This disclosure relates to reactive epoxy compounds that have high water solubility. The reactive epoxy compounds are obtained by mixing an epoxy resin having at least two epoxy groups per molecule with a carboxyl group-containing compound obtained by reacting a polyetheramine comprising a primary amine and an acid anhydride derived from a polyvalent carboxylic acid. This disclosure also relates to waterborne epoxy resin composition comprising core-shell type epoxy resin particles dispersed in a solvent, wherein the particles are formed by an epoxy resin encapsulated in the reactive epoxy compounds of the present invention. The waterborne epoxy resin composition is low in volatile organic compounds (VOC).

A process of utilizing a light generating microcapsule to cure a photo-curable material includes dispersing a microcapsule in an interface material that includes a photo-initiator and a photo-curable material. The process also includes applying a stimulus to the microcapsule to trigger a chemiluminescent reaction within the microcapsule. The chemiluminescent reaction generating a photon having a wavelength within a particular emission range that is consistent with an absorption range of the photo-initiator. The photon generated within the microcapsule exits the microcapsule into the interface material to trigger the photo-initiator to initiate or catalyze curing of the photo-curable material.

Provided is a thermosetting resin composition (C) of which curing can be started at a relatively low temperature in a short time and a cured product exhibits high heat resistance, the thermosetting resin composition (C) comprising an epoxy resin; an epoxy resin curing agent; and an epoxy resin curing accelerator, wherein the epoxy resin curing agent contains an imidazole-based curing agent 1 which is not encapsulated in a microcapsule and a curing agent 2 which is encapsulated in a microcapsule, and the epoxy resin curing accelerator comprises a urea derivative.

Curable epoxy resin compositions suitable for liquid resin infusion processes. In one embodiment, the resin composition contains (a) at least two polyepoxides, one of which is triglycidyl ether of tris(hydroxyphenyl)methane, (b) an aromatic amine curing agent, and (c) core-shell rubber particles. In another embodiment, the resin composition (a) at least two polyepoxides, one of which is diglycidyl ether of bis(hydroxyphenyl)fluorene, (b) an aromatic amine curing agent, and (c) core-shell rubber particles.

Disclosed is a sealant composition. The sealant composition is composed of an epoxy resin having an active group, -cyanoacrylate, an initiator wrapped with an inert sheathing material, a thermal curing agent, a filler, a coupling agent and an epoxy resin having no active groups. In the invention, a method for initiating sealant curing via a chemical initiator is employed, thus the UV irradiation process may be avoided, the cell alignment process may be simplified, and the cost of UV process and UV Mask, etc., may be saved; additionally, the sealant cure effect is uniform and controllable, and the risk of sealant break and liquid crystal pollution may be avoided.

Methods and compositions, and components comprising the compositions, are disclosed relating to improved resin-based adhesives comprising encapsulating at least a catalyst compound. Further methods and compositions are disclosed relating to encapsulated catalysts in uncured resin-based adhesives, said encapsulated catalysts configured to release the catalyst compound and cure the uncured resin-based adhesive on-demand.

An adhesive composition (composition) comprises an epoxy resin, a binder, and a curing agent. Typically, the composition further comprises an aqueous solvent (e.g. water) such that the composition can be referred to as an aqueous adhesive composition. The epoxy resin is typically encapsulated to prevent premature cure of the composition. After rupture of the encapsulated epoxy resin, the composition cures to form an adhesive. The composition is useful for articles such as fasteners (e.g. nuts and bolts) such that it can be referred to as a fastener adhesive. Typically, the composition is disposed on a threaded surface of the fastener. The fastener can be used for an assembly in which the composition generally cures after installation of the fastener. To make the fastener, the adhesive composition can be applied on the threaded surface. After application, the composition can be dried in instances where the composition still includes the aqueous solvent.

This disclosure relates to reactive epoxy compounds that have high water solubility. The reactive epoxy compounds are obtained by mixing an epoxy resin having at least two epoxy groups per molecule with a carboxyl group-containing compound obtained by reacting a polyetheramine comprising a primary amine and an acid anhydride derived from a polyvalent carboxylic acid. This disclosure also relates to waterborne epoxy resin composition comprising core-shell type epoxy resin particles dispersed in a solvent, wherein the particles are formed by an epoxy resin encapsulated in the reactive epoxy compounds of the present invention. The waterborne epoxy resin composition is low in volatile organic compounds (VOC).

A toughened epoxy resin composition includes an end-capped polyalkylene oxide (A), an epoxy resin (B), an epoxy curing agent (C), and a core shell polymer (D). The end-capped polyalkylene oxide (A) has a number average molecular weight of 1500 to 5000, and 40% or more of a total number of ends of the end-capped polyalkylene oxide (A) are capped with at least one selected from the group consisting of an alkyl group, an allyl group, and an aryl group. A weight ratio of the end-capped polyalkylene oxide (A) to the core shell polymer (D) is 10/90 to 90/10. The core shell polymer (D) comprises a core layer in an amount of 70 to 95% by weight and the core layer is one or more selected from the group consisting of diene rubber, (meth)acrylate rubber, organosiloxane rubber, styrene polymer, and (meth)acrylate polymer.

An aluminum-chelate-based latent curing agent is capable of showing excellent solvent resistance and excellent storage stability at room temperature without impairing low temperature rapid curability of resin composition, when preparing one-pack type thermosetting epoxy resin composition by blending aluminum-chelate-based latent curing agent holding aluminum-chelating agent on porous resin particles obtained by subjecting polyfunctional isocyanate compound to interfacial polymerization into alicyclic epoxy resin showing extremely high cationic polymerizability. Aluminum-chelate-based latent curing agent for curing thermosetting epoxy resin is configured such that aluminum-chelating agent is held on porous resin obtained by subjecting polyfunctional isocyanate compound to interfacial polymerization, and that surface activity inhibition treatment is performed by epoxy-alkoxy-silane coupling agent.