Disclosed herein are polymers formed by the condensation of bis(hydroxycarbyl)-aminophenolic compounds with aldehydes. The condensation polymers include one or more repeat units having bis(hydroxycarbyl)amino functionality. The hydroxyl groups of the bis(hydroxycarbyl)amino functionalities are available for further condensation with an epoxide, such as ethylene oxide, to yield a polyalkoxylated polymer. The polymers are useful as antipolymerants, polymerization retardants, surfactants, or a combination of these in one or more industrial systems.

Provided are a thermally emissive coating material composition, a thermally emissive coating and a coating forming method without any thermally emissive filler. Such a thermally emissive coating material composition has a structure in which a straight alkyl with 4 to 16 carbons atoms is bonded to a phenol nucleus of a resol-type phenolic resin via an ether bond. The thermally emissive coating material composition may be formed by dehydrogenative condensation of a resol-type phenolic resin with a linear primary alcohol with 4 to 16 carbon atoms. The thermally emissive coating material composition forms a thermally emissive coating on a surface of a base material.

This invention relates to compositions and a process for stabilizing or improving the solubility of a phenolic resin containing a mixture of linear phenolic resins and calixarenes in a hydrocarbon solvent. This invention also relates to a paraffin-containing fluid composition comprising this stabilized (solubilized) calixarene resin. The invention also relates to methods for dispersing paraffin crystals, inhibiting paraffin crystal deposition, or treating a well or vessel to reduce the deposition of paraffin crystals, with a resin composition containing this stabilized (solubilized) calixarene resin.

This invention relates to compositions and a process for stabilizing or improving the solubility of a phenolic resin containing a mixture of linear phenolic resins and calixarenes in a hydrocarbon solvent. This invention also relates to a paraffin-containing fluid composition comprising this stabilized (solubilized) calixarene resin. The invention also relates to methods for dispersing paraffin crystals, inhibiting paraffin crystal deposition, or treating a well or vessel to reduce the deposition of paraffin crystals, with a resin composition containing this stabilized (solubilized) calixarene resin.

Storage stable polyhydroxylated aromatic ether adducts of polyalkylene oxide are described. Reactive compositions are formed by combining an ether adduct with an aldehyde, optionally further adding a phenolic-aldehyde prepolymer. The reactive compositions are cured by removing water, by acidification, or both. The cured compositions sorb solvated compounds from environments containing water. The cured compositions are also useful for pre-loading with compounds that are subsequently released at a controlled rate into environments containing water.

In a method in which a workpiece, while being temporarily fixed on a support via a temporary fixing material, is processed and/or transported and thereafter the support and the workpiece are separated from each other by an irradiation separation method, a technique is shown which prevents the photo-degradation of the workpiece.

A workpiece treating method includes a step of forming a stack including a support, a temporary fixing material and a workpiece wherein the temporary fixing material includes a layer (I) that contains a polymer (A) including a structural unit (A1); a step of processing the workpiece and/or transporting the stack; a step of applying light to the layer (I) through the support; and a step of separating the support and the workpiece from each other.

##STR00001##

The invention relates to a curable resin that represents an excellent substitute for phenolic resins and is therefore able to replace phenolic resins in all applications in which they are used. Said resin is characterised in that it comprises: (1) at least one prepolymer resulting from the prepolymerisation of a compound A comprising at least one aromatic or heteroaromatic ring, a first group OCH2-CCH and at least one second group selected from the groups OCH2-CCH2 and CH2-CHCH2, said groups being carried by the at least one aromatic or heteroaromatic ring; and (2) a compound B comprising at least two thiol groups (SH). The invention also relates to a material obtained by curing said curable resin, and in particular to an ablative composite material. The invention further relates to a material obtained by curing said curable resin.

The invention relates to a curable resin that represents an excellent substitute for phenolic resins and is therefore able to replace phenolic resins in all applications in which they are used. Said resin is characterised in that it comprises: (1) at least one prepolymer resulting from the prepolymerisation of a compound A comprising at least one aromatic or heteroaromatic ring, a first group OCH2-CCH and at least one second group selected from the groups OCH2-CCH2 and CH2-CHCH2, said groups being carried by the at least one aromatic or heteroaromatic ring; and (2) a compound B comprising at least two thiol groups (SH). The invention also relates to a material obtained by curing said curable resin, and in particular to an ablative composite material. The invention further relates to a material obtained by curing said curable resin.

A compound of Formula A-1: ##STR00001##
where n is an integer and R is C.sub.1-10 alkyl. In some cases, n is an integer of 1 to 20 or 5 to 15. R may be substituted or unsubstituted. An adhesive composition may include a compound of Formula A-1. The adhesive composition may include at least one of a crosslinker, a catalyst, and a solvent. An imprint lithography stack may include a substrate and an adhesion layer adhered to the substrate, where the adhesion layer includes a compound of Formula A-1. Forming an adhesion layer on an imprint lithography substrate includes disposing an adhesive composition on the imprint lithography substrate and polymerizing the adhesive composition to yield the adhesion layer on the substrate, where the adhesive composition includes a compound of Formula A-1, where n is an integer and R is C.sub.1-10 alkyl.

A compound of Formula A-1: ##STR00001##
where n is an integer and R is C.sub.1-10 alkyl. In some cases, n is an integer of 1 to 20 or 5 to 15. R may be substituted or unsubstituted. An adhesive composition may include a compound of Formula A-1. The adhesive composition may include at least one of a crosslinker, a catalyst, and a solvent. An imprint lithography stack may include a substrate and an adhesion layer adhered to the substrate, where the adhesion layer includes a compound of Formula A-1. Forming an adhesion layer on an imprint lithography substrate includes disposing an adhesive composition on the imprint lithography substrate and polymerizing the adhesive composition to yield the adhesion layer on the substrate, where the adhesive composition includes a compound of Formula A-1, where n is an integer and R is C.sub.1-10 alkyl.