[Objects] Provided is an ionomer resin composition that, when molded into a film shape, is small in both of orientational birefringence and photoelastic birefringence and excellent in transparency, heat resistance, flexibility, and size stability. Additionally, provided are an optical film including the ionomer resin composition, a polarizing plate including the optical film, and a liquid crystal display apparatus including the same. [Solution] An ionomer resin composition according to the present invention is an ionomer resin composition obtained by reacting an acrylic thermoplastic resin (X) including a chain alkyl (meth)acrylate unit (a), an N-substituted maleimide unit (b), and an unsaturated acid and/or unsaturated acid anhydride unit (c) with a metal compound (Y), in which the acrylic thermoplastic resin (X) includes the chain alkyl (meth)acrylate unit (a), the N-substituted maleimide unit (b), and the unsaturated acid and/or unsaturated acid anhydride unit (c) in a total amount of 80% by mass or more, and contents of the structural units (a), (b), and (c) with respect to 100 parts by mass in total of the acrylic thermoplastic resin (X) except for the unsaturated acid and/or unsaturated acid anhydride unit (c) are from 65 to 87 parts by mass, from 1 to 30 parts by mass, and from 0.1 to 5 parts by mass, respectively.

The present invention relates to method for preparing a modified acrylonitrile-butadiene-styrene resin having excellent matteness, impact resistance, and heat resistance, as well as having a low total volatile organic compounds content, and to a modified acrylonitrile-butadiene-styrene resin prepared thereby.

The present invention relates to method for preparing a modified acrylonitrile-butadiene-styrene resin having excellent matteness, impact resistance, and heat resistance, as well as having a low total volatile organic compounds content, and to a modified acrylonitrile-butadiene-styrene resin prepared thereby.

A methacrylic resin composition comprises a methacrylic resin, the methacrylic resin comprising: 50 mass % to 97 mass % of a methacrylic acid ester monomer unit (A); 3 mass % to 30 mass % of a structural unit (B) having a cyclic structure-containing main chain; and 0 mass % to 20 mass % of another vinyl monomer unit (C) that is copolymerizable with a methacrylic acid ester monomer, wherein the methacrylic resin satisfies a specific condition; and the composition has a weight average molecular weight residual ratio of 80% or more upon heating under a nitrogen atmosphere at 280° C. for 1 hour, and has a weight average molecular weight residual ratio of 80% or more upon heating in air at 280° C. for 0.5 hours.

A methacrylic resin composition comprises a methacrylic resin, the methacrylic resin comprising: 50 mass % to 97 mass % of a methacrylic acid ester monomer unit (A); 3 mass % to 30 mass % of a structural unit (B) having a cyclic structure-containing main chain; and 0 mass % to 20 mass % of another vinyl monomer unit (C) that is copolymerizable with a methacrylic acid ester monomer, wherein the methacrylic resin satisfies a specific condition; and the composition has a weight average molecular weight residual ratio of 80% or more upon heating under a nitrogen atmosphere at 280° C. for 1 hour, and has a weight average molecular weight residual ratio of 80% or more upon heating in air at 280° C. for 0.5 hours.

A methacrylic resin composition comprises a methacrylic resin, the methacrylic resin comprising: 50 mass % to 97 mass % of a methacrylic acid ester monomer unit (A); 3 mass % to 30 mass % of a structural unit (B) having a cyclic structure-containing main chain; and 0 mass % to 20 mass % of another vinyl monomer unit (C) that is copolymerizable with a methacrylic acid ester monomer, wherein the methacrylic resin satisfies a specific condition; and the composition has a weight average molecular weight residual ratio of 80% or more upon heating under a nitrogen atmosphere at 280° C. for 1 hour, and has a weight average molecular weight residual ratio of 80% or more upon heating in air at 280° C. for 0.5 hours.

The present invention provides a sealant composition for electronic device, in which the curing does not proceed when heated, which does not cause the problem of use in the mounting process of electronic device. The present invention relates to a sealant composition for electronic device comprising (a) a compound having two or more (meth)acryloyl groups and (c) a nitroxide compound and/or a thiocarbonylthio compound.

The present invention provides a sealant composition for electronic device, in which the curing does not proceed when heated, which does not cause the problem of use in the mounting process of electronic device. The present invention relates to a sealant composition for electronic device comprising (a) a compound having two or more (meth)acryloyl groups and (c) a nitroxide compound and/or a thiocarbonylthio compound.

Provided is a heat-resistant resin composition which includes: a base resin including: a graft copolymer prepared by graft polymerization of a diene-based rubber polymer with an aromatic vinyl-based monomer and a vinyl cyan-based monomer; a first styrene-based copolymer including an aromatic vinyl-based unit and a vinyl cyan-based unit; a second styrene-based copolymer including a maleimide-based unit, an aromatic vinyl-based unit, and a vinyl cyan-based unit; and a carbonate-based polymer; and a third styrene-based copolymer including an aromatic vinyl-based unit and a maleic acid-based unit.

Provided is a heat-resistant resin composition which includes: a base resin including: a graft copolymer prepared by graft polymerization of a diene-based rubber polymer with an aromatic vinyl-based monomer and a vinyl cyan-based monomer; a first styrene-based copolymer including an aromatic vinyl-based unit and a vinyl cyan-based unit; a second styrene-based copolymer including a maleimide-based unit, an aromatic vinyl-based unit, and a vinyl cyan-based unit; and a carbonate-based polymer; and a third styrene-based copolymer including an aromatic vinyl-based unit and a maleic acid-based unit.