Provided is a urea compound-containing epoxy resin curing agent particle that can impart excellent storage stability and heat stability to an epoxy resin composition including a urea compound as a curing agent, while maintaining the solubility of the urea compound during heating and the fluidity after dissolution of the urea compound. The surface of the urea compound-containing epoxy resin curing agent particle is coated with a Group 4 or Group 13 element-containing alkoxide compound, chelate compound, and/or acylate compound.

Provided is a one-pack type adhesive which contains (A) an epoxy resin, (B) a curing agent, (C) a curing accelerator, (D) an inorganic filler and (E) a polycarbodiimide compound, and wherein: the curing agent (B) contains at least one amine-based curing agent; the curing accelerator (C) contains at least one capsule type curing accelerator; the inorganic filler (D) contains at least one flake-like inorganic filler; and the content of the inorganic filler (D) is 10-200 parts by mass relative to 100 parts by mass of the epoxy resin (A).

An aluminum-chelate-based latent curing agent is capable of showing excellent solvent resistance and excellent storage stability at room temperature without impairing low temperature rapid curability of resin composition, when preparing one-pack type thermosetting epoxy resin composition by blending aluminum-chelate-based latent curing agent holding aluminum-chelating agent on porous resin particles obtained by subjecting polyfunctional isocyanate compound to interfacial polymerization into alicyclic epoxy resin showing extremely high cationic polymerizability. Aluminum-chelate-based latent curing agent for curing thermosetting epoxy resin is configured such that aluminum-chelating agent is held on porous resin obtained by subjecting polyfunctional isocyanate compound to interfacial polymerization, and that surface activity inhibition treatment is performed by epoxy-alkoxy-silane coupling agent.

A curable high heat epoxy composition, comprising: 40 to 95 wt % of at least one high heat diepoxy compound of formulas (I) to (X) as provided herein; 1 to 40 wt % of an auxiliary polyepoxide; 0.01 to 12 wt % of a core-shell particle comprising an elastomer core and a rigid shell; and a hardener.

A thermosetting resin composition, wherein a cured product of the thermosetting resin composition that has been cured at 130 C. for 15 minutes has a moisture absorptivity of 2.5% or less after 168 hours at 85 C. and 85% RH, and a ratio of the light transmittance with a wavelength of 700 nm/the light transmittance with a wavelength of 400 nm of 2 or less.

A method of treating a subterranean formation including providing a sugar based hardenable resin, providing proppant particles, providing a hardening agent, combining the sugar based hardenable resin and the hardening agent to form a resin compound, coating the resin compound onto at least a portion of the proppant particles to create resin-coated proppant particles, and placing the coated proppant particles into a subterranean formation zone, wherein the resin compound does not substantially cure prior to placing the resin coated proppant particles into the subterranean formation zone.

A catalyst-containing particle including a core and an acidic coating layer thereon, wherein the core includes a nitrogen-containing catalyst for a thermoset polymeric system, and the acidic coating layer comprises a binder; and a method of making such particles. A curable, one-part epoxy/thiol resin composition that includes: an epoxy/thiol resin mixture including: an epoxy resin component that includes an epoxy resin having at least two epoxide groups per molecule; a thiol component that includes a polythiol compound having at least two primary thiol groups; and catalyst-containing particles dispersed in the epoxy/thiol resin mixture; wherein each particle includes a core and an acidic coating layer thereon, wherein the core includes a nitrogen-containing catalyst for the epoxy resin; and a method of curing such curable composition.

Photo-protected microcapsules containing a photopolymer composition are dispersed in an epoxy coating to form an autonomic self-healing material. The capsule shell wall is formulated to protect the photopolymer composition from electromagnetic radiation exposure prior to rupture of the capsule shell, so that the photopolymer composition (e.g., a UV curable epoxy resin) remains active until triggered by damage to the capsule shell. Carbon black pigment is a suitable UV protector for the capsules. Upon sufficient damage to a region of the coating, the capsules will rupture and the photopolymer composition will fill and cure in and/or around the damaged region in the presence of electromagnetic radiation, achieving autonomic healing of the damaged coating.

The present invention provides a method with which curing can be carried out in a short time without a heat load on an adherend and a cured product having stable quality can be obtained. The resin composition curing method in accordance with the present invention includes the step (a) of directly and/or indirectly irradiating, with laser light, a resin composition (A) which contains (i) an epoxy resin, (ii) an encapsulated curing agent including a core that contains a curing agent and a shell that covers the core, (iii) a filler, and (iv) a color material.

A process of curing a photo-curable material includes dispersing a microcapsule in a material that includes a photo-initiator and a photo-curable material. The process also includes applying a stimulus to the microcapsule to trigger a chemiluminescent reaction within the microcapsule. The chemiluminescent reaction generating a photon having a wavelength within a particular emission range that is consistent with an absorption range of the photo-initiator. The photon exits the microcapsule to trigger the photo-initiator to initiate or catalyze curing of the photo-curable material.