An epoxy resin composition for fiber reinforced composite materials comprising components (A) to (E): component (A), an epoxy resin; component (B), a dicyandiamide or a derivative thereof; component (C), a polyisocyanate compound; component (D), a urea compound as represented by formula (1): ##STR00001##
(wherein R.sup.1 and R.sup.2 are each independently H, CH.sub.3, OCH.sub.3, OC.sub.2H.sub.5, NO.sub.2, halogen, or NH—CO NR.sup.3R.sup.4; and R.sup.3 and R.sup.4 are each independently a hydrocarbon group, allyl group, alkoxy group, alkenyl group, aralkyl group, or an alicyclic compound containing both R.sup.3 and R.sup.4, all containing 1 to 8 carbon atoms); and component (E), at least one compound selected from the group consisting of quaternary ammonium salts, phosphonium salts, imidazole compounds, and phosphine compounds.

An epoxy resin includes a reaction product between an epoxy compound and a compound having a naphthalene structure and a functional group that is reactive with an epoxy group.

The present invention relates to curable compositions comprising (a) N-arylated benzoxazines, and (b) a prepolymer produced from a diisocyanate having two isocyanate groups with different reactivity. The compositions are particularly suitable in the production of adhesives and sealants, prepregs and towpreg.

Compositions and methods are described which provide a protective coating to coils or springs via a polymerization process such as by covalent bonding that includes grafting to the metal surface.

An electrocoat system for electrodeposition is described. The system includes an inorganic bismuth-containing compound or a mixture of inorganic and organic bismuth-containing compounds. The system demonstrates a high degree of crosslinking and produces a cured coating with optimal crosslinking and corrosion resistance.

Epoxy adhesives are made using core-shell rubbers and small amounts if any of other elastomeric materials. The epoxy adhesives contain a mixture of latent curing agents and/or high levels of calcium oxide. The adhesives exhibit excellent bonding properties even when an open or closed bead is exposed to humid air for prolonged periods before the epoxy adhesive is cured.

Methods in which toughness improvers based on terminally blocked polyurethane prepolymers are used to increase the maximum linear expansion of single component heat-curing epoxy resin compositions, in particular for joining substrates having different thermal expansion coefficients, in particular in the framework of transport agents or white goods.

An adhesive for an endoscope, the adhesive including (A) an epoxy resin including at least one epoxy resin of a bisphenol A epoxy resin, a bisphenol F epoxy resin, or a phenol novolac epoxy resin, (B) a curing component including at least one of a phosphorus-containing compound, a polythiol compound, a dicyandiamide compound, a phenol compound, or a polyether-polyamine compound, and (C) an inorganic amphoteric ion exchanger; and a cured product of the adhesive. An endoscope including the cured product fixed, and a method for producing the endoscope.

A flux resin composition includes an epoxy resin, an imidazole compound, a thixo agent, and an activator. The epoxy resin includes at least one resin selected from the group consisting of naphthalene epoxy resins, biphenyl aralkyl epoxy resins, trisphenol methane epoxy resins, biphenyl epoxy resins, and dicyclopentadiene epoxy resins. The content of the at least one resin is equal to or greater than 20% by weight with respect to a total weight of the epoxy resin.

Disclosed herein is a self-healing material comprising microcapsules comprising a monomeric or oligomeric healing agent, and a catalyst that is able to catalyse the polymerisation of the monomeric or oligomeric healing agent.