PCE-type copolymers in powder form can be obtained by spry-drying and are easily re-dispersed in water. The fineness and the anti-caking properties of said PCE-type copolymers in powder form, as well as their water reduction potential and influence on slump life are improved. A production process of said PCE-type copolymers in powder form is by a spray-drying method, and PCE-type copolymers can be used for the improvement of mineral binder compositions and especially dry mortars.

PCE-type copolymers in powder form can be obtained by spry-drying and are easily re-dispersed in water. The fineness and the anti-caking properties of said PCE-type copolymers in powder form, as well as their water reduction potential and influence on slump life are improved. A production process of said PCE-type copolymers in powder form is by a spray-drying method, and PCE-type copolymers can be used for the improvement of mineral binder compositions and especially dry mortars.

PCE-type copolymers in powder form can be obtained by spry-drying and are easily re-dispersed in water. The fineness and the anti-caking properties of said PCE-type copolymers in powder form, as well as their water reduction potential and influence on slump life are improved. A production process of said PCE-type copolymers in powder form is by a spray-drying method, and PCE-type copolymers can be used for the improvement of mineral binder compositions and especially dry mortars.

The present invention relates to provision of a photosensitive resin composition containing (A) a photopolymerizable compound having an ethylenically unsaturated group and an acidic substituent, and (B) a photopolymerization initiator, wherein at least one of the components contained in the photosensitive resin composition is a component including a dicyclopentadiene structure; a photosensitive resin film using the foregoing photosensitive resin composition; a printed wiring board and a method for producing the same; and a semiconductor package.

Conventionally, a photocurable composition to which an ultraviolet absorber is added is difficult to form a colorless and transparent cured resin because the ultraviolet absorber itself is colored, and thus the photocurable composition is hardly to be used in a display apparatus required for colorlessness and transparency. Provided is a photocurable composition including a specific compound, wherein a light transmittance of 385 nm is 50% or less and a yellowness index is 3.0 or less in a state in which a cured resin having a thickness of 200 μm or less is interposed between alkali free glass plates each having a thickness of 0.7 mm.

Objects are to provide a fluorine-containing active energy ray curable resin which may be suitably used as a surfactant in an aqueous active energy ray curable resin composition, to provide an active energy ray curable resin composition including the resin, and to provide a cured product obtained by curing the composition. Specifically, a fluorine-containing active energy ray curable resin is provided which includes a polymer structure (a1) derived from a radically polymerizable unsaturated monomer, a poly(perfluoroalkylene ether) chain (a2), a radically polymerizable unsaturated group (a3), and an acid group forming a neutral salt structure (a4). Also provided are a surfactant including the fluorine-containing active energy ray curable resin; an active energy ray curable resin composition including the fluorine-containing active energy ray curable resin, an active energy ray curable hydrophilic resin other than the fluorine-containing active energy ray curable resin, and water; and a cured film of the composition.

Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and another thermosetting resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the other thermosetting resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.

Disclosed are a thermosetting resin composition, a prepreg made therefrom, a laminate clad with a metal foil, and a high-frequency circuit board, wherein the thermosetting resin composition contains thermosetting ingredients. The thermosetting ingredients include a phosphorus-containing monomer or a phosphorus-containing resin and another thermosetting resin containing an unsaturated group, and the phosphorus-containing monomer or the phosphorus-containing resin has a structure as shown in formula I. By using the phosphorus-containing monomer or the phosphorus-containing resin as a cross-linking agent of the other thermosetting resin containing an unsaturated group and by means of a cross-linking reaction of a large number of unsaturated double bonds in the resin, the high-frequency dielectric properties and high-temperature-resistance required by a circuit substrate are provided.

The present disclosure provides a photopolymerizable composition. The photopolymerizable composition includes at least one urethane component, at least one monofunctional reactive diluent, an initiator, and optionally an inhibitor. The present disclosure also provides an article including the reaction product of the photopolymerizable composition. Further, the present disclosure provides a method of making an article. The method includes (i) providing a photopolymerizable composition and (ii) selectively curing the photopolymerizable composition to form an article. The method optionally also includes (iii) curing unpolymerized urethane component and/or reactive diluent remaining after step (ii). Further, methods are provided, including receiving, by a manufacturing device having one or more processors, a digital object comprising data specifying an article; and generating, with the manufacturing device by an additive manufacturing process, the article based on the digital object. A system is also provided, including a display that displays a 3D model of an article; and one or more processors that, in response to the 3D model selected by a user, cause a 3D printer to create a physical object of an article.

A composition with improved adhesive and sealant properties comprising a) a pre-polymer comprising a polymeric unit of the general formula (-A-B-).sub.n, wherein A represents a substituted or un-substituted ester, B represents a substituted or un-substituted acid ester comprising at least two acid ester functionalities, and n represents an integer greater than 1, and b) an anhydride compound.