Patent classifications
C08F222/40
Adhesive resins for wafer bonding
An adhesive bonding method that includes bonding a handling wafer to a front side surface of a device wafer with an adhesive comprising N-substituted maleimide copolymers. The device wafer may then be thinned from the backside surface of the device wafer while the device wafer is adhesively engaged to the handling wafer. The adhesive can then be removed by laser debonding, wherein the device wafer is separated from the handling wafer.
ACRYLIC RESIN COMPOSITION, AND MOLDED PRODUCT AND FILM MADE FROM SAME
A resin composition includes an acrylic resin and a graft copolymer having a gel content of 65% to 84%, wherein the graft copolymer is a multistage-polymerized graft copolymer obtained by a multistage polymerization including the polymerization stages (I) to (III). In the polymerization stage (I), a first monomer mixture and a polyfunctional monomer are polymerized in a presence of a primary alkyl mercaptan-based chain transfer agent and/or a secondary alkyl mercaptan-based chain transfer agent to obtain a first hard polymer. In the polymerization stage (II), a second monomer mixture and a polyfunctional monomer are poloymerized to obtain a soft polymer. In the polymerization stage (III), a third monomer mixture and a polyfunctional monomer are polymerized to obtain a second hard polymer.
ACRYLIC RESIN COMPOSITION, AND MOLDED PRODUCT AND FILM MADE FROM SAME
A resin composition includes an acrylic resin and a graft copolymer having a gel content of 65% to 84%, wherein the graft copolymer is a multistage-polymerized graft copolymer obtained by a multistage polymerization including the polymerization stages (I) to (III). In the polymerization stage (I), a first monomer mixture and a polyfunctional monomer are polymerized in a presence of a primary alkyl mercaptan-based chain transfer agent and/or a secondary alkyl mercaptan-based chain transfer agent to obtain a first hard polymer. In the polymerization stage (II), a second monomer mixture and a polyfunctional monomer are poloymerized to obtain a soft polymer. In the polymerization stage (III), a third monomer mixture and a polyfunctional monomer are polymerized to obtain a second hard polymer.
Resin composition, resin sheet, multilayer printed wiring board, and semiconductor device
A resin composition of the present invention is a resin composition containing a bismaleimide compound (A) containing a constituent unit represented by the following formula (1), and maleimide groups at both ends of the molecular chain, at least one resin or compound (B) selected from the group consisting of a maleimide compound other than the bismaleimide compound (A), a cyanate compound, a benzoxazine compound, an epoxy resin, a carbodiimide compound, and a compound having an ethylenically unsaturated group, and a photo initiator (C): ##STR00001##
wherein R.sub.1 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; R.sub.2 represents a linear or branched alkylene group having 1 to 16 carbon atoms, or a linear or branched alkenylene group having 2 to 16 carbon atoms; each R.sub.3 independently represents a hydrogen atom, a linear or branched alkyl group having 1 to 16 carbon atoms, or a linear or branched alkenyl group having 2 to 16 carbon atoms; and each n independently represents an integer of 1 to 10.
MALEIMIDE-BASED COPOLYMER, MALEIMIDE-BASED COPOLYMER COMPOSITION, RESIN COMPOSITION, AND INJECTION MOLDED BODY
A maleimide-based copolymer which allows to obtain a resin composition having balanced heat resistance providing property and impact resistance, superior flowabillty, and low yellowness (YI); a maleimide-based copolymer composition using such maleimide-based copolymer; a resin composition.; and an injection molded body are provided. A maleimide-based copolymer, including: aromatic vinyl monomer unit, vinyl cyanide monomer unit, and maleimide monomer unit; wherein: the maleimide-based copolymer has a weight average molecular weight of 50,000 to 110,000; and the maleimide-based copolymer has a mid-point glass transition temperature measured in accordance with JIS K-7121 of 165° C. to 200° C., is provided.
MALEIMIDE-BASED COPOLYMER, MALEIMIDE-BASED COPOLYMER COMPOSITION, RESIN COMPOSITION, AND INJECTION MOLDED BODY
A maleimide-based copolymer which allows to obtain a resin composition having balanced heat resistance providing property and impact resistance, superior flowabillty, and low yellowness (YI); a maleimide-based copolymer composition using such maleimide-based copolymer; a resin composition.; and an injection molded body are provided. A maleimide-based copolymer, including: aromatic vinyl monomer unit, vinyl cyanide monomer unit, and maleimide monomer unit; wherein: the maleimide-based copolymer has a weight average molecular weight of 50,000 to 110,000; and the maleimide-based copolymer has a mid-point glass transition temperature measured in accordance with JIS K-7121 of 165° C. to 200° C., is provided.
Curable mixtures based on xylylene bismaleimide
The inventionrelates to a curable mixture comprising: RM % of m-xylylene bismaleimide of formula (I) ##STR00001##
RP % of a polyimide component, and RC % of a comonomer component. Further, the invention relates to methods for the preparation of the curable mixture, methods for the preparation of a prepolymer, of a crosslinked polymer, and composite materials, in particular of fiber-reinforced composites. In addition, the present invention relates to a prepolymer, a crosslinked polymer and composite materials, in particular fiber-reinforced composites, obtainable by said methods.
Resin composition, and pre-preg, metal-clad laminate, and printed circuit board prepared using the same
A resin composition is provided. The resin composition comprises: (A) a compound having a structure of formula (I), ##STR00001## wherein R.sub.1 is an organic group; and (B) a vinyl-containing elastomer, wherein the weight ratio of the compound having the structure of formula (I) to the vinyl-containing elastomer is 20:1 to 1:1.
Resin composition, and pre-preg, metal-clad laminate, and printed circuit board prepared using the same
A resin composition is provided. The resin composition comprises: (A) a compound having a structure of formula (I), ##STR00001## wherein R.sub.1 is an organic group; and (B) a vinyl-containing elastomer, wherein the weight ratio of the compound having the structure of formula (I) to the vinyl-containing elastomer is 20:1 to 1:1.
Ionomer resin composition, optical film, polarizing plate, and liquid crystal display apparatus
[Objects] Provided is an ionomer resin composition that, when molded into a film shape, is small in both of orientational birefringence and photoelastic birefringence and excellent in transparency, heat resistance, flexibility, and size stability. Additionally, provided are an optical film including the ionomer resin composition, a polarizing plate including the optical film, and a liquid crystal display apparatus including the same. [Solution] An ionomer resin composition according to the present invention is an ionomer resin composition obtained by reacting an acrylic thermoplastic resin (X) including a chain alkyl (meth)acrylate unit (a), an N-substituted maleimide unit (b), and an unsaturated acid and/or unsaturated acid anhydride unit (c) with a metal compound (Y), in which the acrylic thermoplastic resin (X) includes the chain alkyl (meth)acrylate unit (a), the N-substituted maleimide unit (b), and the unsaturated acid and/or unsaturated acid anhydride unit (c) in a total amount of 80% by mass or more, and contents of the structural units (a), (b), and (c) with respect to 100 parts by mass in total of the acrylic thermoplastic resin (X) except for the unsaturated acid and/or unsaturated acid anhydride unit (c) are from 65 to 87 parts by mass, from 1 to 30 parts by mass, and from 0.1 to 5 parts by mass, respectively.