C08G8/08

Polyoxymethylene compositions
11827779 · 2023-11-28 · ·

Described herein are polyoxymethylene (POM) compositions comprising polyoxymethylene and styrene maleic anhydride (SMA) copolymers or modified SMA copolymers, said POM compositions exhibiting improved physical properties such as heat deflection temperatures compared to POM compositions which do not comprise SMA copolymers.

Polyoxymethylene compositions
11827779 · 2023-11-28 · ·

Described herein are polyoxymethylene (POM) compositions comprising polyoxymethylene and styrene maleic anhydride (SMA) copolymers or modified SMA copolymers, said POM compositions exhibiting improved physical properties such as heat deflection temperatures compared to POM compositions which do not comprise SMA copolymers.

Thermosetting resin composition, prepreg, metal-clad laminate, printed wiring board, film with resin, and metal foil with resin

A thermosetting resin composition contains a thermosetting resin and an inorganic filler. The thermosetting resin includes a curing agent. A 3 mass % methyl ethyl ketone solution of the curing agent has a Gardner color scale of 15 or more. The content of the curing agent accounts for 10 mass % or more of a total solid content of the thermosetting resin composition.

Thermosetting resin composition, prepreg, metal-clad laminate, printed wiring board, film with resin, and metal foil with resin

A thermosetting resin composition contains a thermosetting resin and an inorganic filler. The thermosetting resin includes a curing agent. A 3 mass % methyl ethyl ketone solution of the curing agent has a Gardner color scale of 15 or more. The content of the curing agent accounts for 10 mass % or more of a total solid content of the thermosetting resin composition.

ISOCYANATE COMPOSITION AND BINDER SYSTEM CONTAINING SAID ISOCYANATE COMPOSITION

What is described are isocyanate compositions comprising β-dicarbonyl compounds and a binder system, especially for use in a process from the group consisting of polyurethane cold-box process and polyurethane no-bake process, with this isocyanate composition as polyisocyanate component.

Material for forming underlayer film for lithography, composition for forming underlayer film for lithography, underlayer film for lithography and production method thereof, pattern forming method, resin, and purification method

The present embodiment provides a material for forming an underlayer film for lithography, containing at least any of a compound represented by following formula (1) or a resin including a structural unit derived from a compound represented by the following formula (1), ##STR00001##
wherein R.sup.1 represents a 2n-valent group having 1 to 60 carbon atoms, or a single bond, each R.sup.2 independently represents a halogen atom, a straight, branched or cyclic alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, an alkoxy group having 1 to 30 carbon atoms, a thiol group, a hydroxyl group, or a group where a hydrogen atom of a hydroxyl group is substituted with an acid-dissociable group, and may be the same or different in the same naphthalene ring or benzene ring, in which at least one R.sup.2 represents a group where a hydrogen atom of a hydroxyl group is substituted with an acid-dissociable group, n is an integer of 1 to 4, and structural formulae of n structural units in square brackets [ ] may be the same or different when n is an integer of 2 or more, X represents an oxygen atom, a sulfur atom, or a non-bridging group, each m.sup.2 is independently an integer of 0 to 7, provided that at least one m.sup.2 is an integer of 1 to 7, and each q is independently 0 or 1.

BINDER, METHOD FOR MANUFACTURING SAME AND METHOD FOR MANUFACTURING CASTING SAND MOLD
20210147605 · 2021-05-20 · ·

Provided are a binder in the producing of a casting sand mold according to an ink jet type lamination shaping method in which a binder is printed with respect to sand, a method for producing the binder, and a method for producing a casting sand mold using the binder. Specifically, provided are a binder useful for a casting sand mold of an ink jet type, containing: a resol-type phenolic resin that is obtained by reacting aldehydes (A1), phenols (P1), and a compound (N) having two or more phenolic hydroxyl groups in one molecule or by reacting the aldehydes (A1) and a novolac-type phenolic resin (N1), in the presence of an alkali catalyst, and has a dispersion degree (Mw/Mn) of 1.0 to 3.5 and a phenolic monomer residue of 5% or less, a method for producing the binder, and a method for producing a casting sand mold.

BINDER, METHOD FOR MANUFACTURING SAME AND METHOD FOR MANUFACTURING CASTING SAND MOLD
20210147605 · 2021-05-20 · ·

Provided are a binder in the producing of a casting sand mold according to an ink jet type lamination shaping method in which a binder is printed with respect to sand, a method for producing the binder, and a method for producing a casting sand mold using the binder. Specifically, provided are a binder useful for a casting sand mold of an ink jet type, containing: a resol-type phenolic resin that is obtained by reacting aldehydes (A1), phenols (P1), and a compound (N) having two or more phenolic hydroxyl groups in one molecule or by reacting the aldehydes (A1) and a novolac-type phenolic resin (N1), in the presence of an alkali catalyst, and has a dispersion degree (Mw/Mn) of 1.0 to 3.5 and a phenolic monomer residue of 5% or less, a method for producing the binder, and a method for producing a casting sand mold.

COMPOSITION AND SUBSTRATE-TREATING METHOD

A composition enables particles to be removed from a surface of a substrate by: applying the composition on the surface of the substrate to form a substrate treatment film on the surface; and bringing a liquid into contact with the substrate treatment film to remove the substrate treatment film from the surface. The composition includes a resin; and a solvent. The solvent includes a first solvent component having a normal boiling point of no less than 175° C. A content of the first solvent component with respect to 100 parts by mass of the resin is no less than 1 part by mass.

COMPOUND, RESIN, COMPOSITION, RESIST PATTERN FORMATION METHOD AND CIRCUIT PATTERN FORMATION METHOD
20210070685 · 2021-03-11 ·

The present invention provides a compound having a specific structure represented by the following formula (0), a resin having a constituent unit derived from the compound, various compositions containing the compound and/or the resin, and various methods using the compositions.

##STR00001##