Patent classifications
C08F222/40
Radiation polymerizable composition, cured layer of same, optical fiber containing cured layer and method for producing same
[Problem] To provide a radiation curable resin composition which is suitable as a primary material for optical fibers, while having a high curing rate by means of irradiation of radiation [Solution] A radiation polymerizable composition for forming an optical fiber primary coating layer, said composition containing: (A) a urethane oligomer containing a structure represented by formula (I) (in formula (I), R represents a vinyl group; and * represents a bonding hand); (B) one or more compounds selected from among (i) maleic acid anhydride, (ii) a compound represented by formula (II) (in formula (II), R.sup.I represents a single bond or an alkanediyl group having from 1 to 6 carbon atoms; and R.sup.2 represents a hydrogen atom, a hydroxy group or a specific group represented by formula (II-1) or formula (II-2)), and (iii) a compound represented by formula (III) (in formula (III), R.sup.5 represents an alkanediyl group having from 1 to 6 carbon atoms); and (C) a radiation polymerization initiator.
Radiation polymerizable composition, cured layer of same, optical fiber containing cured layer and method for producing same
[Problem] To provide a radiation curable resin composition which is suitable as a primary material for optical fibers, while having a high curing rate by means of irradiation of radiation [Solution] A radiation polymerizable composition for forming an optical fiber primary coating layer, said composition containing: (A) a urethane oligomer containing a structure represented by formula (I) (in formula (I), R represents a vinyl group; and * represents a bonding hand); (B) one or more compounds selected from among (i) maleic acid anhydride, (ii) a compound represented by formula (II) (in formula (II), R.sup.I represents a single bond or an alkanediyl group having from 1 to 6 carbon atoms; and R.sup.2 represents a hydrogen atom, a hydroxy group or a specific group represented by formula (II-1) or formula (II-2)), and (iii) a compound represented by formula (III) (in formula (III), R.sup.5 represents an alkanediyl group having from 1 to 6 carbon atoms); and (C) a radiation polymerization initiator.
Radiation polymerizable composition, cured layer of same, optical fiber containing cured layer and method for producing same
[Problem] To provide a radiation curable resin composition which is suitable as a primary material for optical fibers, while having a high curing rate by means of irradiation of radiation [Solution] A radiation polymerizable composition for forming an optical fiber primary coating layer, said composition containing: (A) a urethane oligomer containing a structure represented by formula (I) (in formula (I), R represents a vinyl group; and * represents a bonding hand); (B) one or more compounds selected from among (i) maleic acid anhydride, (ii) a compound represented by formula (II) (in formula (II), R.sup.I represents a single bond or an alkanediyl group having from 1 to 6 carbon atoms; and R.sup.2 represents a hydrogen atom, a hydroxy group or a specific group represented by formula (II-1) or formula (II-2)), and (iii) a compound represented by formula (III) (in formula (III), R.sup.5 represents an alkanediyl group having from 1 to 6 carbon atoms); and (C) a radiation polymerization initiator.
RESIST COMPOUND, METHOD FOR FORMING PATTERN USING SAME, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING SAME
Provided are a resist compound, a method of forming a pattern by using the same, and a method of manufacturing a semiconductor device using the same. According to the present disclosure, the compound may be represented by Formula 1:
##STR00001##
RESIN COMPOSITION, RESIN SHEET, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER, AND SEMICONDUCTOR DEVICE
A resin composition containing a bismaleimide compound (A) containing a constituent unit represented by the following formula (1) and maleimide groups at both ends of the molecular chain, a radical polymerizable resin or compound (B) other than the bismaleimide compound (A), and a curing accelerator (C), wherein the radical polymerizable resin or compound (B) contains at least one selected from the group consisting of a citraconimide group, a vinyl group, a maleimide group, a (meth)acryloyl group and an allyl group.
##STR00001##
RESIN COMPOSITION, RESIN SHEET, LAMINATE, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE FOR MOUNTING SEMICONDUCTOR WITH RESIN COMPOSITION LAYER, AND SEMICONDUCTOR DEVICE
A resin composition containing a bismaleimide compound (A) containing a constituent unit represented by the following formula (1) and maleimide groups at both ends of the molecular chain, a radical polymerizable resin or compound (B) other than the bismaleimide compound (A), and a curing accelerator (C), wherein the radical polymerizable resin or compound (B) contains at least one selected from the group consisting of a citraconimide group, a vinyl group, a maleimide group, a (meth)acryloyl group and an allyl group.
##STR00001##
THERMOPLASTIC RESIN COMPOSITION, METHOD OF PREPARING THE SAME, AND MOLDED ARTICLE MANUFACTURED USING THE SAME
Disclosed is a thermoplastic resin composition, a method of preparing the same, and a molded article manufactured using the same, including a thermoplastic resin composition including 100 parts by weight of a base resin including a vinyl cyanide compound-conjugated diene compound-aromatic vinyl compound graft copolymer (A); a vinyl cyanide compound-conjugated diene compound-aromatic vinyl compound copolymer (B); an acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer (C); a vinyl cyanide compound-aromatic vinyl compound copolymer (D); and a branched vinyl cyanide compound-aromatic vinyl compound copolymer (E) and a high-density polyethylene resin (F), a method of preparing the thermoplastic resin composition, and a molded article manufactured using the thermoplastic resin composition.
THERMOPLASTIC RESIN COMPOSITION, METHOD OF PREPARING THE SAME, AND MOLDED ARTICLE MANUFACTURED USING THE SAME
Disclosed is a thermoplastic resin composition, a method of preparing the same, and a molded article manufactured using the same, including a thermoplastic resin composition including 100 parts by weight of a base resin including a vinyl cyanide compound-conjugated diene compound-aromatic vinyl compound graft copolymer (A); a vinyl cyanide compound-conjugated diene compound-aromatic vinyl compound copolymer (B); an acrylate-aromatic vinyl compound-vinyl cyanide compound graft copolymer (C); a vinyl cyanide compound-aromatic vinyl compound copolymer (D); and a branched vinyl cyanide compound-aromatic vinyl compound copolymer (E) and a high-density polyethylene resin (F), a method of preparing the thermoplastic resin composition, and a molded article manufactured using the thermoplastic resin composition.
COPOLYMER AND COMPOSITE MATERIAL
A copolymer is formed by reacting (A) aromatic monomer, an oligomer thereof, or a polymer thereof, with (B) aliphatic monomer, an oligomer thereof, or a polymer thereof. The aromatic monomer has a chemical structure of
##STR00001##
in which each of R.sup.1 is independently H or CH.sub.3, and n=1-4. R.sup.2 is a single bond, —O—,
##STR00002##
Each of R.sup.3 is independently
##STR00003##
COPOLYMER AND COMPOSITE MATERIAL
A copolymer is formed by reacting (A) aromatic monomer, an oligomer thereof, or a polymer thereof, with (B) aliphatic monomer, an oligomer thereof, or a polymer thereof. The aromatic monomer has a chemical structure of
##STR00001##
in which each of R.sup.1 is independently H or CH.sub.3, and n=1-4. R.sup.2 is a single bond, —O—,
##STR00002##
Each of R.sup.3 is independently
##STR00003##