A thermal latent curing agent including one or more polyoxazoline based polymers and one or more curing agents is provided. The curing agents are: (i) physically entrapped in a matrix of the polyoxazoline based polymer, and/or (ii) covalently bonded to the polyoxazoline based polymer irreversibly as a side and/or terminal group, and/or (iii) covalently bonded to the polyoxazoline based polymer reversibly. Methods for preparation of the thermal latent curing agents are provided. One component mixtures that include a thermoset matrix resin and one or more of such thermal latent curing agents and different uses of the mixtures are also provided.

A process of utilizing a light generating microcapsule to cure a photo-curable material includes dispersing a microcapsule in an interface material that includes a photo-initiator and a photo-curable material. The process also includes applying a stimulus to the microcapsule to trigger a chemiluminescent reaction within the microcapsule. The chemiluminescent reaction generating a photon having a wavelength within a particular emission range that is consistent with an absorption range of the photo-initiator. The photon generated within the microcapsule exits the microcapsule into the interface material to trigger the photo-initiator to initiate or catalyze curing of the photo-curable material.

The present invention provides a resin composition which can be cured in a short time without a heat load on an adherend and with which a cured product having stable quality can be obtained. The resin composition in accordance with the present invention contains (i) a bisphenol A epoxy resin, (ii) an encapsulated curing agent including a core that contains a curing agent and a shell that covers the core, (iii) a filler, and (iv) a color material.

An aluminum chelate-based latent curing agent for curing a thermosetting epoxy resin, in which an aluminum chelate-based curing agent is held in a porous resin obtained by, at the same time, subjecting a polyfunctional isocyanate compound to interfacial polymerization and subjecting a radical polymerizable compound to radical polymerization in the presence of a radical polymerization initiator, and the surface of the aluminum chelate-based latent curing agent has been subjected to inactivation treatment with an alkoxysilane coupling agent. An alkylalkoxysilane is preferred as the alkoxysilane coupling agent. The radical polymerizable compound preferably contains a polyfunctional radical polymerizable compound.

A method of treating a subterranean formation including providing a sugar based hardenable resin, providing proppant particles, providing a hardening agent, combining the sugar based hardenable resin and the hardening agent to form a resin compound, coating the resin compound onto at least a portion of the proppant particles to create resin-coated proppant particles, and placing the coated proppant particles into a subterranean formation zone, wherein the resin compound does not substantially cure prior to placing the resin coated proppant particles into the subterranean formation zone.

The present invention disclosed a process for the preparation of microcapsules containing epoxy resin which comprises water-insoluble and/or water-soluble components prepared by in-situ polymerization using non-aqueous continuous phase which acts as healing agents for the micro-cracks when embedded in composite structures.

A microcapsule type curable resin composition produces substantially no gases when applied to an adherend, e.g., to a threaded member, which is then tightened, moreover, due to exceptional coating properties to an adherend, does not give rise to coating irregularities. The microcapsule type curable resin composition contains (A) microcapsules encapsulating a curable compound (a), (B) a substance able to bring about curing of component (a), and (C) a binder able to adhere the microcapsules to an adherend, wherein the microcapsule type curable resin composition includes, per total 100 mass parts, (D) 1-25 mass parts of mica having average particle diameter of 10-150 m, and (E) 1-25 mass parts of an inorganic filler having average particle diameter of 3-50 m, the mass ratio of component (D) and component (E) being 0.2-2.0 of component (E) with respect to 1.0 of component (D).

Epoxy compositions include a cucurbituril in complex with a curative, and methods for curing the epoxy composition. The curative is reactive with an epoxy compound, and the curative may be a cure accelerator or a cure hardener. Cured resins are obtained or obtainable from the epoxy compositions. Complexes of a cucurbituril have a curative.

Methods and compositions, and components comprising the compositions, are disclosed relating to improved resin-based adhesives comprising encapsulating at least a catalyst compound. Further methods and compositions are disclosed relating to encapsulated catalysts in uncured resin-based adhesives, said encapsulated catalysts configured to release the catalyst compound and cure the uncured resin-based adhesive on-demand

Methods and compositions, and components comprising the compositions, are disclosed relating to improved resin-based adhesives comprising encapsulating at least a catalyst compound. Further methods and compositions are disclosed relating to encapsulated catalysts in uncured resin-based adhesives, said encapsulated catalysts configured to release the catalyst compound and cure the uncured resin-based adhesive on-demand.