Provided herein according to some embodiments is a dual cure stereolithography resin that includes thermoplastic particles, which thermoplastic particles are insoluble in the resin and insoluble during a first, light, cure in which an intermediate object is produced, but then dissolve or swell in the intermediate object during the second, heat, cure.

Provided is a heat-curable resin composition capable of being turned into a cured product having a low relative permittivity, a low dielectric tangent, an excellent adhesiveness and a high resistance. The heat-curable resin composition contains: (A) a citraconimide compound; (B) an epoxy resin; (C) an epoxy resin curing agent; and (D) a curing accelerator.

Provided is a heat-curable resin composition capable of being turned into a cured product having a low relative permittivity, a low dielectric tangent, an excellent adhesiveness and a high resistance. The heat-curable resin composition contains: (A) a citraconimide compound; (B) an epoxy resin; (C) an epoxy resin curing agent; and (D) a curing accelerator.

A film containing: a propenyl group-containing resin (A) including, at an end of a molecule, a constituent unit represented by the following formula (1); a radical polymerizable resin or compound (B) other than the propenyl group-containing resin (A); and a curing accelerator (C), wherein the radical polymerizable resin or compound (B) includes at least one selected from the group consisting of a maleimide group and a citraconimide group. In the formula (1), —* represents a bonding hand.

A film containing: a propenyl group-containing resin (A) including, at an end of a molecule, a constituent unit represented by the following formula (1); a radical polymerizable resin or compound (B) other than the propenyl group-containing resin (A); and a curing accelerator (C), wherein the radical polymerizable resin or compound (B) includes at least one selected from the group consisting of a maleimide group and a citraconimide group. In the formula (1), —* represents a bonding hand.

The present disclosure relates to a thermoplastic resin composition including a styrene-based copolymer comprising a (meth)acrylate-based monomer, an aromatic vinyl-based monomer, and a maleimide-based monomer; a first graft copolymer including an acrylic-based rubber polymer, an aromatic vinyl-based monomer, and a vinyl cyanide-based monomer; and a second graft copolymer comprising an acrylic-based rubber polymer, an aromatic vinyl-based monomer, and a vinyl cyanide-based monomer, wherein the styrene-based copolymer has a residual oligomer content of 0.37% by weight or less, and the acrylic-based rubber polymer of the first graft copolymer and the acrylic-based rubber polymer of the second graft copolymer have different average particle diameters. A method of preparing the thermoplastic resin composition, and a molded article including the thermoplastic resin composition are also disclosed.

The present disclosure relates to a thermoplastic resin composition including a styrene-based copolymer comprising a (meth)acrylate-based monomer, an aromatic vinyl-based monomer, and a maleimide-based monomer; a first graft copolymer including an acrylic-based rubber polymer, an aromatic vinyl-based monomer, and a vinyl cyanide-based monomer; and a second graft copolymer comprising an acrylic-based rubber polymer, an aromatic vinyl-based monomer, and a vinyl cyanide-based monomer, wherein the styrene-based copolymer has a residual oligomer content of 0.37% by weight or less, and the acrylic-based rubber polymer of the first graft copolymer and the acrylic-based rubber polymer of the second graft copolymer have different average particle diameters. A method of preparing the thermoplastic resin composition, and a molded article including the thermoplastic resin composition are also disclosed.

The present disclosure relates to a method for preparing a copolymer, a copolymer prepared therefrom, and a thermoplastic resin composition including the copolymer. The method includes introducing and polymerizing an aromatic vinyl-based monomer, a vinyl cyan-based monomer, and an imide-based monomer, wherein the imide-based monomer is introduced at once in an amount of 1 wt % to 24 wt % before the start of polymerization, and is continuously introduced in an amount of 76 wt % to 99 wt % from the start of the polymerization.

The present disclosure relates to a method for preparing a copolymer, a copolymer prepared therefrom, and a thermoplastic resin composition including the copolymer. The method includes introducing and polymerizing an aromatic vinyl-based monomer, a vinyl cyan-based monomer, and an imide-based monomer, wherein the imide-based monomer is introduced at once in an amount of 1 wt % to 24 wt % before the start of polymerization, and is continuously introduced in an amount of 76 wt % to 99 wt % from the start of the polymerization.

An adhesive bonding method that includes bonding a handling wafer to a front side surface of a device wafer with an adhesive comprising N-substituted maleimide copolymers. The device wafer may then be thinned from the backside surface of the device wafer while the device wafer is adhesively engaged to the handling wafer. The adhesive can then be removed by laser debonding, wherein the device wafer is separated from the handling wafer.