A paraffin inhibitor composition that exhibits stable properties at low temperature is provided. The composition may contain, for instance, an alkylphenol copolymer having the following repeating units (A) and (B):

##STR00001##

wherein, x is an integer from 1 to 200; y is an integer from 2 to 200; R.sub.1 is a straight or branched C.sub.1-C.sub.15 alkyl; and R.sub.2 is a straight or branched C.sub.16-C.sub.40 alkyl.

An alkylphenol copolymer, such as for use in a petroleum composition, is provided. The alkylphenol copolymer has the following repeating units (A) and (B):

##STR00001##

wherein, x is an integer from 1 to 200; y is an integer from 2 to 200; R.sub.1 is a straight or branched C.sub.1-C.sub.15 alkyl; and R.sub.2 is a straight or branched C.sub.2-C.sub.40 alkyl, wherein R.sub.2 is different than R.sub.1.

In one embodiment, an alkylphenol copolymer is disclosed wherein the copolymer comprises at least one alkylphenol monomer and the alkylphenol copolymer exhibits the following: an oscillation displacement of greater than 0 at a temperature of 5 C. in a first oscillation temperature sweep and an oscillation displacement in a second oscillation temperature sweep within 25% of the oscillation displacement in the first oscillation temperature sweep at a temperature of 5 C. In a further embodiment, a petroleum composition is disclosed wherein the composition comprises a petroleum source and a macromolecular compound wherein the macromolecular compound exhibits the following: an oscillation displacement of greater than 0 at a temperature of 10 C. in a first oscillation temperature sweep, and an oscillation displacement in a second oscillation temperature sweep within 25% of the oscillation displacement in the first oscillation temperature sweep at a temperature of 10 C.

Processes for manufacturing novolacs and resoles from lignin are disclosed. A phenol-aldehyde-lignin dispersion is formed which can then be used to make either a novolac or a resole, depending upon the catalysts used.

The material for forming a film for lithography according to the present invention contains a compound represented by the following formula (1): ##STR00001##
wherein, each R.sup.0 independently represents a monovalent group having an oxygen atom, a monovalent group having a sulfur atom, a monovalent group having a nitrogen atom, a hydrocarbon group or a halogen atom, and each p is independently an integer of 0 to 4.

The material for forming a film for lithography according to the present invention contains a compound represented by the following formula (1): ##STR00001##
wherein, each R.sup.0 independently represents a monovalent group having an oxygen atom, a monovalent group having a sulfur atom, a monovalent group having a nitrogen atom, a hydrocarbon group or a halogen atom, and each p is independently an integer of 0 to 4.

In lithography, a composition comprising a novolak resin comprising recurring units derived from a phenolphthalein, Phenol Red, Cresolphthalein, Cresol Red, or Thymolphthalein is used to form a photoresist underlayer film. The underlayer film is strippable in alkaline water, without causing damage to ion-implanted Si substrates or SiO.sub.2 substrates.

In lithography, a composition comprising a novolak resin comprising recurring units derived from a phenolphthalein, Phenol Red, Cresolphthalein, Cresol Red, or Thymolphthalein is used to form a photoresist underlayer film. The underlayer film is strippable in alkaline water, without causing damage to ion-implanted Si substrates or SiO.sub.2 substrates.

The present disclosure generally relates to adhesive compositions, adhesive articles including the adhesive compositions, methods of making the adhesive compositions and articles, and methods of using the adhesive compositions and articles. The adhesive compositions of the present disclosure include a thermoplastic phenolic resin made from the reaction of (1) alkyl phenol (e.g., butyl- or octyl- or -nonyl) and formaldehyde; or (2) alkyl phenol (e.g., butyl- or octyl-) and acetaldehyde; or (3) alkyl phenol (e.g., butyl- or octyl-) and acetylene. The present disclosure also generally relates to adhesive articles including these adhesive compositions. The inventors of the present disclosure found that such adhesive articles exhibit excellent adhesion to architectural coatings with including low or no VOCs, deep base formulations, and/or formulations including primer in various conditions, including, for example, high humidity.

The invention provides a composition for forming an organic film, which generates no by-product even under such a film formation condition in an inert gas to prevent substrate corrosion, which is capable of forming an organic film not only excellent in properties of filling and planarizing a pattern formed on a substrate but also favorable for dry etching resistance during substrate processing, and further which causes no fluctuation in film thickness of the film due to thermal decomposition even when a CVD hard mask is formed on the organic film. The composition for forming an organic film includes (A) a polymer having a repeating unit shown by the following general formula (1) and (B) an organic solvent.

##STR00001##