Provided are a pressure-sensitive adhesive composition, a pressure-sensitive adhesive film, and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive composition that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics, and a pressure-sensitive adhesive film including the same are provided.

In one or more embodiments, the present invention provides an way to modify the isoprene unit using an alder-ene reaction to form thermoset compounds comprising the resultant electron-deficient, readily crosslinkable polyisobutylene-based rubber that avoids the use of corrosive bromine or chlorine to make the activated butyl rubber, is easier to crosslink than the halobutyls, allows crosslinking with a simple organic base or a peroxide, and has mechanical properties as good as or better than sulfur crosslinked butyl rubbers.

In one or more embodiments, the present invention provides an way to modify the isoprene unit using an alder-ene reaction to form thermoset compounds comprising the resultant electron-deficient, readily crosslinkable polyisobutylene-based rubber that avoids the use of corrosive bromine or chlorine to make the activated butyl rubber, is easier to crosslink than the halobutyls, allows crosslinking with a simple organic base or a peroxide, and has mechanical properties as good as or better than sulfur crosslinked butyl rubbers.

The present application relates to an adhesive composition comprising a curable oligomer and a polymer derived from butylene, an adhesive film comprising same, an organic electronic device comprising same, and a lighting apparatus and a display device comprising same. The adhesive film comprising the adhesive composition shows excellent moisture-blocking properties and enables an organic electronic device to have flexibility as well as excellent and reliable durability at high temperature and high humidity.

The present application relates to an adhesive composition comprising a curable oligomer and a polymer derived from butylene, an adhesive film comprising same, an organic electronic device comprising same, and a lighting apparatus and a display device comprising same. The adhesive film comprising the adhesive composition shows excellent moisture-blocking properties and enables an organic electronic device to have flexibility as well as excellent and reliable durability at high temperature and high humidity.

Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.

Provided are a pressure-sensitive adhesive film and a method of manufacturing an organic electronic device using the same. The pressure-sensitive adhesive film that may effectively block moisture or oxygen penetrated into an organic electronic device from an external environment, and exhibit reliability under harsh conditions such as high temperature and high humidity and excellent optical characteristics is provided.

In one or more embodiments, the present invention provides an way to modify the isoprene unit using an alder-ene reaction to form thermoset compounds comprising the resultant electron-deficient, readily crosslinkable polyisobutylene-based rubber that avoids the use of corrosive bromine or chlorine to make the activated butyl rubber, is easier to crosslink than the halobutyls, allows crosslinking with a simple organic base or a peroxide, and has mechanical properties as good as or better than sulfur crosslinked butyl rubbers.

In one or more embodiments, the present invention provides an way to modify the isoprene unit using an alder-ene reaction to form thermoset compounds comprising the resultant electron-deficient, readily crosslinkable polyisobutylene-based rubber that avoids the use of corrosive bromine or chlorine to make the activated butyl rubber, is easier to crosslink than the halobutyls, allows crosslinking with a simple organic base or a peroxide, and has mechanical properties as good as or better than sulfur crosslinked butyl rubbers.

Provided is a graft copolymer (A) obtainable by graft-polymerizing, in the presence of 30 to 80 parts by mass of an ethylene-based polymer (a), an aromatic vinyl-based monomer (b) and, if necessary, another vinyl-based monomer (c) copolymerizable with the aromatic vinyl-based monomer (b) in a total amount of 20 to 70 parts by mass (provided that the sum of the components (a), (b) and (c) is 100 parts by mass), in which the ethylene-based polymer (a) has a density of 0.900 g/cm.sup.3 or more and less than 0.966 g/cm.sup.3, a number average molecular weight of 10,000 to 50,000, and a molecular weight distribution of 5 to 15, and the proportion of the ethylene-based polymer (a) molecules having a molecular weight of 10,000 or less is 5.5% or more.