Patent classifications
C08G69/26
POLYAMIDE RESIN, POLYAMIDE RESIN COMPOSITION, AND MOLDED ARTICLE
Provided are a polyamide resin having high crystallinity, a high glass transition temperature, and a low mass loss rate, and a polyamide resin composition and a molded article in which the polyamide resin is used. The polyamide resin includes a diamine-derived structural unit and a dicarboxylic acid-derived structural unit, in which 50 mol % or more of the diamine-derived structural units are structural unit derived from p-benzenediethanamine, and of the dicarboxylic acid-derived structural units, from not less than 20 mol % to less than 95 mol % are structural units derived from an aromatic dicarboxylic acid and from more than 5 mol % to not more than 80 mol % are structural units derived from an α,ω-linear aliphatic dicarboxylic acid having from 4 to 15 carbons.
Process for producing a polyamide powder by precipitation
The present invention relates to a process for producing a polyamide powder (PP) comprising at least one semicrystalline polyamide (P) and at least one additive (A). The semicrystalline polyamide (P) and the at least one additive (A) are initially compounded with one another in an extruder and subsequently introduced into a solvent (SV) in which the at least one semicrystalline polyamide (P) then crystallizes to obtain the polyamide powder (PP). The present invention further relates to the thus obtainable polyamide powder (PP) and to the use of the polyamide powder (PP) as sintering powder (SP) and also to a process for producing a shaped body by selective laser sintering of a polyamide powder (PP).
ANTISTATIC AGENT, ANTISTATIC RESIN COMPOSITION, AND MOLDED PRODUCT
An object of the present invention is to provide an antistatic agent which imparts excellent antistatic properties to thermoplastic resins. The antistatic agent of the present invention contains a block polymer (A) having a block of a polyamide (a) and a block of a hydrophilic polymer (b) as structure units; and an amide-forming monomer (c), wherein a weight ratio of the amide-forming monomer (c) to the block polymer (A), i.e., amide-forming monomer (c)/block polymer (A), is 2/98 to 12/88.
Filament compositions for fused filament fabrication and methods of use thereof
The disclosure generally relates to filaments and in particular, filaments for use in fused filament fabrication to prepare 3D printed articles. The filaments may be prepared from a polymer composition comprising: A) 55 to 95 weight percent semi-aromatic copolyamide having a melting point; and B) 5 to 45 weight percent amorphous copolyamide having a melting point.
Flame-retardant polyamide compositions with a high glow wire ignition temperature and use thereof
A flame-retardant polyamide composition can be prepared with a glow wire ignition temperature of not less than 775° C. Such a composition can include a polyamide having a melting point of not more than 290° C. as component A, fillers and/or reinforcers as component B, a phosphinic salt of the formula (I) as component C, a compound selected from the group of the Al, Fe, TiO.sub.p and Zn salts of ethylbutylphosphinic acid, of dibutylphosphinic acid, of ethylhexylphosphinic acid, of butylhexylphosphinic acid and/or of dihexylphosphinic acid as component D, a phosphonic salt of the formula (II) as component E, and a melamine polyphosphate having an average degree of condensation of 2 to 200 as component F. Additional components can be included in the composition.
Flame-retardant polyamide compositions with a high glow wire ignition temperature and use thereof
A flame-retardant polyamide composition can be prepared with a glow wire ignition temperature of not less than 775° C. Such a composition can include a polyamide having a melting point of not more than 290° C. as component A, fillers and/or reinforcers as component B, a phosphinic salt of the formula (I) as component C, a compound selected from the group of the Al, Fe, TiO.sub.p and Zn salts of ethylbutylphosphinic acid, of dibutylphosphinic acid, of ethylhexylphosphinic acid, of butylhexylphosphinic acid and/or of dihexylphosphinic acid as component D, a phosphonic salt of the formula (II) as component E, and a melamine polyphosphate having an average degree of condensation of 2 to 200 as component F. Additional components can be included in the composition.
POLYAMIDE COMPOSITION WHICH IS DYED IN BLACK, PRODUCTION AND USE THEREOF
Disclosed herein is a black-colored polyamide composition which includes a polycondensate of formaldehyde, n-phenyl-benzene amine and 2-propanone and carbon black, and preferably also glass fibers, production of this polyamide composition and use thereof for the production of black-colored laser-inscribable polyamide moldings.
POLYAMIDE COMPOSITION WHICH IS DYED IN BLACK, PRODUCTION AND USE THEREOF
Disclosed herein is a black-colored polyamide composition which includes a polycondensate of formaldehyde, n-phenyl-benzene amine and 2-propanone and carbon black, and preferably also glass fibers, production of this polyamide composition and use thereof for the production of black-colored laser-inscribable polyamide moldings.
REINFORCED RESIN COMPOSITION, MOLDED PRODUCT, AND METHOD OF IMPROVING TENSILE STRENGTH AT ELEVATED TEMPERATURES
The present disclosure is directed to provide a reinforced resin composition excellent in mechanical strength at elevated temperatures and a molded product including such a reinforced resin composition. A reinforced resin composition of the present disclosure includes (A) a polyamide; (B) a polyamide; (C) a polyphenylene ether; and (D) an inorganic filler, wherein a mass ratio of the component (C) with respect to 100 parts by mass of a sum of the component (A), the component (B), and the component (C) is from 20 to 50 parts by mass, ΔH.sub.TcMt is 10 J/g or more, and ΔH.sub.MpMt is 35 J/g or less.
REINFORCED RESIN COMPOSITION, MOLDED PRODUCT, AND METHOD OF IMPROVING TENSILE STRENGTH AT ELEVATED TEMPERATURES
The present disclosure is directed to provide a reinforced resin composition excellent in mechanical strength at elevated temperatures and a molded product including such a reinforced resin composition. A reinforced resin composition of the present disclosure includes (A) a polyamide; (B) a polyamide; (C) a polyphenylene ether; and (D) an inorganic filler, wherein a mass ratio of the component (C) with respect to 100 parts by mass of a sum of the component (A), the component (B), and the component (C) is from 20 to 50 parts by mass, ΔH.sub.TcMt is 10 J/g or more, and ΔH.sub.MpMt is 35 J/g or less.