A thermosetting resin composition, wherein a cured product of the thermosetting resin composition that has been cured at 130° C. for 15 minutes has a moisture absorptivity of 2.5% or less after 168 hours at 85° C. and 85% RH, and a ratio of the light transmittance with a wavelength of 700 nm/the light transmittance with a wavelength of 400 nm of 2 or less.

Disclosed is a composition including controlled release particles, wherein each of the controlled release particles includes: (a) a core including at least one hydrophobic active ingredient; and (b) a wall at least partially surrounding the core and including the reaction products of: (i) an organofunctional silane; (ii) an epoxy; (iii) an amine; (iv) an isocyanate; (v) an epoxide curing agent; wherein the controlled release particles are effective to retain the at least one hydrophobic active ingredient upon exposure to water and effective to release the at least one hydrophobic active ingredient in response to friction. A method for preparing the composition is also disclosed.

Disclosed is a composition including controlled release particles, wherein each of the controlled release particles includes: (a) a core including at least one hydrophobic active ingredient; and (b) a wall at least partially surrounding the core and including the reaction products of: (i) an organofunctional silane; (ii) an epoxy; (iii) an amine; (iv) an isocyanate; (v) an epoxide curing agent; wherein the controlled release particles are effective to retain the at least one hydrophobic active ingredient upon exposure to water and effective to release the at least one hydrophobic active ingredient in response to friction. A method for preparing the composition is also disclosed.

Disclosed is a composition including controlled release particles, wherein each of the controlled release particles includes: (a) a core including at least one hydrophobic active ingredient; and (b) a wall at least partially surrounding the core and including the reaction products of: (i) an organofunctional silane; (ii) an epoxy; (iii) an amine; (iv) an isocyanate; (v) an epoxide curing agent; wherein the controlled release particles are effective to retain the at least one hydrophobic active ingredient upon exposure to water and effective to release the at least one hydrophobic active ingredient in response to friction. A method for preparing the composition is also disclosed.

The present specification discloses a latent hardener in which only the surface of the hardener is selectively deactivated under a carbon dioxide or inert gas atmosphere, a one-component epoxy adhesive including the same, and a preparation method thereof.

Provided are a low-temperature heat-curable adhesive composition for structures which is able to cure at a low temperature in a short time, is reduced in groove defects after open-state standing, and is excellent in rust-preventive property, corrosion resistance, shower resistance, and workability; and a method for producing an automotive structure using the adhesive composition. The low-temperature heat-curable adhesive composition for structures includes (A) an epoxy resin, (B) a micro-encapsulated curing agent, (C) a hygroscopic agent, (D) a viscosity modifier, and (E) a stabilizer. The hygroscopic agent (C) is calcium oxide, which suitably includes both a surface-treated grade and a non-surface-treated grade.

A toughened epoxy resin composition includes an end-capped polyalkylene oxide (A), an epoxy resin (B), an epoxy curing agent (C), and a core shell polymer (D). The end-capped polyalkylene oxide (A) has a number average molecular weight of 1500 to 5000, and 40% or more of a total number of ends of the end-capped polyalkylene oxide (A) are capped with at least one selected from the group consisting of an alkyl group, an allyl group, and an aryl group. A weight ratio of the end-capped polyalkylene oxide (A) to the core shell polymer (D) is 10/90 to 90/10. The core shell polymer (D) comprises a core layer in an amount of 70 to 95% by weight and the core layer is one or more selected from the group consisting of diene rubber, (meth)acrylate rubber, organosiloxane rubber, styrene polymer, and (meth)acrylate polymer.

A process of curing a photo-curable material includes dispersing a microcapsule in a material that includes a photo-initiator and a photo-curable material. The process also includes applying a stimulus to the microcapsule to trigger a chemiluminescent reaction within the microcapsule. The chemiluminescent reaction generating a photon having a wavelength within a particular emission range that is consistent with an absorption range of the photo-initiator. The photon exits the microcapsule to trigger the photo-initiator to initiate or catalyze curing of the photo-curable material.

A catalyst-containing particle including a core and an acidic coating layer thereon, wherein the core includes a nitrogen-containing catalyst for a thermoset polymeric system, and the acidic coating layer comprises a binder; and a method of making such particles. A curable, one-part epoxy/thiol resin composition that includes: an epoxy/thiol resin mixture including: an epoxy resin component that includes an epoxy resin having at least two epoxide groups per molecule; a thiol component that includes a polythiol compound having at least two primary thiol groups; and catalyst-containing particles dispersed in the epoxy/thiol resin mixture; wherein each particle includes a core and an acidic coating layer thereon, wherein the core includes a nitrogen-containing catalyst for the epoxy resin; and a method of curing such curable composition.

Self-healing compositions, method of preparation and uses thereof are disclosed. In an example, a self-healing composition includes a first microcapsule and a second microcapsule. The first microcapsule includes a first polydimethylsiloxane resin, a first silicone fluid, a first functionalized alkoxysilane, and a catalyst capable of catalyzing hydrosilylation reactions, and the second microcapsule includes a second polydimethylsiloxane resin, a second silicone fluid, a second functionalized alkoxysilane, and a hydrogen-terminated dimethyl siloxane resin. In this way, the self-healing composition releases and mixes contents of the first microcapsule and the second microcapsule upon the rupture thereof, imparting a passively initiated repair process to the self-healing composition.