra-fine particle size polyethylene may also be obtained. The method has simple steps, is easy to control, has a relatively low cost and a high repeatability, and can realize industrialisation.

A release coating composition comprises (A) an organopolysiloxane containing at least two (2) ethylenically unsaturated groups, (B) an organopolysiloxane containing at least 2 Si—H groups per molecule, and (C) a hydrosilylation catalyst. If the organopolysiloxane (A) contains only 2 ethylenically unsaturated groups, the organopolysiloxane (B) contains on average more than 2 Si—H groups per molecule. The composition further comprises (D1) a hydrosilylation inhibitor comprising a maleimide of the general formula (I):

##STR00001##

In formula (I), A.sup.3 represents a hydrogen atom or a hydrocarbyl or substituted hydrocarbyl group having 1 to 18 carbon atoms, and A.sup.1 and A.sup.2 each represent a hydrogen atom or a hydrocarbyl or substituted hydrocarbyl group having 1 to 18 carbon atoms. The composition yet further comprises (D2) a second hydrosilylation inhibitor selected from acetylenic compounds, ethylenically unsaturated isocyanates, acetylenically unsaturated silanes and unsaturated dicarboxylic acid diesters or a maleate compound or a mixture thereof.

A release coating composition comprises (A) an organopolysiloxane containing at least two (2) ethylenically unsaturated groups, (B) an organopolysiloxane containing at least 2 Si—H groups per molecule, and (C) a hydrosilylation catalyst. If the organopolysiloxane (A) contains only 2 ethylenically unsaturated groups, the organopolysiloxane (B) contains on average more than 2 Si—H groups per molecule. The composition further comprises (D1) a hydrosilylation inhibitor comprising a maleimide of the general formula (I):

##STR00001##

In formula (I), A.sup.3 represents a hydrogen atom or a hydrocarbyl or substituted hydrocarbyl group having 1 to 18 carbon atoms, and A.sup.1 and A.sup.2 each represent a hydrogen atom or a hydrocarbyl or substituted hydrocarbyl group having 1 to 18 carbon atoms. The composition yet further comprises (D2) a second hydrosilylation inhibitor selected from acetylenic compounds, ethylenically unsaturated isocyanates, acetylenically unsaturated silanes and unsaturated dicarboxylic acid diesters or a maleate compound or a mixture thereof.

Disclosed herein are methods of preparing an aminimide. An epoxy compound is reacted with a hydrazine compound comprising a trivalent nitrogen, and an anhydride functional material or a cyclic compound containing a carbonyl group and at least one heteroatom alpha to the carbonyl group at a temperature greater than 20° C. to form the aminimide. At least one of the epoxy compound and the anhydride functional material or the cyclic compound is polymeric.

Disclosed herein are methods of preparing an aminimide. An epoxy compound is reacted with a hydrazine compound comprising a trivalent nitrogen, and an anhydride functional material or a cyclic compound containing a carbonyl group and at least one heteroatom alpha to the carbonyl group at a temperature greater than 20° C. to form the aminimide. At least one of the epoxy compound and the anhydride functional material or the cyclic compound is polymeric.

An object is to provide a chlorinated polyolefin resin composition being superior in adhesion, solution stability, and chipping resistance. The chlorinated polyolefin resin composition contains a component (A): a polyolefin resin A having a melting point (Tm.sub.A) obtained with a differential scanning calorimeter (DSC) in the range of 90 to 160° C., and a component (B): a polyolefin resin B having a melting point (Tm.sub.B) obtained with a differential scanning calorimeter (DSC) in the range of 50 to 130° C., at least any one of the component (A) and the component (B), or a copolymer thereof being a chlorinated polyolefin resin (where |Tm.sub.A−Tm.sub.B|≥5° C.).

An object is to provide a chlorinated polyolefin resin composition being superior in adhesion, solution stability, and chipping resistance. The chlorinated polyolefin resin composition contains a component (A): a polyolefin resin A having a melting point (Tm.sub.A) obtained with a differential scanning calorimeter (DSC) in the range of 90 to 160° C., and a component (B): a polyolefin resin B having a melting point (Tm.sub.B) obtained with a differential scanning calorimeter (DSC) in the range of 50 to 130° C., at least any one of the component (A) and the component (B), or a copolymer thereof being a chlorinated polyolefin resin (where |Tm.sub.A−Tm.sub.B|≥5° C.).

An object is to provide a resin composition having excellent performance as a binder such as adhesiveness and, at the same time, retaining solution properties favorably even after a solution is stored for a long period of time. A modified polyolefin resin composition includes a modified polyolefin resin (C), in which the modified polyolefin resin (C) is a resin made by modifying a polymer (A) that is a polymer (a) of a polyolefin resin or a chlorinated polyolefin resin and an α,β-unsaturated carboxylic acid derivative having a structure derived from at least one carboxy group or a chlorinated product (b) thereof with a modification component including an alcohol (B); and a residual ratio of the structure derived from at least one carboxy group in the modified polyolefin resin (C) is 50% or more and 80% or less.