Patent classifications
C08G59/10
AQUEOUS RESIN DISPERSION AND AQUEOUS COATING COMPOSITION CONTAINING SAID RESIN DISPERSION
Described herein is an aqueous resin dispersion (AD) including a resin component (R) including at least one di- and/or polyfunctional monomeric primary and/or secondary amine (M) and polyfunctional polymeric organic amines having primary and/or secondary amino groups. Also described herein is an aqueous two-component coating composition including the resin dispersion.
Epoxy resin composition, curable resin composition, and fiber-reinforced composite material
The present invention provides an epoxy resin composition that contains an epoxy resin (A) that is a product of reaction between an epihalohydrin and either catechol, optionally with its aromatic ring methyl-substituted, or pyrogallol, optionally with its aromatic ring methyl-substituted, and an aromatic glycidylamine epoxy resin (B). This epoxy resin composition is suitable for use in fiber-reinforced composite materials, fiber-reinforced plastic articles, etc., by virtue of being liquid at room temperature, being superior in quick curing, and high mechanical properties in its cured form.
ADHESIVE PRODUCTS USING OILSEED SOLIDS AND POLYISOCYANATES
Methods of making and using adhesive compositions based on oilseed solids are provided. Also provided are adhesive compositions made using the methods. The adhesive compositions are made by mixing defatted oilseed solids with a polyisocyanate to form a non-aqueous adhesive composition and, subsequently, mixing the non-aqueous adhesive composition with water to form an aqueous adhesive composition.
One-component epoxy-modified polyurethane and/or polyurea adhesives having high elongation and excellent thermal stability, and assembly processes using same
A one-component epoxy-modified polyurethane and/or urea adhesive includes very high levels of reactive urethane group- and/or urea group-containing tougheners, an epoxy resin and epoxy hardener. These adhesives are formulated to cure at high temperatures and surprisingly provide high elongations, excellent thermal stability and good adhesive properties.
One-component epoxy-modified polyurethane and/or polyurea adhesives having high elongation and excellent thermal stability, and assembly processes using same
A one-component epoxy-modified polyurethane and/or urea adhesive includes very high levels of reactive urethane group- and/or urea group-containing tougheners, an epoxy resin and epoxy hardener. These adhesives are formulated to cure at high temperatures and surprisingly provide high elongations, excellent thermal stability and good adhesive properties.
EPOXY RESIN COMPOSITION, CURABLE RESIN COMPOSITION, AND FIBER-REINFORCED COMPOSITE MATERIAL
The present invention provides an epoxy resin composition that contains an epoxy resin (A) that is a product of reaction between an epihalohydrin and either catechol, optionally with its aromatic ring methyl-substituted, or pyrogallol, optionally with its aromatic ring methyl-substituted, and an aromatic glycidylamine epoxy resin (B). This epoxy resin composition is suitable for use in fiber-reinforced composite materials, fiber-reinforced plastic articles, etc., by virtue of being liquid at room temperature, being superior in quick curing, and high mechanical properties in its cured form.
GLYCIDYL AMINE EPOXY RESINS BASED ON AMES NEGATIVE AMINES
A glycidyl amine epoxy resin(s) and a process for production of glycidyl amine epoxy resin(s) are disclosed. The glycidyl amine epoxy resin(s) is/are free from Bisphenol A (BPA) and Bisphenol F (BPF) and are based on AMES negative amine precursors.
GLYCIDYL AMINE EPOXY RESINS BASED ON AMES NEGATIVE AMINES
A glycidyl amine epoxy resin(s) and a process for production of glycidyl amine epoxy resin(s) are disclosed. The glycidyl amine epoxy resin(s) is/are free from Bisphenol A (BPA) and Bisphenol F (BPF) and are based on AMES negative amine precursors.
Rapid curing thiol epoxy resin with improved compression strength performance
Aspects described herein generally describe epoxy resins and methods of epoxy resin formation. In some embodiments, a resin includes the reaction product of one or more polythiols, one or more polyepoxides, one or more fillers and one or more amine catalysts. Polythiols have between two and about ten thiol moieties. Polyepoxides have between two and about ten epoxy moieties. One or more amine catalysts of the formula NR.sub.1R.sub.2R.sub.3, wherein each of R.sub.1, R.sub.2, and R.sub.3 is independently linear or branched C1-20 alkyl or two or more of R.sub.1, R.sub.2, and R.sub.3 combine to form cycloalkyl. The resin has a compressive strength of at least 14 ksi at 2% offset at 70 F. and at least 8 ksi at 2% offset at 190 F.
Rapid curing thiol epoxy resin with improved compression strength performance
Aspects described herein generally describe epoxy resins and methods of epoxy resin formation. In some embodiments, a resin includes the reaction product of one or more polythiols, one or more polyepoxides, one or more fillers and one or more amine catalysts. Polythiols have between two and about ten thiol moieties. Polyepoxides have between two and about ten epoxy moieties. One or more amine catalysts of the formula NR.sub.1R.sub.2R.sub.3, wherein each of R.sub.1, R.sub.2, and R.sub.3 is independently linear or branched C1-20 alkyl or two or more of R.sub.1, R.sub.2, and R.sub.3 combine to form cycloalkyl. The resin has a compressive strength of at least 14 ksi at 2% offset at 70 F. and at least 8 ksi at 2% offset at 190 F.