The present disclosure relates to an epoxy resin of which distribution of molecular weight having distribution range of molecular weight of 300 to 2,000,000 is adjusted such that an upper limit value is increased to a maximum of 2,000,000, a method of preparing the same, a composition comprising the same, and a use thereof. The epoxy resin having controlled distribution of molecular weight of the present disclosure may have improved thermal properties of an epoxy system by expanding the distribution of molecular weight, and may exhibit excellent processability.

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The present invention relates to a resin composition, comprising (a) an epoxy resin; (b) a curing agent comprising the structure of formula C1; (c) an inorganic filler; wherein R.sup.C1 is (a) a siloxane group of formula C1a or (b) or both a siloxane group of formula C1a and an ester group of formula C1b; R.sup.C2 is selected from a bulky C.sub.4 to C.sub.12 alkyl group comprising at least one tertiary or quaternary carbon atom; R.sup.C11, R.sup.C12, R.sup.C13 are independently selected from methyl, ethyl and 1-propyl; R.sup.C14 is selected from a linear or branched C.sub.1 to C.sub.8 alkyl; X.sup.C1 is selected from a divalent C.sub.1 to C.sub.4 alkanediyl group; and n is an average number of repeating units and is from 1.05 to 200.

The epoxy resin composition for a prepreg according to an embodiment of the present invention contains (A) an epoxy resin, (B) a curing agent or a curing accelerator, (C) silica microparticles, and (D) core-shell rubber particles, the epoxy resin composition containing from 1 to 5 parts by mass of (C) the silica microparticles and from 2 to 10 parts by mass of (D) the core-shell rubber particles per 100 parts by mass of (A) the epoxy resin, and a mass ratio of (C) the silica microparticles to (D) the core-shell rubber particles, in terms of (C)/(D), being from 1/1 to 1/5.

The present invention relates to compositions (self-thermally) curable on demand under the triggering action of UV-visible to near-infrared irradiation of moderate intensity, method of using same for accelerated photopolyaddition of cyclic ether-anhydride resins or dark curing of cyclic ether-anhydride resins, and articles obtained by such method. The invention also relates to a resin casting, film or coated substrate, and an adhesive layer or bonding agent, comprising a cyclic ether-anhydride resin obtained by an accelerated curing process according to the invention. The invention additionally relates to the use of a composition of the invention for increasing the delamination strength of laminated composite materials.

An epoxy resin composition suitable for molding a fiber-reinforced plastic molded article is provided. The molded article has exceptional mechanical properties. In particular, a tubular molded article has high breaking strength. The epoxy resin composition contains components (A), (C), and (D), where component (A) is an epoxy resin of a particular formula, component (C) is an epoxy resin other than component (A) that is liquid at 25° C., and component (D) is a curing agent.

A method for producing a semiconductor element by wafer-level chip-size packaging includes applying a liquid compression molding material to a wafer after completion of circuit formation and subjecting the wafer to sealing treatment by compression molding. The liquid compression molding material includes (A) an epoxy resin; (B) a curing agent; and (C) a filler. The liquid compression molding material having a thixotropic index (TI) of 0.8 to 4.0.

A copolymer is formed by reacting a composition I, which includes (a) a first epoxy compound having a chemical structure of

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wherein R.sup.1 is single bond, —O—,

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(b) a second epoxy compound that is different from (a) the first epoxy compound, and (c) a curing agent. The copolymer can be mixed with inorganic powder to form a composite material.

The present invention provides a resin composition containing an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a bonding agent containing the resin composition. Further, the present invention provides a cured product containing resin particles and a matrix resin, wherein the resin particles are a cured product of an epoxy compound A having a specific structure having an aromatic ring, and having an epoxy equivalent in the range of from 500 to 10,000 g/eq, and the matrix resin is a cured product of an epoxy compound B having an epoxy equivalent in the range of from 100 to 300 g/eq, and a laminate having a substrate and the cured product.

The present application provides a rapid curing epoxy resin composition for fiber-reinforced plastic materials that can be used with modern fast-cure heating systems without loss of heat resistance, surface quality, or mechanical properties of the cured epoxy matrix composite as well as prepregs and fiber-reinforced plastic materials based thereon as their matrix resins. The epoxy resin composition includes an epoxy resin, a dicyandiamide, an aromatic urea, and a clathrate complex comprising at least one compound selected from the group consisting of carboxylic acid compounds and tetrakisphenol compounds and at least one epoxy accelerator which is an imidazole and/or imidazoline.

A manufacturing method of a highly flameproof laminated composite material is provided in the present disclosure. The manufacturing method of the highly flameproof laminated composite material includes the steps as follows. A raw material is provided, a shaping step is performed and a combining step is performed. The raw material includes an inorganic powder and a polymer material. In the shaping step, the raw material is made into at least one inorganic layer, an inorganic sheet, a ply of film, or a layer of coating. In the combining step, the inorganic layer is made to be connected to a surface of a substrate, so as to obtain the highly flameproof laminated composite material. A weight ratio of the inorganic powder and the polymer material is 0.01-0.1, and a thickness of the inorganic layer is 0.1 mm-8.0 mm.