There is provided a composition for forming an EUV resist overlayer film that is used in an EUV lithography process, that does not intermix with the EUV resist, that blocks unfavorable exposure light for EUV exposure, for example, UV light and DUV light and selectively transmits EUV light alone, and that can be developed with a developer after exposure. A composition for forming an EUV resist overlayer film used in an EUV lithography process including a resin containing a naphthalene ring in a main chain or in a side chain and a solvent, in which the resin may include a hydroxy group, a carboxy group, a sulfo group, or a monovalent organic group having at least one of these groups as a hydrophilic group.

A photosensitive resin composition comprises: a resin having a phenolic hydroxyl group; a photosensitive acid generator; a compound having at least one selected from the group consisting of an aromatic ring, a heterocycle and an alicycle, and at least one selected from the group consisting of a methylol group and an alkoxyalkyl group; an aliphatic compound having two or more functional groups being at least one selected from the group consisting of an acryloyloxy group, a methacryloyloxy group, a glycidyloxy group, an oxetanyl alkyl ether group, a vinyl ether group and a hydroxyl group; and a compound having at least one skeleton selected from the group consisting of an anthracene skeleton, a phenanthrene skeleton, a pyrene skeleton, a perylene skeleton, a carbazole skeleton, a phenothiazine skeleton, a xanthone skeleton, a thioxanthone skeleton, an acridine skeleton, a phenylpyrazoline skeleton, a distyrylbenzene skeleton and a distyrylpyridine skeleton, or a benzophenone compound.

A photosensitive composition for the formation of resist underlayer films that contains a novolac phenolic resin resulting from an acid-catalyzed reaction between one or more phenolic trinuclear compounds (A) selected from the group consisting of the compounds of general formula (1) and the compounds of general formula (2) and an aldehyde (B).

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In the formulae, R.sup.1, R.sup.2, and R.sup.3 each independently represent a substituted or unsubstituted alkyl having 1 to 8 carbon atoms, R.sup.4 represents hydrogen, substituted or unsubstituted alkyl, or substituted or unsubstituted aryl, p and q are each independently an integer of 1 to 4, r is an integer of 0 to 4, and s is 1 or 2, with the proviso that the sum of r and s is 5 or less.

The present invention relates to a cleaning implement that includes a melamine-formaldehyde foam. The melamine-formaldehyde foam cleaning implement has a d90/d10 ratio above 1.65 and a compression deflection force above 3.25 psi. Additionally the present invention encompasses processes for making and methods for cleaning hard surfaces with a cleaning implement according to the present invention.

The present invention relates to a cleaning implement that includes a melamine-formaldehyde foam. The melamine-formaldehyde foam cleaning implement has a d90/d10 ratio above 1.65 and a compression deflection force above 3.25 psi. Additionally the present invention encompasses processes for making and methods for cleaning hard surfaces with a cleaning implement according to the present invention.

A production method of an addition condensation product includes a step at which an aromatic compound, a carbonyl compound, and a catalyst are mixed in a reaction solvent, and an addition condensation reaction of the aromatic compound and the carbonyl compound is conducted in the temperature range of 60 to 97° C., both inclusive, to obtain the addition condensation product of the aromatic compound and the carbonyl compound. At the step to obtain the addition condensation product, 1 mole of the aromatic compound is mixed with 0.1 to 0.999 mole, both inclusive, of the carbonyl compound as the mole ratio. A ratio of the aromatic compound dimer to the aromatic compound multimer is in the range of 1:75 to 1:1,000.

Described herein are polyoxymethylene (POM) compositions comprising polyoxymethylene and styrene maleic anhydride (SMA) copolymers or modified SMA copolymers, said POM compositions exhibiting improved physical properties such as heat deflection temperatures compared to POM compositions which do not comprise SMA copolymers.

The present invention relates to a cleaning implement that includes a melamine-formaldehyde foam. The melamine-formaldehyde foam cleaning implement has a d90/d10 ratio above 1.65 and a compression deflection force above 3.25 psi. Additionally the present invention encompasses processes for making and methods for cleaning hard surfaces with a cleaning implement according to the present invention.

The present invention relates to a cleaning implement that includes a melamine-formaldehyde foam. The melamine-formaldehyde foam cleaning implement has a d90/d10 ratio above 1.65 and a compression deflection force above 3.25 psi. Additionally the present invention encompasses processes for making and methods for cleaning hard surfaces with a cleaning implement according to the present invention.

The present invention relates to a novel compound having an alkoxysilyl group and an active ester group, a method for preparing the same, a composition comprising the same, and a use, wherein the novel compound exhibits improved low moisture absorption and/or low dielectric properties when cured as an epoxy composition, but is not accompanied by loss of thermal expansion characteristics. Disclosed are a novel compound of formulae AF to LF having an alkoxysilyl group and an active ester group, and a method for preparing the same, a composition comprising the same, and a use of same.