Provided herein are methods of forming solid-state ionically conductive composite materials that include particles of an inorganic phase in a matrix of an organic phase. The methods involve forming the composite materials from a precursor that is polymerized in-situ after being mixed with the particles. The polymerization occurs under applied pressure that causes particle-to-particle contact. In some embodiments, once polymerized, the applied pressure may be removed with the particles immobilized by the polymer matrix. In some implementations, the organic phase includes a cross-linked polymer network. Also provided are solid-state ionically conductive composite materials and batteries and other devices that incorporate them. In some embodiments, solid-state electrolytes including the ionically conductive solid-state composites are provided. In some embodiments, electrodes including the ionically conductive solid-state composites are provided.

The present embodiments generally relate to a technology for improving Cu/Mo grade by the addition of cationic polymers as selective depressants for acid insoluble matters, e.g., silicates and/or clays, in the flotation circuit. Various types of cationic polymers are demonstrated to be effective depressants including polyamine, polyDADMAC, and cationic polyacrylamide. Also disclosed are processes for enriching a desired mineral from an ore comprising the desired mineral and gangue, wherein the process comprises carrying out a flotation process in the presence of one or more cationic polymer depressants.

The present embodiments generally relate to a technology for improving Cu/Mo grade by the addition of cationic polymers as selective depressants for acid insoluble matters, e.g., silicates and/or clays, in the flotation circuit. Various types of cationic polymers are demonstrated to be effective depressants including polyamine, polyDADMAC, and cationic polyacrylamide. Also disclosed are processes for enriching a desired mineral from an ore comprising the desired mineral and gangue, wherein the process comprises carrying out a flotation process in the presence of one or more cationic polymer depressants.

Provided herein are methods of forming solid-state ionically conductive composite materials that include particles of an inorganic phase in a matrix of an organic phase. The methods involve forming the composite materials from a precursor that is polymerized in-situ after being mixed with the particles. The polymerization occurs under applied pressure that causes particle-to-particle contact. In some embodiments, once polymerized, the applied pressure may be removed with the particles immobilized by the polymer matrix. In some implementations, the organic phase includes a cross-linked polymer network. Also provided are solid-state ionically conductive composite materials and batteries and other devices that incorporate them. In some embodiments, solid-state electrolytes including the ionically conductive solid-state composites are provided. In some embodiments, electrodes including the ionically conductive solid-state composites are provided.

The present invention is to provide polyether compounds having epoxy hydroxyl urethane group, as the following formula (I), (II) or (III) shows: ##STR00001##
and waterborne epoxy resin composition. Using the hydroxyl urethane as emulsifier, the obtained waterborne epoxy resin composition of the present invention has better stability and freeze-thaw resistance.

The present invention is to provide polyether compounds having epoxy hydroxyl urethane group, as the following formula (I), (II) or (III) shows: ##STR00001##
and waterborne epoxy resin composition. Using the hydroxyl urethane as emulsifier, the obtained waterborne epoxy resin composition of the present invention has better stability and freeze-thaw resistance.

A one-component epoxy-modified polyurethane and/or urea adhesive includes very high levels of reactive urethane group- and/or urea group-containing tougheners, an epoxy resin and epoxy hardener. These adhesives are formulated to cure at high temperatures and surprisingly provide high elongations, excellent thermal stability and good adhesive properties.

Aspects described herein generally describe epoxy resins and methods of epoxy resin formation. In some embodiments, a resin includes the reaction product of one or more polythiols, one or more polyepoxides, one or more fillers and one or more amine catalysts. Polythiols have between two and about ten thiol moieties. Polyepoxides have between two and about ten epoxy moieties. One or more amine catalysts of the formula NR.sub.1R.sub.2R.sub.3, wherein each of R.sub.1, R.sub.2, and R.sub.3 is independently linear or branched C1-20 alkyl or two or more of R.sub.1, R.sub.2, and R.sub.3 combine to form cycloalkyl. The resin has a compressive strength of at least 14 ksi at 2% offset at 70 F. and at least 8 ksi at 2% offset at 190 F.

Aspects described herein generally describe epoxy resins and methods of epoxy resin formation. In some embodiments, a resin includes the reaction product of one or more polythiols, one or more polyepoxides, one or more fillers and one or more amine catalysts. Polythiols have between two and about ten thiol moieties. Polyepoxides have between two and about ten epoxy moieties. One or more amine catalysts of the formula NR.sub.1R.sub.2R.sub.3, wherein each of R.sub.1, R.sub.2, and R.sub.3 is independently linear or branched C1-20 alkyl or two or more of R.sub.1, R.sub.2, and R.sub.3 combine to form cycloalkyl. The resin has a compressive strength of at least 14 ksi at 2% offset at 70 F. and at least 8 ksi at 2% offset at 190 F.

Aspects described herein generally describe epoxy resins and methods of epoxy resin formation. In some embodiments, a resin includes the reaction product of one or more polythiols, one or more polyepoxides, one or more fillers and one or more amine catalysts. Polythiols have between two and about ten thiol moieties. Polyepoxides have between two and about ten epoxy moieties. One or more amine catalysts of the formula NR.sub.1R.sub.2R.sub.3, wherein each of R.sub.1, R.sub.2, and R.sub.3 is independently linear or branched C1-20 alkyl or two or more of R.sub.1, R.sub.2, and R.sub.3 combine to form cycloalkyl. The resin has a compressive strength of at least 14 ksi at 2% offset at 70 F. and at least 8 ksi at 2% offset at 190 F.