A manufacturing method of a highly flameproof laminated composite material is provided in the present disclosure. The manufacturing method of the highly flameproof laminated composite material includes the steps as follows. A raw material is provided, a shaping step is performed and a combining step is performed. The raw material includes an inorganic powder and a polymer material. In the shaping step, the raw material is made into at least one inorganic layer, an inorganic sheet, a ply of film, or a layer of coating. In the combining step, the inorganic layer is made to be connected to a surface of a substrate, so as to obtain the highly flameproof laminated composite material. A weight ratio of the inorganic powder and the polymer material is 0.01-0.1, and a thickness of the inorganic layer is 0.1 mm-8.0 mm.

The present invention provides low polyphenols (such as bisphenol A) tougheners for epoxy adhesives. The tougheners, and adhesives comprising the tougheners exhibit enhanced viscosity stability, e.g., compared to tougheners prepared from higher amounts of bisphenol A (and epoxy adhesives comprising them).

An epoxy resin composition for a fiber-reinforced composite material includes: (a) one or more epoxy resins; (b) an aromatic diamine compound; (c) a dicyandiamide; (d) a urea compound; and (e) an amine adduct compound, blended in specific ranges.

The present invention relates to a curing agent for moisture-curing compositions which includes at least one aqueous emulsion of at least one epoxy resin. Curing agents according to the invention are especially used for the accelerated curing of moisture-curing compositions which are based on polyurethane polymers that have isocyanate groups or of silane-functional polymers.

Disclosed is an environment-friendly and flame-retardant abradable seal coating material with an ultra-low density and a use method thereof. The seal coating material includes a component A and a component B packaged separately; the component A includes 20-30 wt % of a curing agent for bisphenol A epoxy resin, 20-30 wt % of a liquid phosphorus-containing curing agent, 20-40 wt % of a hollow glass microbead, 1-5 wt % of 2,4,6-tris(dimethylaminomethyl)phenol, 5-15 wt % of dimethyl methylphosphonate and 0.5-3 wt % of a silane coupling agent; the component B includes 30-40 wt % of a bisphenol A epoxy resin, 30-40 wt % of a liquid phosphorus-containing epoxy resin, 20-30 wt % of a hollow glass microbead, 0-10 wt % of a liquid acrylonitrile-butadiene rubber and 0.5-3 wt % of a silane coupling agent. The method includes: mixing the component A and the component B to obtain a coating, and applying the obtained coating to a surface of a part for curing.

This invention relates to a composition comprising a semisolid epoxy resin containing a curative dispersed therein. The curative has a particle size such that at least 90% of the particles have a size below 25 pm at ambient temperature of 21° C., wherein the composition further comprises a diluent containing a particulate filler. The composition is used as matrix in prepregs. The use of the diluent increases peel strength of the composition when brought into contact with metal or wood substrate.

A method for instillation molding UV epoxy resin includes: the UV epoxy resin preparation step: adding at least two photosensitizers to a single component epoxy resin and uniformly mixing them to obtain the UV epoxy resin, wherein the photosensitizer with the highest content in the UV epoxy resin is a photosensitive curing agent for curing the UV epoxy resin, and the rest photosensitizers are photosensitive viscosity regulating agents for regulating the viscosity of the UV epoxy resin to be suitable for instillation molding; and instillation step: dividing the instillation molding of the UV epoxy resin into N procedures performed in one work station, wherein zero, one or more photosensitive viscosity regulating agents are initiated in each procedure, so that the UV epoxy resin reaches a viscosity suitable for respective instillation procedure and is subsequently instillation molded; curing step: initiating the photosensitive curing agent to finally cure the UV epoxy resin.

A method for instillation molding UV epoxy resin includes: the UV epoxy resin preparation step: adding at least two photosensitizers to a single component epoxy resin and uniformly mixing them to obtain the UV epoxy resin, wherein the photosensitizer with the highest content in the UV epoxy resin is a photosensitive curing agent for curing the UV epoxy resin, and the rest photosensitizers are photosensitive viscosity regulating agents for regulating the viscosity of the UV epoxy resin to be suitable for instillation molding; and instillation step: dividing the instillation molding of the UV epoxy resin into N procedures performed in one work station, wherein zero, one or more photosensitive viscosity regulating agents are initiated in each procedure, so that the UV epoxy resin reaches a viscosity suitable for respective instillation procedure and is subsequently instillation molded; curing step: initiating the photosensitive curing agent to finally cure the UV epoxy resin.

An adhesive composition comprising an epoxy compound and a compound comprising at least one aminimide functional group is disclosed. The compound comprising the at least one aminimide functional group is present in an amount from 2-8% by weight based on total weight of the adhesive composition and reacts with the epoxy compound upon activation by an external energy source. The adhesive composition also may comprise an amidine salt.

Disclosed are one-component epoxy resin adhesive compositions which include (a) one or more non-rubber-modified epoxy resins; (b) one or more latent epoxy curing agents; (c) one or more toughening agents; and (d) zinc oxide nanoparticles. The one-component epoxy resin adhesive compositions exhibit improved toughness of the adhesive as measured by its lap shear strength as well as improved environmental stability, i.e., corrosion protection, by addition of the zinc oxide nanoparticles when applied to metal substrates.