A composition for manufacturing a semiconductor device includes at least one carbon-based compound that includes at least one of an alkyne group and an azide group, and a solvent. A method of manufacturing a semiconductor device includes forming a feature layer on a substrate, coating the feature layer with a composition including alkyne and azide, forming a carbon-containing layer including a triazole compound by performing a heat treatment on the coated composition, forming a photoresist film on the carbon-containing layer, forming photoresist patterns by exposing and developing the photoresist film, and patterning the carbon-containing layer and the feature layer using the photoresist patterns.

The invention relates to medicine, namely, to the solutions used for hemostasis. The hemostatic agent, which represents a polyammonia methanediamine chloride of the general formula ##STR00001##
where: n=1-20, m=1-10, at that nm8. The hemostatic agent may be applied in the form of a 0.01-10% aqueous solution. An aqueous solution of the preparation can be used for impregnation of materials used for bleeding arrest, suture material, bandaging material. The hemostatic agent may be used in the composition of a retraction cord, adhesive pastes, vaginal and rectal suppositories, creams, gels, as well as used with microchips that provide slow release of the preparation. The preparation can also be used in eye drops, eye ointments, and lubricants applied to the surface of the catheter. The drug can be used in endodontic treatment, may be injected into a polymer sealer for root canal obturation, as well as locallyby means of electrophoresis. The hemostatic agent may be used in conjunction with a gel based on aluminum sulphate or silver solution, and also with a polysaccharide haemostatic system. An efficient haemostatic preparation ensuring a significant analgetic effect is developed.

The present invention relates to a cross-linkable composition comprising: i) a fluorinated ,-bis(propargyl) oligomer of formula (I): in which m is 1 to 100, e.g. 1 to 93, n is 2 to 150, e.g. 1 to 128, p is 0 to 2 preferably 0 or 1.75, and, n, m and p are selected such that the fluorinated ,-bis(propargyl) oligomer of formula (I) has a number average molar mass Mn of 400 to 25000; ii) a cross-linking agent comprising at least three azide-N.sub.3 groups; and iii) optionally, a fluorinated oligomer comprising two terminal azide-N3 or fluorinated ,-bis(azide) oligomer groups. The invention also relates to a material comprising the click chemistry reaction product of the cross-linkable composition of the invention, to a method for preparing said material and to the uses thereof.

The present invention relates to a cross-linkable composition comprising: i) a fluorinated ,-bis(propargyl) oligomer of formula (I): in which m is 1 to 100, e.g. 1 to 93, n is 2 to 150, e.g. 1 to 128, p is 0 to 2 preferably 0 or 1.75, and, n, m and p are selected such that the fluorinated ,-bis(propargyl) oligomer of formula (I) has a number average molar mass Mn of 400 to 25000; ii) a cross-linking agent comprising at least three azide-N.sub.3 groups; and iii) optionally, a fluorinated oligomer comprising two terminal azide-N3 or fluorinated ,-bis(azide) oligomer groups. The invention also relates to a material comprising the click chemistry reaction product of the cross-linkable composition of the invention, to a method for preparing said material and to the uses thereof.

A photosensitive composition is provided. The photosensitive composition includes a composition for forming polyimide, a photoinitiator, a photo cross-linking agent, and a thermal cross-linking agent. The composition for forming polyimide includes a diamine monomer component, an anhydride monomer component, and a polyimide modifier. The diamine monomer component includes a long-chain aliphatic diamine monomer, a carboxylic acid-containing diamine monomer, and a triazole compound. The anhydride monomer component includes a dianhydride monomer and a monoanhydride monomer. The polyimide modifier has a double bond and an epoxy group.

A perfluoropolyether-based rubber composition which gives cured objects excellent in terms of heat resistance, low-temperature resistance, organic-solvent resistance, and acid resistance, the rubber composition being characterized by comprising (a) a linear perfluoropolyether compound having a number-average molecular weight of 1,000-100,000 and including at least two azido groups in the molecule and a divalent perfluoroalkyl ether structure in the main chain and (b) a linear perfluoropolyether compound having at least three ethynyl groups in the molecule.

A perfluoropolyether-based rubber composition which gives cured objects excellent in terms of heat resistance, low-temperature resistance, organic-solvent resistance, and acid resistance, the rubber composition being characterized by comprising (a) a linear perfluoropolyether compound having a number-average molecular weight of 1,000-100,000 and including at least two azido groups in the molecule and a divalent perfluoroalkyl ether structure in the main chain and (b) a linear perfluoropolyether compound having at least three ethynyl groups in the molecule.

An antibacterial polymer material includes a polymer body and plural antibacterial structures mixed with the polymer body and bonded with the polymer body, and the antibacterial structures have a content of 0.2%-8%. The antibacterial polymer material may be manufactured to form an antibacterial plastic product and an antibacterial fiber, and the antibacterial structures are mixed with the polymer body and bonded with the polymer body, so that the antibacterial ingredient is distributed more uniformly in the product or masterbatch to prevent the antibacterial ingredient from being just distributed on the surface or the antibacterial effect from being lessened or vanished due to a damage of the surface by an external force. Since the antibacterial ingredient is mixed with the masterbatch or product, the possibility of the antibacterial ingredient exuding a corroded or damaged surface is reduced to improve the effect of environmental protection.

Provided herein are compositions, CO.sub.2-permeable/selective membranes and related methods of making and using the membranes. Ionically cross-linked poly(ether)-based membranes were prepared for applications relating to CO.sub.2. These films were studied for their thermal curing behavior using DSC. The resulting free-standing membranes have T.sub.gs near 64 C., T.sub.dS up to 230 C., and Young's modulus up to 4.2 MPa. These membranes showed CO.sub.2 permeabilities of 84-110 Barrer and CO.sub.2/N.sub.2 selectivity of 20-40.

Provided herein are compositions, CO.sub.2-permeable/selective membranes and related methods of making and using the membranes. Ionically cross-linked poly(ether)-based membranes were prepared for applications relating to CO.sub.2. These films were studied for their thermal curing behavior using DSC. The resulting free-standing membranes have T.sub.gs near 64 C., T.sub.dS up to 230 C., and Young's modulus up to 4.2 MPa. These membranes showed CO.sub.2 permeabilities of 84-110 Barrer and CO.sub.2/N.sub.2 selectivity of 20-40.