Patent classifications
C08F290/06
ELASTIC MATERIALS PREPARED FROM ENERGY-CURABLE LIQUID COMPOSITIONS
An elastic material is provided having an elongation greater than 150% as measured according to ASTM D638-02a, a resiliency greater than 12% as measured according to ASTM D2632-01 (reapproved 2008), and a Shore A hardness of at least 10 as measured by ASTM D2240-15e1. The elastic material is an energy-cured reaction product of a curable composition that is a liquid at 25° C. The curable composition includes at least a) relatively high molecular weight (meth)acrylate-functionalized oligomer having no more than two (meth)acrylate functional groups per molecule on average; b) at least one mono(meth)acrylate-functionalized monomer having a molecular weight of less than 500 Daltons and a single (meth)acrylate functional group per molecule and/or an ethylenically unsaturated nitrogen-containing monomer; and c) at least one multi(meth)acrylate-functionalized monomer having a molecular weight of less than 1000 Daltons and at least two (meth)acrylate functional groups per molecule.
SELF-HEALING OLIGOMERS AND THE USE THEREOF
Disclosed herein are self-healing oligomers according to the structure [UPy-(D.sub.m-U-D.sub.m)(.sub.2+q)]-[A(G)(.sub.n−1)-D.sub.m].sub.k-Z; wherein UPy, D, m, U, q, A, G, n, k, and Z are defined and described further herein, and wherein the oligomer possesses at least 3 urethane linking groups and comprises a backbone derived from a polyether polyol, a polyester polyol, a poly(dimethylsiloxane), a disulfide polyol, or combinations thereof. Also described and claimed are various compositions containing such oligomers as part of a self-healing component, wherein such compositions also include an optional reactive monomer and/or oligomer component and a photoinitiator component. Yet further described and claimed are articles cured from the compositions elsewhere described using the oligomers elsewhere described.
RADIATION POLYMERIZABLE COMPOSITION, CURED LAYER OF SAME, OPTICAL FIBER CONTAINING CURED LAYER AND METHOD FOR PRODUCING SAME
[Problem] To provide a radiation curable resin composition that is suitable as a primary material of an optical fiber and has a fast curing rate by irradiation with radiation.
[Solution] A radiation polymerizable composition for forming a primary coating layer of an optical fiber, the radiation polymerizable composition comprising: (A) a urethane oligomer comprising a structure represented by formula (I) below:
##STR00001## wherein R is a vinyl group and * is a bond; (B) one or more compounds of: (i) maleic anhydride, (ii) a compound represented by formula (II):
##STR00002## wherein R.sup.1 is a single bond or an alkanediyl group comprising 1 to 6 carbon atoms, and R.sup.2 is a hydrogen atom, a hydroxy group, or a group represented by predetermined formula (II-1) or formula (II-2), or (iii) a compound represented by formula (III):
##STR00003## wherein R.sup.5 is an alkanediyl group comprising 1 to 6 carbon atoms; and (C) a radiation polymerization initiator.
PHOTOSENSITIVE RESIN COMPOSITION, MOLDED ARTICLE THAT IS PROVIDED WITH PATTERN, AND METHOD FOR PRODUCING MOLDED ARTICLE THAT IS PROVIDED WITH PATTERN
Disclosed is a photosensitive resin composition containing a polymerizable component and used to form a resin layer in an imprint method including forming a reverse pattern of a pattern of a mold on a resin layer by using the mold having the pattern. The polymerizable component contains an organic sulfur compound. A viscosity of the photosensitive resin composition at 25° C. is less than 20 mPa.Math.s.
PHOTOSENSITIVE RESIN COMPOSITION, MOLDED ARTICLE THAT IS PROVIDED WITH PATTERN, AND METHOD FOR PRODUCING MOLDED ARTICLE THAT IS PROVIDED WITH PATTERN
Disclosed is a photosensitive resin composition containing a polymerizable component and used to form a resin layer in an imprint method including forming a reverse pattern of a pattern of a mold on a resin layer by using the mold having the pattern. The polymerizable component contains an organic sulfur compound. A viscosity of the photosensitive resin composition at 25° C. is less than 20 mPa.Math.s.
POLYMERIZABLE ABSORBERS OF UV AND HIGH ENERGY VISIBLE LIGHT
Described are polymerizable high energy light absorbing compounds of formula I:
##STR00001##
wherein R.sup.1, R.sup.2, R.sup.3, R.sup.4, R.sup.5, R.sup.6, R.sup.7, R.sup.8, R.sup.9, and X are as described herein. The compounds absorb various wavelengths of ultraviolet and/or high energy visible light and are suitable for incorporation in various products, such as biomedical devices and ophthalmic devices.
ANTI-MICROBIAL HYDROGEL
Hydrogels are provided that include an antimicrobial agent and a cross-linkable urethane-based polymer (CUP). Such hydrogels may be used for the controlled-release of antimicrobial agents as well as in the manufacturing of wound dressings. Wound dressings are provided that comprise a hydrogel as defined herein.
POLYESTER-ACRYLIC HYBRID RESINS FOR COMPOSTABLE ADHESIVES
Water-based and solvent-based polyester-(meth)acrylate hybrid polymers that may be utilized as compostable pressure-sensitive adhesives are provided. The aqueous dispersions exhibit an improved shelf-life and provide an improvement in handling and application or deposition/coating onto a variety of substrates, such as for making a pressure sensitive adhesive construct.
Photopolymerisable composition, material obtained by polymerising such a composition and 3D printing method using such a composition
A photopolymerizable composition comprises at least a polymerizable resin, a photosensitizer, an annihilator, and a photoinitiator. The photosensitizer is formulated to absorb an excitation light signal received in a first range of wavelengths. The annihilator is formulated to emit a light signal in a second range of wavelengths different from the first. During the absorption of light by the photosensitizer in the first range of wavelengths, the annihilator emits a light signal in the second range, a photon energy of the emitted light signal being greater than a photon energy of the light signal received by the photosensitizer. The annihilator is also formulated to implement an energy transfer mechanism to excite the photoinitiator for polymerization of the resin. The excited photoinitiator is formulated to generate at least one polymerizable initiator to cause the polymerization reaction. Related methods, such as three-dimensional printing methods, and materials are also disclosed.
Dual-cure method and system for fabrication of 3D polymeric structures cross-reference to earlier applications
A dual-cure method for forming a solid polymeric structure is provided. An end-capped, imide-terminated prepolymer is combined with at least one photopolymerisable olefinic monomer, at least one photoinitiator, and a diamine, to form a curable resin composition, which, in a first step, is irradiated under conditions effective to polymerize the at least one olefinic monomer, thus forming a scaffold composed of the prepolymer and the polyolefin with the diamine trapped therein. The irradiated composition is then thermally treated at a temperature effective to cause a transimidization reaction to occur between the prepolymer and the diamine, thereby releasing the end caps of the prepolymer and providing the solid polymeric structure. A curable resin composition comprising an end-capped, imide-terminated prepolymer, at least one photopolymerisable olefinic monomer, at least one photoinitiator, and a diamine, is also provided, as are related methods of use.